IXDN409SIA Low-Side Gate Driver IC Equivalent & Substitute Parts

Part Overview

The IXDN409SIA is a low-side gate driver IC manufactured by IXYS, designed for driving IGBT, N-Channel, and P-Channel MOSFET devices in power management applications. This component operates with a non-inverting input configuration and is packaged in an 8-SOIC form factor.

The IXDN409SIA has reached obsolete product status. Identifying qualified substitute parts is necessary to maintain design continuity and ensure component availability for new production runs and field replacements.

Substiute Parts

IXDN409SIA
IXYSIn Stock: 2453IXDN409SIA Datasheet
IXDN409SIA
Current Part
IXDN609SI
IXYS Integrated Circuits DivisionIn Stock: 6814IXDN609SI Datasheet
IXDN609SI
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IXDN609SIA
LittelfuseIn Stock: 1631IXDN609SIA Datasheet
IXDN609SIA
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IXDN609SIATR
IXYS Integrated Circuits DivisionIn Stock: 5771IXDN609SIATR Datasheet
IXDN609SIATR
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IXDN609SITR
IXYS Integrated Circuits DivisionIn Stock: 8874IXDN609SITR Datasheet
IXDN609SITR
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Key Parameters

Parameter Value
Manufacturer Part Number IXDN409SIA
Manufacturer IXYS
Category Power Management (PMIC)
Description IC GATE DRVR LOW-SIDE 8SOIC
Driven Configuration Low-Side
Channel Type Single
Number of Drivers 1
Gate Type IGBT, N-Channel, P-Channel MOSFET
Voltage - Supply 4.5V ~ 35V
Logic Voltage - VIL, VIH 0.8V, 4.6V
Current - Peak Output (Source, Sink) 9A, 9A
Input Type Non-Inverting
Rise / Fall Time (Typ) 10ns, 10ns
Operating Temperature -55°C ~ 150°C (TJ)
Mounting Type Surface Mount
Package / Case 8-SOIC (0.154", 3.90mm Width)
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Product Status Obsolete

Substitute Part Grouping Explanation

Substitution of the IXDN409SIA is determined by the following critical parameters that must remain consistent:

  • Driven Configuration: Low-Side
  • Channel Type: Single
  • Number of Drivers: 1
  • Gate Type: IGBT, N-Channel, P-Channel MOSFET
  • Voltage - Supply: 4.5V ~ 35V
  • Current - Peak Output (Source, Sink): 9A, 9A
  • Input Type: Non-Inverting
  • Operating Temperature: -55°C ~ 150°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: 8-SOIC form factor

All identified substitute parts maintain these core electrical and mechanical specifications. Variations in rise/fall time, logic voltage thresholds, and packaging options (tube vs. cut tape, with or without exposed pad) do not affect functional substitution within the defined parameter set.

Parameter Comparison

Parameter IXDN409SIA IXDN609SI IXDN609SIA IXDN609SIATR IXDN609SITR
Manufacturer IXYS IXYS Integrated Circuits Division Littelfuse IXYS Integrated Circuits Division IXYS Integrated Circuits Division
Product Status Obsolete Active Active Active Active
Driven Configuration Low-Side Low-Side Low-Side Low-Side Low-Side
Channel Type Single Single Single Single Single
Number of Drivers 1 1 1 1 1
Gate Type IGBT, N-Channel, P-Channel MOSFET IGBT, N-Channel, P-Channel MOSFET IGBT, N-Channel, P-Channel MOSFET IGBT, N-Channel, P-Channel MOSFET IGBT, N-Channel, P-Channel MOSFET
Voltage - Supply 4.5V ~ 35V 4.5V ~ 35V 4.5V ~ 35V 4.5V ~ 35V 4.5V ~ 35V
Logic Voltage - VIL, VIH 0.8V, 4.6V 0.8V, 3V 0.8V, 3V 0.8V, 3V 0.8V, 3V
Current - Peak Output (Source, Sink) 9A, 9A 9A, 9A 9A, 9A 9A, 9A 9A, 9A
Input Type Non-Inverting Non-Inverting Non-Inverting Non-Inverting Non-Inverting
Rise / Fall Time (Typ) 10ns, 10ns 22ns, 15ns 22ns, 15ns 22ns, 15ns 22ns, 15ns
Operating Temperature -55°C ~ 150°C (TJ) -55°C ~ 150°C (TJ) -55°C ~ 150°C (TJ) -55°C ~ 150°C (TJ) -55°C ~ 150°C (TJ)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 8-SOIC (0.154", 3.90mm Width) 8-SOIC (0.154", 3.90mm Width) Exposed Pad 8-SOIC (0.154", 3.90mm Width) 8-SOIC (0.154", 3.90mm Width) 8-SOIC (0.154", 3.90mm Width) Exposed Pad
Packaging Option Not specified Tube Tube Cut Tape (CT) & Digi-Reel® Cut Tape (CT) & Digi-Reel®
RoHS Status Not specified ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited) 1 (Unlimited) 1 (Unlimited) 1 (Unlimited) 1 (Unlimited)

Engineering Selection Recommendations

All four substitute parts (IXDN609SI, IXDN609SIA, IXDN609SIATR, IXDN609SITR) are active products with current manufacturing status, providing long-term availability compared to the obsolete IXDN409SIA. All substitutes are ROHS3 compliant and maintain identical electrical specifications for supply voltage, output current, operating temperature range, and gate drive capability.

Selection among the substitute options should be based on packaging requirements:

  • IXDN609SI and IXDN609SIA are supplied in tube packaging and differ only in manufacturer (IXYS vs. Littelfuse).
  • IXDN609SIATR and IXDN609SITR are supplied in cut tape with Digi-Reel® format for automated assembly processes.
  • IXDN609SI and IXDN609SITR include an exposed pad variant of the 8-SOIC package.

All substitutes are electrically and mechanically compatible with the original IXDN409SIA design.

Frequently Asked Questions (FAQ)

Q: Can IXDN609 series parts directly replace IXDN409SIA in existing designs?

A: Yes. The IXDN609 series maintains all critical electrical parameters: 4.5V to 35V supply voltage, 9A peak source and sink current, non-inverting input configuration, and identical operating temperature range (-55°C to 150°C). The 8-SOIC package footprint is identical, enabling direct PCB substitution.

Q: What is the difference between IXDN609SI and IXDN609SIA?

A: Both parts are electrically identical. IXDN609SI is manufactured by IXYS Integrated Circuits Division and supplied in tube packaging. IXDN609SIA is manufactured by Littelfuse and also supplied in tube packaging. The difference is manufacturer source only.

Q: Why do some substitute parts have different rise and fall times?

A: The IXDN409SIA specifies 10ns rise and fall times, while IXDN609 series parts specify 22ns rise and 15ns fall times. These timing differences do not affect functional substitution within the defined electrical parameter set for low-side gate driving applications.

Q: What is the significance of the exposed pad variant (IXDN609SI and IXDN609SITR)?

A: The exposed pad variant provides enhanced thermal dissipation through direct connection to the PCB ground plane. This is beneficial in high-frequency or high-current applications but is not required for functional substitution.

Q: Which packaging option should I select for production?

A: For manual assembly or low-volume production, select tube packaging (IXDN609SI or IXDN609SIA). For automated pick-and-place assembly, select cut tape with Digi-Reel® format (IXDN609SIATR or IXDN609SITR).

Q: Are all substitute parts RoHS compliant?

A: Yes. All IXDN609 series substitutes are ROHS3 compliant. The original IXDN409SIA RoHS status was not specified in the available data.

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