IXFH14N60P Equivalent & Substitute Parts

Part Overview

The IXFH14N60P is an N-Channel MOSFET manufactured by IXYS, rated for 600V drain-to-source voltage with 14A continuous drain current at 25°C. This device is part of the HiPerFET™ series and is housed in a TO-247AD through-hole package. The component is currently in active production status with 1007 units in stock.

Finding equivalent and substitute parts becomes necessary when the IXFH14N60P reaches end-of-life, when supply constraints occur, or when design requirements necessitate alternative electrical or thermal characteristics. Substitute parts must maintain compatibility with existing circuit designs while meeting or exceeding the original specifications within acceptable tolerances.

Substiute Parts

IXFH14N60P
IXYSIn Stock: 1090IXFH14N60P Datasheet
IXFH14N60P
Current Part
SPW11N80C3FKSA1
Infineon TechnologiesIn Stock: 3410SPW11N80C3FKSA1 Datasheet
SPW11N80C3FKSA1
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Key Parameters

Parameter Value Unit
Drain to Source Voltage (Vdss) 600 V
Continuous Drain Current (Id) @ 25°C 14 A (Tc)
Rds On (Max) @ 7A, 10V 550 mOhm
Gate Charge (Qg) @ 10V 36 nC
Power Dissipation (Max) 300 W (Tc)
Operating Temperature Range -55 to 150 °C (TJ)
Package Type TO-247-3 Through Hole
Vgs (Max) ±30 V
Input Capacitance (Ciss) @ 25V 2500 pF

Substitute Part Grouping Explanation

Substitution of the IXFH14N60P is determined by the following critical parameters:

Voltage Rating Compatibility: The substitute part must have a Vdss rating equal to or greater than 600V to ensure safe operation in the original circuit topology.

Current Rating Compatibility: The substitute part must support a continuous drain current (Id) equal to or greater than 14A at 25°C to handle the design load without thermal stress.

On-State Resistance (Rds On): The substitute part's Rds On should be comparable to or lower than 550mOhm to maintain similar power dissipation characteristics and thermal performance.

Package Compatibility: The substitute part must use the TO-247-3 through-hole package to ensure mechanical and thermal interface compatibility with existing PCB layouts and heatsink mounting.

Gate Charge (Qg): Lower gate charge values reduce switching losses and improve circuit efficiency; however, the substitute part's Qg should remain within reasonable bounds to avoid significant circuit redesign.

Temperature Range: The substitute part must support the full operating temperature range of -55°C to 150°C (TJ) to maintain reliability across all environmental conditions.

Compliance Requirements: The substitute part must maintain RoHS3 compliance and REACH unaffected status to satisfy regulatory and supply chain requirements.

Parameter Comparison

Parameter IXFH14N60P (Main) SPW11N80C3FKSA1 (Substitute) Unit
Manufacturer IXYS Infineon Technologies
FET Type N-Channel N-Channel
Drain to Source Voltage (Vdss) 600 800 V
Continuous Drain Current (Id) @ 25°C 14 11 A (Tc)
Rds On (Max) @ 10V 550 @ 7A 450 @ 7.1A mOhm
Gate Charge (Qg) @ 10V 36 85 nC
Vgs (Max) ±30 ±20 V
Input Capacitance (Ciss) 2500 @ 25V 1600 @ 100V pF
Power Dissipation (Max) 300 156 W (Tc)
Operating Temperature Range -55 to 150 -55 to 150 °C (TJ)
Package Type TO-247-3 TO-247-3
Product Status Active Not For New Designs
RoHS Status ROHS3 Compliant ROHS3 Compliant

Engineering Selection Recommendations

Primary Consideration - Product Status: The IXFH14N60P maintains active production status, making it the preferred choice for new designs. The SPW11N80C3FKSA1 carries a "Not For New Designs" designation, indicating that Infineon has discontinued active development and support for this part. This status should restrict its use to legacy system maintenance or replacement scenarios only.

