IXFP8N50PM N-Channel MOSFET Equivalent & Substitute Parts

Part Overview

The IXFP8N50PM is an N-Channel MOSFET manufactured by IXYS, rated for 500V drain-to-source voltage with 4.4A continuous drain current at 25°C. This device is part of the HiPerFET™ and PolarHT™ series and is housed in a TO-220-3 through-hole package. The part is currently classified as obsolete, necessitating identification of functionally equivalent alternatives for ongoing design support and production requirements.

Substiute Parts

IXFP8N50PM
IXYSIn Stock: 720IXFP8N50PM Datasheet
IXFP8N50PM
Current Part
IXFP12N65X2M
IXYSIn Stock: 1490IXFP12N65X2M Datasheet
IXFP12N65X2M
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AOT9N50
Alpha & Omega Semiconductor Inc.In Stock: 3863AOT9N50 Datasheet
AOT9N50
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IRFI3205PBF
Infineon TechnologiesIn Stock: 2715IRFI3205PBF Datasheet
IRFI3205PBF
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Key Parameters

Parameter Value Unit
FET Type N-Channel
Drain to Source Voltage (Vdss) 500 V
Continuous Drain Current (Id) @ 25°C 4.4 A
Rds On (Max) @ Id, Vgs 800 mOhm @ 4A, 10V
Gate Threshold Voltage (Vgs(th)) @ Id 5.5 V @ 1mA
Power Dissipation (Max) 42 W
Operating Temperature Range -55 to 150 °C
Package Type TO-220-3 Through Hole
Technology MOSFET (Metal Oxide)

Substitute Part Grouping Explanation

Substitution of the IXFP8N50PM is determined by the following critical parameters:

Voltage Rating Compatibility: The drain-to-source voltage (Vdss) must equal or exceed 500V to maintain circuit protection and reliability margins.

Current Handling Capacity: The continuous drain current (Id) must meet or exceed 4.4A at 25°C to support the intended load without thermal stress.

On-State Resistance (Rds On): The maximum on-state resistance must be compatible with the original specification to ensure similar power dissipation and thermal characteristics.

Gate Drive Voltage: The gate drive voltage (Vgs) must be compatible with existing control circuitry, typically 10V for this device class.

Package and Mounting: The TO-220-3 through-hole package is the standard form factor for this application class and must be maintained for mechanical and thermal compatibility.

Operating Temperature Range: The device must support the -55°C to 150°C operating range to ensure functionality across the intended application environment.

Substitute parts are grouped based on these parameters. Parts meeting all critical criteria are classified as direct substitutes. Parts with enhanced ratings (higher voltage, current, or power dissipation) are classified as upgrades suitable for applications requiring improved performance margins.

Parameter Comparison

Parameter IXFP8N50PM IXFP12N65X2M AOT9N50 IRFI3205PBF
Manufacturer IXYS IXYS Alpha & Omega Semiconductor Inc. Infineon Technologies
FET Type N-Channel N-Channel N-Channel N-Channel
Vdss (V) 500 650 500 55
Id @ 25°C (A) 4.4 12 9 64
Rds On (Max) @ Vgs 10V (mOhm) 800 @ 4A 310 @ 6A 850 @ 4.5A 8 @ 34A
Vgs(th) (Max) (V) 5.5 @ 1mA 5 @ 250µA 4.5 @ 250µA 4 @ 250µA
Gate Charge (Qg) @ 10V (nC) 20 18.5 28 170
Power Dissipation (Max) (W) 42 40 192 63
Operating Temperature Range (°C) -55 to 150 -55 to 150 -55 to 150 -55 to 175
Package TO-220-3 TO-220 Isolated Tab TO-220-3 TO-220AB Full-Pak
Product Status Obsolete Active Not For New Designs Active
RoHS Status Not specified ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant

Engineering Selection Recommendations

IXFP12N65X2M (IXYS): This part is recommended as the primary substitute for the IXFP8N50PM. It maintains the same manufacturer lineage and operating temperature range. The device provides enhanced voltage rating (650V vs. 500V) and significantly higher current capacity (12A vs. 4.4A), offering improved performance margins for existing designs. The part is actively manufactured and ROHS3 compliant. The TO-220 Isolated Tab package is mechanically compatible with standard TO-220-3 footprints in most applications. Lower on-state resistance (310mOhm vs. 800mOhm) reduces power dissipation and thermal stress.

