IXFN48N55 Equivalent & Substitute Parts

Part Overview

The IXFN48N55 is an N-Channel MOSFET rated for 550V drain-to-source voltage with 48A continuous drain current in a SOT-227B chassis mount package. Manufactured by IXYS under the HiPerFET™ series, this device is classified as obsolete. Due to its obsolete status, equivalent substitute parts from active manufacturers are necessary to maintain design continuity and ensure long-term component availability for new production and field replacements.

Substiute Parts

IXFN48N55
IXYSIn Stock: 1136IXFN48N55 Datasheet
IXFN48N55
Current Part
APT38F50J
Microchip TechnologyIn Stock: 743APT38F50J Datasheet
APT38F50J
Similar
STE48NM50
STMicroelectronicsIn Stock: 1678STE48NM50 Datasheet
STE48NM50
Similar

Key Parameters

Parameter Value Unit
FET Type N-Channel
Drain to Source Voltage (Vdss) 550 V
Continuous Drain Current (Id) @ 25°C 48 A (Tc)
Drive Voltage (Max Rds On) 10 V
Rds On (Max) @ Id, Vgs 110 mOhm @ 500mA, 10V
Power Dissipation (Max) 600 W (Tc)
Operating Temperature Range -55 to 150 °C (TJ)
Mounting Type Chassis Mount
Package / Case SOT-227-4, miniBLOC

Substitute Part Grouping Explanation

Substitution of the IXFN48N55 is determined by the following critical electrical and mechanical parameters:

Primary Substitution Criteria:

  • FET Type: N-Channel topology
  • Drain to Source Voltage (Vdss): Minimum 550V
  • Continuous Drain Current (Id): Minimum 48A at 25°C
  • Drive Voltage: 10V gate drive compatibility
  • Mounting Type: Chassis Mount configuration
  • Operating Temperature Range: -55°C to 150°C minimum

Secondary Compatibility Factors:

  • On-state resistance (Rds On) at specified gate voltage
  • Gate charge characteristics
  • Input capacitance
  • Power dissipation capability
  • Package mechanical compatibility

The substitute parts listed below meet or exceed the primary electrical specifications of the IXFN48N55 while maintaining chassis mount mechanical compatibility. Both substitute parts are from active manufacturers with current production status and full RoHS3 compliance.

Parameter Comparison

Parameter IXFN48N55 APT38F50J STE48NM50 Unit
Manufacturer IXYS Microchip Technology STMicroelectronics
Product Status Obsolete Active Active
FET Type N-Channel N-Channel N-Channel
Vdss 550 500 550 V
Id @ 25°C 48 38 48 A (Tc)
Drive Voltage 10 10 10 V
Rds On (Max) @ 10V Vgs 110 @ 500mA 100 @ 28A 100 @ 24A mOhm
Vgs(th) (Max) 4.5 @ 8mA 5 @ 2.5mA 5 @ 250µA V @ Id
Gate Charge (Qg) @ 10V 330 220 117 nC
Input Capacitance (Ciss) @ 25V 8900 8800 3700 pF
Power Dissipation (Max) 600 355 450 W (Tc)
Operating Temperature -55 to 150 -55 to 150 -55 to 150 °C (TJ)
Mounting Type Chassis Mount Chassis Mount Chassis Mount
Package SOT-227-4, miniBLOC ISOTOP® ISOTOP
RoHS Status Not specified ROHS3 Compliant ROHS3 Compliant
REACH Status REACH Unaffected REACH Unaffected REACH Unaffected

Engineering Selection Recommendations

STE48NM50 (STMicroelectronics) – Primary Substitute

The STE48NM50 is the preferred direct substitute for the IXFN48N55. This device matches the critical electrical specifications: 550V Vdss rating, 48A continuous drain current, and 10V gate drive compatibility. The STE48NM50 is manufactured by STMicroelectronics under the MDmesh™ series with active product status and full ROHS3 compliance. The device exhibits lower gate charge (117 nC versus 330 nC) and reduced input capacitance (3700 pF versus 8900 pF), resulting in improved switching performance. Power dissipation is rated at 450W, which is lower than the original 600W specification but remains adequate for most applications within the original design envelope. The ISOTOP® package provides mechanical compatibility with chassis mount requirements.

APT38F50J (Microchip Technology) – Secondary Substitute

The APT38F50J is a secondary substitute option when the STE48NM50 is unavailable. This device is manufactured by Microchip Technology under the POWER MOS 8™ series with active product status and ROHS3 compliance. The APT38F50J operates at 500V Vdss, which is 50V below the original specification, and provides 38A continuous drain current, which is 10A below the original rating. These reduced ratings require design verification to confirm compatibility with the original application. The device exhibits superior on-state resistance (100 mOhm versus 110 mOhm) and lower gate charge (220 nC). Power dissipation is limited to 355W. The ISOTOP® package maintains chassis mount compatibility. This substitute is suitable only for applications where the lower voltage and current ratings do not compromise circuit performance.

Both substitute parts carry REACH Unaffected status and EAR99 ECCN classification, matching the regulatory profile of the original component.

Frequently Asked Questions (FAQ)

Q: Can the STE48NM50 be used as a direct replacement for the IXFN48N55 without circuit modification?

A: The STE48NM50 meets all primary electrical specifications (550V Vdss, 48A Id, 10V gate drive) and maintains chassis mount mechanical compatibility. However, the reduced power dissipation rating (450W versus 600W) and lower gate charge (117 nC versus 330 nC) require thermal and switching performance verification in the specific application circuit. Physical package dimensions must be confirmed for mechanical fit.

Q: Is the APT38F50J suitable for all applications using the IXFN48N55?

A: The APT38F50J has reduced electrical ratings: 500V Vdss (versus 550V) and 38A Id (versus 48A). This device is suitable only for applications where these lower ratings do not exceed the circuit's operating conditions. Applications requiring the full 550V/48A specification must use the STE48NM50 or equivalent.

Q: What are the package differences between the IXFN48N55 and the substitute parts?

A: The IXFN48N55 uses SOT-227-4 miniBLOC packaging. Both substitute parts use ISOTOP® packaging. While both are chassis mount configurations, physical dimensions and mounting hole patterns may differ. Mechanical verification is required before PCB layout finalization.

Q: Are the substitute parts RoHS compliant?

A: Both the STE48NM50 and APT38F50J are ROHS3 compliant. The original IXFN48N55 RoHS status is not specified in the available documentation. Both substitutes meet current environmental compliance requirements for new production.

Q: How do the gate charge characteristics affect circuit performance?

A: The STE48NM50 exhibits significantly lower gate charge (117 nC versus 330 nC), resulting in faster switching transitions and reduced gate drive power requirements. The APT38F50J provides intermediate gate charge (220 nC). Lower gate charge improves switching efficiency but may require gate drive circuit adjustment to prevent overshoot or ringing in sensitive applications.

Q: What is the impact of reduced input capacitance in the STE48NM50?

A: The STE48NM50 has substantially lower input capacitance (3700 pF versus 8900 pF). This reduces capacitive loading on the gate drive circuit, enabling faster switching and lower gate drive losses. Applications with marginal gate drive capability may benefit from this characteristic.

Q: Can these parts be used interchangeably in existing designs?

A: The STE48NM50 is the closest electrical equivalent and may be used as a direct substitute with thermal and switching performance verification. The APT38F50J requires design review due to reduced voltage and current ratings. Physical package compatibility must be confirmed for both substitutes before implementation.

Request Quote (Ships tomorrow)