IXFV16N80P Equivalent & Substitute Parts

Part Overview

The IXFV16N80P is an N-Channel MOSFET manufactured by IXYS, rated for 800V drain-to-source voltage with 16A continuous drain current at 25°C. This device is packaged in a PLUS220 (TO-220-3 Short Tab) through-hole configuration and is part of the HiPerFET™ Polar series. The IXFV16N80P is classified as obsolete, making identification of equivalent and substitute parts necessary for ongoing design support and component procurement.

Substiute Parts

IXFV16N80P
IXYSIn Stock: 937IXFV16N80P Datasheet
IXFV16N80P
Current Part
APT17F80B
Microchip TechnologyIn Stock: 864APT17F80B Datasheet
APT17F80B
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R8010ANX
Rohm SemiconductorIn Stock: 2653R8010ANX Datasheet
R8010ANX
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SPP11N80C3XKSA1
Infineon TechnologiesIn Stock: 7731SPP11N80C3XKSA1 Datasheet
SPP11N80C3XKSA1
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STP13N80K5
STMicroelectronicsIn Stock: 4435STP13N80K5 Datasheet
STP13N80K5
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Key Parameters

Parameter Value Unit
Drain-to-Source Voltage (Vdss) 800 V
Continuous Drain Current (Id) @ 25°C 16 A
Drive Voltage (Max Rds On) 10 V
Rds On (Max) @ Id, Vgs 600 mOhm @ 500 mA, 10V mOhm
Gate Threshold Voltage (Vgs(th)) @ Id 5 V @ 4 mA
Gate Charge (Qg) @ Vgs 71 nC @ 10V
Maximum Gate Voltage (Vgs) ±30 V
Input Capacitance (Ciss) @ Vds 4600 pF @ 25V
Power Dissipation (Max) 460 W
Operating Temperature Range -55 to 150 °C
Mounting Type Through Hole
Package Type TO-220-3, Short Tab
RoHS Status ROHS3 Compliant

Substitute Part Grouping Explanation

Substitution of the IXFV16N80P is determined by strict alignment of electrical and mechanical parameters. The following criteria establish valid substitute relationships:

Primary Substitution Criteria:

  • Drain-to-Source Voltage (Vdss): Must equal 800V
  • FET Type: Must be N-Channel MOSFET
  • Technology: Must be Metal Oxide Semiconductor
  • Mounting Type: Must be Through Hole
  • Operating Temperature Range: Must support -55°C to 150°C minimum
  • Gate Voltage (Vgs Max): Must support ±30V or greater
  • RoHS Compliance: Must maintain ROHS3 Compliant status

Secondary Compatibility Parameters:

  • Continuous Drain Current (Id): Substitute parts rated at or above 16A are electrically compatible
  • Rds On (Max): Lower or equal values indicate improved performance
  • Gate Charge (Qg): Lower values reduce drive circuit requirements
  • Power Dissipation: Higher ratings provide thermal margin
  • Package Configuration: TO-220-3 variants are mechanically compatible

All substitute parts listed meet the primary substitution criteria. Variations in secondary parameters reflect design trade-offs and performance enhancements available from alternative manufacturers.

Parameter Comparison

Parameter IXFV16N80P APT17F80B R8010ANX SPP11N80C3XKSA1 STP13N80K5
Manufacturer IXYS Microchip Technology Rohm Semiconductor Infineon Technologies STMicroelectronics
Vdss (V) 800 800 800 800 800
Id @ 25°C (A) 16 18 10 11 12
Drive Voltage (V) 10 10 10 10 10
Rds On (Max) @ 10V (mOhm) 600 @ 500mA 580 @ 9A 560 @ 5A 450 @ 7.1A 450 @ 6A
Vgs(th) (V) 5 @ 4mA 5 @ 1mA 5 @ 1mA 3.9 @ 680µA 5 @ 100µA
Gate Charge Qg (nC) 71 @ 10V 122 @ 10V 62 @ 10V 85 @ 10V 29 @ 10V
Vgs Max (V) ±30 ±30 ±30 ±20 ±30
Ciss (pF) 4600 @ 25V 3757 @ 25V 1750 @ 25V 1600 @ 100V 870 @ 100V
Power Dissipation (W) 460 500 40 156 190
Operating Temperature (°C) -55 to 150 -55 to 150 -55 to 150 -55 to 150 -55 to 150
Package Type TO-220-3, Short Tab TO-247-3 TO-220-3 Full Pack TO-220-3 TO-220-3
Product Status Obsolete Active Active Active Active
RoHS Status ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant

Engineering Selection Recommendations

APT17F80B (Microchip Technology)

The APT17F80B is an active product offering 18A continuous drain current, exceeding the IXFV16N80P specification by 2A. This part provides improved thermal performance with 500W maximum power dissipation. The APT17F80B is packaged in TO-247-3, which differs mechanically from the PLUS220 package but maintains through-hole mounting compatibility. Gate charge is elevated at 122 nC, requiring verification of drive circuit capability. This substitute is suitable for applications where increased current capacity and thermal margin are beneficial and package transition is feasible.