AOT9N50 (Alpha & Omega Semiconductor Inc.): This part matches the original 500V voltage rating and provides doubled current capacity (9A vs. 4.4A). The device maintains the same operating temperature range and TO-220-3 package form factor. However, the product status is classified as "Not For New Designs," limiting its suitability for long-term production applications. The on-state resistance (850mOhm) is comparable to the original specification. ROHS3 compliance is confirmed.

IRFI3205PBF (Infineon Technologies): This part is not recommended as a direct substitute due to fundamental voltage rating incompatibility. The 55V Vdss rating is insufficient for applications requiring 500V operation. This device is suitable only for low-voltage applications and represents a different product category. The part is actively manufactured and ROHS3 compliant but cannot replace the IXFP8N50PM in its intended voltage class.

Frequently Asked Questions (FAQ)

Q: Can the IXFP12N65X2M directly replace the IXFP8N50PM in existing designs?

A: The IXFP12N65X2M is electrically compatible with the IXFP8N50PM for applications operating at or below 500V. The higher voltage rating (650V) and current capacity (12A) provide additional performance margin. The TO-220 Isolated Tab package is mechanically compatible with standard TO-220-3 footprints. Verification of thermal management and gate drive circuitry compatibility is required for specific applications.

Q: Why is the IRFI3205PBF listed as a substitute if it has a 55V rating?

A: The IRFI3205PBF is not a suitable substitute for the IXFP8N50PM. It is included in this reference for completeness based on the provided input data, but its 55V voltage rating makes it unsuitable for 500V applications. This device operates in a different voltage class and cannot be used interchangeably.

Q: What is the significance of the "Isolated Tab" designation on the IXFP12N65X2M?

A: The Isolated Tab feature on the IXFP12N65X2M provides electrical isolation between the tab and the drain connection, reducing parasitic capacitance and improving high-frequency performance. This feature is beneficial in many applications but requires verification that the PCB layout and thermal management design accommodate the isolated tab configuration.

Q: Is the AOT9N50 suitable for new production designs?

A: The AOT9N50 is classified as "Not For New Designs" by the manufacturer. While the part is currently in stock and functionally compatible with the IXFP8N50PM, it is not recommended for new design implementations. The IXFP12N65X2M is the preferred choice for new production due to its active status and long-term availability assurance.

Q: How do the on-state resistance values affect circuit performance?

A: The on-state resistance (Rds On) directly determines power dissipation during conduction. The IXFP8N50PM specifies 800mOhm at 4A and 10V gate drive. The IXFP12N65X2M provides 310mOhm at 6A and 10V, resulting in lower power dissipation and reduced thermal stress. The AOT9N50 specifies 850mOhm at 4.5A, comparable to the original. Lower Rds On values improve efficiency and reduce cooling requirements.

Q: Are all substitute parts ROHS3 compliant?

A: The IXFP12N65X2M and AOT9N50 are confirmed ROHS3 compliant. The IRFI3205PBF is also ROHS3 compliant. The original IXFP8N50PM does not specify RoHS status in the provided data. Compliance verification with specific regulatory requirements for your application is recommended.

Q: What is the impact of gate charge differences on circuit design?

A: Gate charge (Qg) affects the speed and energy required to switch the MOSFET. The IXFP8N50PM specifies 20nC at 10V, while the IXFP12N65X2M specifies 18.5nC, and the AOT9N50 specifies 28nC. Higher gate charge requires more drive current and increases switching losses. The IXFP12N65X2M offers slightly faster switching characteristics, while the AOT9N50 requires marginally more drive energy.

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