IXDI504SIAT/R Low-Side Gate Driver IC Equivalent & Substitute Parts

Part Overview

The IXDI504SIAT/R is a low-side gate driver IC manufactured by IXYS, designed for driving IGBT and MOSFET devices in power management applications. This inverting gate driver operates across a 4.5V to 30V supply range with dual independent channels in an 8-SOIC package. The part is currently obsolete, making equivalent substitutes necessary for new designs and production continuity. Substitute parts must maintain functional compatibility in low-side gate driving configurations while meeting the electrical and thermal requirements of the target application.

Substiute Parts

IXDI504SIAT/R
IXYSIn Stock: 1003IXDI504SIAT/R Datasheet
IXDI504SIAT/R
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IR4426SPBF
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IR4426STRPBF
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IXDI602SI
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IXDI602SIA
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IXDI602SIATR
IXYS Integrated Circuits DivisionIn Stock: 2133IXDI602SIATR Datasheet
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IXDI602SITR
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UCC27323D
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UCC27323DR
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UCC37323DR
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Key Parameters

Parameter IXDI504SIAT/R
Manufacturer IXYS
Category Power Management (PMIC)
Description IC GATE DRVR LOW-SIDE 8SOIC
Driven Configuration Low-Side
Number of Drivers 2
Gate Type IGBT, N-Channel, P-Channel MOSFET
Voltage - Supply 4.5V ~ 30V
Logic Voltage - VIL, VIH 0.8V, 3V
Current - Peak Output (Source, Sink) 4A, 4A
Input Type Inverting
Rise / Fall Time (Typ) 9ns, 8ns
Operating Temperature -55°C ~ 150°C (TJ)
Package / Case 8-SOIC (0.154", 3.90mm Width)
Mounting Type Surface Mount
Product Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)

Substitute Part Grouping Explanation

Substitution eligibility for the IXDI504SIAT/R is determined by the following critical parameters:

Primary Compatibility Criteria:

  • Driven Configuration: Low-Side (mandatory)
  • Number of Drivers: 2 (mandatory)
  • Input Type: Inverting (mandatory)
  • Package / Case: 8-SOIC form factor (mandatory for PCB compatibility)
  • Mounting Type: Surface Mount (mandatory)

Electrical Compatibility Criteria:

  • Voltage - Supply range must encompass or overlap with 4.5V ~ 30V
  • Logic Voltage thresholds (VIL, VIH) must be compatible with control signal levels
  • Current - Peak Output (Source, Sink) must meet or exceed application requirements
  • Gate Type support for IGBT and MOSFET devices
  • Operating Temperature range must cover -55°C ~ 150°C or application-specific subset

Secondary Considerations:

  • Rise / Fall Time specifications affect switching performance and EMI characteristics
  • Product Status (Active preferred over Obsolete or Last Time Buy for long-term availability)
  • RoHS and REACH compliance for regulatory requirements
  • Moisture Sensitivity Level for storage and handling requirements

The substitute parts listed below meet the primary compatibility criteria and maintain functional equivalence within specified electrical parameters.

Parameter Comparison

Part Number Manufacturer Supply Voltage Logic VIL, VIH Peak Output (Source, Sink) Rise / Fall Time (Typ) Operating Temp Package Product Status
IXDI504SIAT/R IXYS 4.5V ~ 30V 0.8V, 3V 4A, 4A 9ns, 8ns -55°C ~ 150°C 8-SOIC Obsolete
IR4426SPBF Infineon Technologies 6V ~ 20V 0.8V, 2.7V 2.3A, 3.3A 15ns, 10ns -40°C ~ 150°C 8-SOIC Obsolete
IR4426STRPBF Infineon Technologies 6V ~ 20V 0.8V, 2.7V 2.3A, 3.3A 15ns, 10ns -40°C ~ 150°C 8-SOIC Active
IXDI602SI IXYS Integrated Circuits Division 4.5V ~ 35V 0.8V, 3V 2A, 2A 7.5ns, 6.5ns -55°C ~ 150°C 8-SOIC-EP Active
IXDI602SIA IXYS Integrated Circuits Division 4.5V ~ 35V 0.8V, 3V 2A, 2A 7.5ns, 6.5ns -55°C ~ 150°C 8-SOIC Active
IXDI602SIATR IXYS Integrated Circuits Division 4.5V ~ 35V 0.8V, 3V 2A, 2A 7.5ns, 6.5ns -55°C ~ 150°C 8-SOIC Active
IXDI602SITR IXYS Integrated Circuits Division 4.5V ~ 35V 0.8V, 3V 2A, 2A 7.5ns, 6.5ns -55°C ~ 150°C 8-SOIC-EP Active
UCC27323D Texas Instruments 4.5V ~ 15V 1V, 2V 4A, 4A 20ns, 15ns -55°C ~ 150°C 8-SOIC Last Time Buy
UCC27323DR Texas Instruments 4.5V ~ 15V 1V, 2V 4A, 4A 20ns, 15ns -55°C ~ 150°C 8-SOIC Active
UCC37323DR Texas Instruments 4.5V ~ 15V 1V, 2V 4A, 4A 20ns, 15ns -55°C ~ 150°C 8-SOIC Active