R8010ANX (Rohm Semiconductor)

The R8010ANX is an active product rated for 10A continuous drain current, below the IXFV16N80P specification. Power dissipation is limited to 40W, significantly lower than the original part. This substitute is applicable only in applications where the 16A current requirement can be reduced or where multiple devices are paralleled. The R8010ANX offers the lowest input capacitance at 1750 pF, reducing gate drive requirements. This part is suitable for lower-power variants of existing designs.

SPP11N80C3XKSA1 (Infineon Technologies)

The SPP11N80C3XKSA1 is an active product from the CoolMOS™ series, rated for 11A continuous drain current. This part provides superior on-resistance performance at 450 mOhm, reducing conduction losses compared to the IXFV16N80P. Gate charge is 85 nC, and input capacitance is 1600 pF, both favorable for drive circuit efficiency. The maximum gate voltage is ±20V, which is lower than the original ±30V specification. This substitute is recommended for applications prioritizing efficiency and where gate voltage tolerance can be accommodated.

STP13N80K5 (STMicroelectronics)

The STP13N80K5 is an active product from the SuperMESH5™ series, rated for 12A continuous drain current. This part delivers the lowest gate charge at 29 nC and the lowest input capacitance at 870 pF, providing significant advantages in switching speed and drive circuit simplification. On-resistance is 450 mOhm, matching the SPP11N80C3XKSA1. Power dissipation is 190W, providing adequate thermal performance for moderate-power applications. This substitute is recommended as the primary alternative for new designs requiring improved switching characteristics and reduced drive complexity.

All substitute parts maintain ROHS3 compliance and support the full -55°C to 150°C operating temperature range of the original device.

Frequently Asked Questions (FAQ)

Q: Can the APT17F80B replace the IXFV16N80P in existing PCB layouts?

A: The APT17F80B uses TO-247-3 packaging, which differs from the PLUS220 (TO-220-3 Short Tab) package of the IXFV16N80P. While both are through-hole devices, pin spacing and mechanical dimensions are not identical. PCB layout modification is required. Electrical compatibility is confirmed for all rated parameters.

Q: Why does the R8010ANX have lower power dissipation than the IXFV16N80P?

A: The R8010ANX is rated for 10A continuous drain current, compared to 16A for the IXFV16N80P. Power dissipation is a function of current rating and thermal design. The R8010ANX is suitable only for applications where current requirements do not exceed 10A or where multiple devices are used in parallel configurations.

Q: What is the significance of gate charge differences among substitute parts?

A: Gate charge (Qg) determines the energy required to switch the MOSFET on and off. Lower gate charge reduces drive circuit power consumption and enables faster switching. The STP13N80K5 at 29 nC requires significantly less drive energy than the IXFV16N80P at 71 nC. Drive circuit capability must be verified for each substitute.

Q: Are all substitute parts suitable for direct replacement without circuit modification?

A: Electrical substitution is confirmed for all parts listed, provided that continuous drain current requirements do not exceed the substitute part rating. However, package differences (TO-247 vs. TO-220) require PCB layout evaluation. Gate charge and input capacitance variations may require drive circuit verification. Thermal design must account for power dissipation differences.

Q: Which substitute part offers the best overall performance improvement?

A: The STP13N80K5 provides the most significant performance enhancements, with the lowest gate charge (29 nC) and input capacitance (870 pF), reducing switching losses and drive circuit complexity. The SPP11N80C3XKSA1 offers comparable on-resistance performance with slightly higher gate charge. Selection depends on application priorities: efficiency, thermal margin, or drive simplicity.

Q: Is the ±20V maximum gate voltage of the SPP11N80C3XKSA1 compatible with ±30V drive circuits?

A: The SPP11N80C3XKSA1 is rated for ±20V maximum gate voltage. Application of ±30V gate voltage exceeds the device specification and may cause gate oxide degradation. Drive circuits must be verified to operate within ±20V limits when using this substitute.

Q: What is the impact of lower input capacitance on circuit design?

A: Lower input capacitance (Ciss) reduces the charge required to drive the gate and decreases switching time. Substitute parts with lower Ciss values (R8010ANX at 1750 pF, SPP11N80C3XKSA1 at 1600 pF, STP13N80K5 at 870 pF) enable faster switching and reduced EMI compared to the IXFV16N80P at 4600 pF. Drive circuit current requirements are correspondingly reduced.

Q: Are all substitute parts available in the same packaging options?

A: No. The IXFV16N80P is available in PLUS220 (TO-220-3 Short Tab). Substitute parts are available in TO-247-3 (APT17F80B), TO-220-3 Full Pack (R8010ANX), and standard TO-220-3 (SPP11N80C3XKSA1, STP13N80K5). Package selection affects PCB layout and thermal management design.

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