Voltage Rating Trade-off: The SPW11N80C3FKSA1 provides an 800V Vdss rating compared to the IXFH14N60P's 600V rating. While this higher voltage rating offers additional design margin, it does not provide functional equivalence for circuits designed specifically for 600V operation. The higher voltage rating may introduce unnecessary cost and complexity.

Current Rating Limitation: The SPW11N80C3FKSA1 is rated for 11A continuous drain current, which is 3A lower than the IXFH14N60P's 14A rating. This reduction in current capacity makes the SPW11N80C3FKSA1 unsuitable as a direct substitute in applications requiring the full 14A current specification.

Power Dissipation Constraint: The SPW11N80C3FKSA1 has a maximum power dissipation of 156W compared to the IXFH14N60P's 300W. This significant reduction in thermal capacity limits its applicability in high-power switching applications and may require additional thermal management modifications.

Gate Charge Increase: The SPW11N80C3FKSA1 exhibits a gate charge of 85nC versus the IXFH14N60P's 36nC. This 136% increase in gate charge will increase switching losses and may require gate driver circuit modifications to maintain switching frequency performance.

Compliance Alignment: Both parts maintain RoHS3 compliance and REACH unaffected status, satisfying regulatory requirements for equivalent substitution in compliant applications.

Frequently Asked Questions (FAQ)

Q: Can the SPW11N80C3FKSA1 directly replace the IXFH14N60P in existing designs?

A: No. While both devices share the TO-247-3 package and N-Channel MOSFET topology, the SPW11N80C3FKSA1 has a lower continuous drain current rating (11A versus 14A) and significantly reduced power dissipation capability (156W versus 300W). Direct substitution would result in thermal and current capacity violations. Additionally, the SPW11N80C3FKSA1 carries a "Not For New Designs" status, restricting its use to legacy applications only.

Q: What are the key electrical differences between these parts?

A: The primary differences are: (1) Vdss rating is 200V higher on the substitute (800V versus 600V); (2) continuous drain current is 3A lower on the substitute (11A versus 14A); (3) gate charge is 49nC higher on the substitute (85nC versus 36nC); (4) power dissipation is 144W lower on the substitute (156W versus 300W); (5) maximum gate voltage is 10V lower on the substitute (±20V versus ±30V).

Q: Are the packages mechanically compatible?

A: Yes. Both the IXFH14N60P and SPW11N80C3FKSA1 use the TO-247-3 through-hole package, ensuring mechanical compatibility with existing PCB layouts and heatsink mounting interfaces. However, mechanical compatibility does not ensure electrical equivalence.

Q: What is the significance of the "Not For New Designs" status on the SPW11N80C3FKSA1?

A: This designation indicates that Infineon has discontinued active development, qualification, and long-term supply commitment for the SPW11N80C3FKSA1. New designs should not incorporate this part. It is restricted to replacement and maintenance of existing legacy systems where the part is already in use.

Q: How does the increased gate charge affect circuit performance?

A: The SPW11N80C3FKSA1's gate charge of 85nC is 2.36 times higher than the IXFH14N60P's 36nC. Higher gate charge increases the time and energy required to switch the transistor on and off, resulting in higher switching losses, reduced switching frequency capability, and increased heat generation. Gate driver circuits may require modification to accommodate this higher charge requirement.

Q: Can the higher voltage rating of the SPW11N80C3FKSA1 be used as an advantage?

A: The 800V Vdss rating provides additional voltage margin but does not constitute an advantage for circuits designed for 600V operation. Using a higher-rated device in a lower-voltage application introduces unnecessary cost and complexity without functional benefit. The design should be evaluated based on the original 600V specification.

Q: What compliance certifications are maintained across both parts?

A: Both the IXFH14N60P and SPW11N80C3FKSA1 maintain RoHS3 compliance and REACH unaffected status. Both parts are classified under ECCN EAR99 and HTSUS 8541.29.0095. Moisture sensitivity level is 1 (Unlimited) for both devices, indicating no special moisture handling requirements.

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