IXBF50N360 IGBT Equivalent & Substitute Parts

Part Overview

The IXBF50N360 is a 3600V, 70A IGBT manufactured by IXYS in the BIMOSFET™ series, housed in an i4-Pac™-5 through-hole package. This device is rated for 290W maximum power dissipation and features a collector-emitter breakdown voltage of 3600V with a maximum collector current of 70A.

The IXBF50N360 carries a product status of "Not For New Designs," indicating that IXYS has discontinued active development and support for this component. Organizations requiring equivalent functionality for new applications or replacement inventory must identify suitable substitute components that maintain electrical compatibility while offering active product status or enhanced performance characteristics.

Substiute Parts

IXBF50N360
IXYSIn Stock: 927IXBF50N360 Datasheet
IXBF50N360
Current Part
IXBX50N360HV
IXYSIn Stock: 2906IXBX50N360HV Datasheet
IXBX50N360HV
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Key Parameters

Parameter Value Unit
Voltage - Collector Emitter Breakdown (Max) 3600 V
Current - Collector (Ic) (Max) 70 A
Current - Collector Pulsed (Icm) 420 A
Power - Max 290 W
Vce(on) (Max) @ Vge, Ic 2.9V @ 15V, 50A V
Gate Charge 210 nC
Td (on/off) @ 25°C 46/205 ns
Reverse Recovery Time (trr) 1.7 µs
Operating Temperature Range -55 to 150 °C (TJ)
Mounting Type Through Hole -
Package / Case i4-Pac™-5 (3 Leads) -
RoHS Status ROHS3 Compliant -

Substitute Part Grouping Explanation

Substitution of the IXBF50N360 is determined by electrical and mechanical compatibility across the following critical parameters:

Electrical Compatibility Criteria:

  • Voltage - Collector Emitter Breakdown (Max): Must equal or exceed 3600V
  • Vce(on) (Max) @ Vge, Ic: Must match 2.9V @ 15V, 50A specification
  • Gate Charge: Must equal 210 nC
  • Td (on/off) @ 25°C: Must match 46ns/205ns
  • Reverse Recovery Time (trr): Must equal 1.7 µs
  • Operating Temperature Range: Must support -55°C to 150°C (TJ)

Mechanical Compatibility Criteria:

  • Mounting Type: Through Hole
  • Series: BIMOSFET™
  • Input Type: Standard

Performance Enhancement Allowances:

  • Current - Collector (Ic) (Max): May exceed 70A
  • Power - Max: May exceed 290W
  • Current - Collector Pulsed (Icm): May equal or exceed 420A

The IXBX50N360HV meets all electrical compatibility requirements while providing enhanced current and power ratings. Package form factor differs (TO-247PLUS-HV versus i4-Pac™-5), requiring mechanical design verification for board-level integration.

Parameter Comparison

Parameter IXBF50N360 IXBX50N360HV Unit
Manufacturer IXYS IXYS -
Series BIMOSFET™ BIMOSFET™ -
Voltage - Collector Emitter Breakdown (Max) 3600 3600 V
Current - Collector (Ic) (Max) 70 125 A
Current - Collector Pulsed (Icm) 420 420 A
Vce(on) (Max) @ Vge, Ic 2.9V @ 15V, 50A 2.9V @ 15V, 50A V
Power - Max 290 660 W
Input Type Standard Standard -
Gate Charge 210 210 nC
Td (on/off) @ 25°C 46/205 46/205 ns
Reverse Recovery Time (trr) 1.7 1.7 µs
Operating Temperature Range -55 to 150 -55 to 150 °C (TJ)
Mounting Type Through Hole Through Hole -
Package / Case i4-Pac™-5 (3 Leads) TO-247-3 Variant -
Supplier Device Package ISOPLUS i4-PAC™ TO-247PLUS-HV -
Product Status Not For New Designs Active -
RoHS Status ROHS3 Compliant ROHS3 Compliant -
Moisture Sensitivity Level (MSL) 1 (Unlimited) 1 (Unlimited) -
REACH Status REACH Unaffected REACH Unaffected -

Engineering Selection Recommendations

IXBX50N360HV as Primary Substitute:

The IXBX50N360HV is the designated equivalent for the IXBF50N360. This substitute maintains identical electrical characteristics across all critical switching and thermal parameters while providing enhanced current handling (125A versus 70A) and power dissipation (660W versus 290W) capabilities.

The IXBX50N360HV carries an "Active" product status, ensuring ongoing manufacturer support, availability, and compliance with current industry standards. Both components maintain ROHS3 compliance and REACH unaffected status, satisfying regulatory requirements for new designs and manufacturing environments.

The primary design consideration for substitution involves package form factor transition from i4-Pac™-5 (ISOPLUS) to TO-247PLUS-HV. This change requires mechanical redesign of printed circuit board layouts, including lead pattern modification, thermal management interface adjustment, and mounting hardware compatibility verification. Electrical performance remains equivalent across all specified operating conditions.

Frequently Asked Questions (FAQ)

Q: Can the IXBX50N360HV directly replace the IXBF50N360 without circuit modification?

A: Electrical substitution is direct. The IXBX50N360HV maintains identical switching characteristics, gate charge, timing parameters, and thermal operating range. However, the package form factor differs (TO-247PLUS-HV versus i4-Pac™-5), requiring printed circuit board layout redesign and mechanical mounting structure modification.

Q: What are the key electrical parameters that must match for IGBT substitution?

A: Critical matching parameters include collector-emitter breakdown voltage (3600V), gate charge (210 nC), on-state voltage drop (2.9V @ 15V, 50A), turn-on/turn-off delay times (46ns/205ns), and reverse recovery time (1.7 µs). The IXBX50N360HV satisfies all these requirements.

Q: Does the higher current rating (125A versus 70A) of the IXBX50N360HV affect circuit compatibility?

A: Higher current rating represents enhanced capability and does not compromise compatibility in circuits designed for 70A operation. The substitute device operates within the same voltage and thermal specifications, allowing direct electrical substitution in existing circuit topologies.

Q: Are there compliance or regulatory differences between the IXBF50N360 and IXBX50N360HV?

A: Both components maintain ROHS3 compliance, REACH unaffected status, and identical moisture sensitivity levels (MSL 1 - Unlimited). No regulatory or compliance barriers exist for substitution.

Q: Why is the IXBF50N360 marked "Not For New Designs"?

A: This designation indicates IXYS has concluded active development and support for this component. New applications should utilize the IXBX50N360HV, which carries "Active" product status and ensures long-term availability and manufacturer support.

Q: What design considerations apply to the package transition from i4-Pac™-5 to TO-247PLUS-HV?

A: The TO-247PLUS-HV package features different lead spacing, mounting hole patterns, and thermal interface geometry compared to the i4-Pac™-5. Circuit board redesign must accommodate these mechanical differences. Thermal management may improve due to enhanced power dissipation capability (660W versus 290W) of the substitute device.

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