Engineering Selection Recommendations

Tier 1 - Preferred Substitutes (Active Status, Full Compatibility):

IXDI602SIA, IXDI602SIATR, and IXDI602SITR from IXYS maintain the closest electrical alignment with the IXDI504SIAT/R. These parts share identical logic voltage thresholds (0.8V, 3V), extended supply voltage range (4.5V ~ 35V), and matching operating temperature range (-55°C ~ 150°C). All three are currently Active products with RoHS3 compliance and unlimited moisture sensitivity rating. The primary trade-off is reduced peak output current (2A vs. 4A), which is acceptable for applications not requiring maximum drive capability. IXDI602SI includes an exposed pad variant for enhanced thermal performance.

Tier 2 - Alternative Substitutes (Active Status, Conditional Compatibility):

IR4426STRPBF from Infineon Technologies is an Active product offering 4A peak output current matching the original part. However, the supply voltage range is restricted to 6V ~ 20V, requiring circuit redesign if the application uses the full 4.5V ~ 30V range of the IXDI504SIAT/R. Logic voltage thresholds differ (0.8V, 2.7V vs. 0.8V, 3V), and rise/fall times are slower (15ns, 10ns). This part is suitable only for applications operating within the 6V ~ 20V window with compatible logic signal levels.

UCC27323DR and UCC37323DR from Texas Instruments provide 4A peak output current and matching temperature range but are limited to 4.5V ~ 15V supply operation. Logic voltage thresholds (1V, 2V) differ from the original specification. These parts are appropriate for lower voltage applications within the 4.5V ~ 15V band. Both are Active products with RoHS3 compliance.

Tier 3 - Legacy Substitutes (Obsolete or Last Time Buy Status):

IR4426SPBF and UCC27323D are not recommended for new designs due to Obsolete or Last Time Buy status, respectively. These parts present supply chain risk and should be used only when existing inventory must be consumed or when design continuity with legacy systems is required.

Frequently Asked Questions (FAQ)

Q: Can I use IXDI602SIA as a direct replacement for IXDI504SIAT/R?

A: IXDI602SIA is functionally compatible for low-side gate driving applications. Both parts share the same logic voltage thresholds (0.8V, 3V), inverting input configuration, dual independent channels, and 8-SOIC package. The IXDI602SIA supports an extended supply voltage range (4.5V ~ 35V) and maintains the full operating temperature range (-55°C ~ 150°C). The primary difference is reduced peak output current (2A vs. 4A). If your application requires less than 2A peak drive current, substitution is direct. If higher current is needed, circuit redesign or alternative parts must be evaluated.

Q: What is the difference between IXDI602SI, IXDI602SIA, and IXDI602SITR?

A: These three parts are electrically identical with the same electrical specifications. The differences are packaging and distribution format. IXDI602SI uses an 8-SOIC package with exposed pad (8-SOIC-EP) in Tube packaging. IXDI602SIA uses standard 8-SOIC without exposed pad in Tube packaging. IXDI602SITR uses 8-SOIC-EP in Tape & Reel format. The exposed pad variant (SI and SITR) provides improved thermal dissipation. Select based on thermal requirements and procurement format preferences.

Q: Why does IR4426STRPBF have lower peak output current than the original part?

A: The IR4426STRPBF is designed for a narrower supply voltage range (6V ~ 20V) compared to the IXDI504SIAT/R (4.5V ~ 30V). This design constraint results in lower peak output current specifications (2.3A source, 3.3A sink vs. 4A, 4A). The part remains functionally compatible for applications operating within the 6V ~ 20V window and not requiring maximum drive capability.

Q: Can I use UCC27323DR in a 4.5V supply application?

A: UCC27323DR supports 4.5V minimum supply voltage and is compatible with 4.5V applications. However, the maximum supply voltage is limited to 15V, restricting use to applications not exceeding this threshold. If your design requires operation above 15V, UCC27323DR is not suitable. The IXDI602 series supports up to 35V and is preferred for higher voltage applications.

Q: What does "Exposed Pad" mean in the 8-SOIC-EP package?

A: The exposed pad (EP) variant includes a thermal pad on the underside of the package connected to the ground plane. This design feature improves heat dissipation during operation, reducing junction temperature rise. Use the exposed pad variant (IXDI602SI or IXDI602SITR) when thermal

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