IX2113G Equivalent & Substitute Parts

Part Overview

The IX2113G is a half-bridge gate driver IC manufactured by IXYS Integrated Circuits Division, designed for driving IGBT and MOSFET devices in power management applications. This device features independent dual-channel configuration with non-inverting inputs and is packaged in a 14-DIP through-hole format. The IX2113G is classified as obsolete, making identification of functionally equivalent substitute components essential for ongoing system support and new design implementations.

Substiute Parts

IX2113G
IXYS Integrated Circuits DivisionIn Stock: 22467IX2113G Datasheet
IX2113G
Current Part
FAN73912MX
onsemiIn Stock: 25374FAN73912MX Datasheet
FAN73912MX
MFR Recommended

Key Parameters

Parameter IX2113G Specification
Driven Configuration Half-Bridge
Number of Drivers 2
Gate Type IGBT, N-Channel, P-Channel MOSFET
Voltage - Supply 10V ~ 20V
Logic Voltage - VIL, VIH 6V, 9.5V
Current - Peak Output (Source, Sink) 2A, 2A
Input Type Non-Inverting
High Side Voltage - Max (Bootstrap) 600V
Operating Temperature -40°C ~ 150°C (TJ)
Mounting Type Through Hole
Package / Case 14-DIP (0.300", 7.62mm)
RoHS Status ROHS3 Compliant

Substitute Part Grouping Explanation

Substitution of the IX2113G requires functional equivalence across core electrical parameters that define gate driver operation: supply voltage range, logic signal levels, output current capability, and bootstrap voltage rating. The FAN73912MX qualifies as a substitute based on the following alignment criteria:

Matching Parameters:

  • Dual-channel driver configuration (2 drivers)
  • Non-inverting input type
  • Supply voltage range overlap (12V ~ 20V encompasses the upper operating range of IX2113G)
  • Logic voltage thresholds (VIL 6V, VIH 9.5V) identical to original
  • Peak output current capability (2A source minimum, meeting or exceeding IX2113G requirements)
  • ROHS3 compliance and EAR99 classification

Functional Differences:

  • FAN73912MX supports high-side and low-side configuration versus half-bridge only
  • Bootstrap voltage rating increased to 1200V (higher capability)
  • Surface mount packaging (16-SOIC) versus through-hole (14-DIP)
  • Operating temperature range reduced to -40°C ~ 125°C

Parameter Comparison

Parameter IX2113G FAN73912MX Compatibility Notes
Number of Drivers 2 2 Equivalent
Voltage - Supply 10V ~ 20V 12V ~ 20V Overlapping range; FAN73912MX requires minimum 12V
Logic Voltage - VIL, VIH 6V, 9.5V 6V, 9.5V Identical
Current - Peak Output (Source, Sink) 2A, 2A 2A, 3A FAN73912MX meets or exceeds requirements
Input Type Non-Inverting Non-Inverting Equivalent
High Side Voltage - Max (Bootstrap) 600V 1200V FAN73912MX provides higher rating
Operating Temperature -40°C ~ 150°C -40°C ~ 125°C FAN73912MX has reduced upper limit
Mounting Type Through Hole Surface Mount Different assembly method required
Package / Case 14-DIP 16-SOIC PCB layout redesign necessary
RoHS Status ROHS3 Compliant ROHS3 Compliant Equivalent

Engineering Selection Recommendations

The FAN73912MX serves as a functional substitute for the obsolete IX2113G in applications where the following conditions are met:

  1. Supply Voltage Constraint: System supply voltage must operate at or above 12V. Applications limited to the 10V ~ 12V range of the IX2113G cannot use FAN73912MX without supply modification.

  2. Temperature Constraint: Maximum junction temperature requirement must not exceed 125°C. Applications requiring operation above 125°C require alternative solutions.

  3. Packaging Accommodation: PCB redesign is mandatory due to transition from 14-DIP through-hole to 16-SOIC surface mount. Pin-to-pin compatibility does not exist.

  4. Compliance Status: Both devices maintain ROHS3 compliance and EAR99 classification, ensuring regulatory equivalence for procurement and deployment.

The FAN73912MX is classified as active product status, providing long-term availability and supply chain stability compared to the obsolete IX2113G.

Frequently Asked Questions (FAQ)

Q: Can the FAN73912MX be used as a direct pin-for-pin replacement for the IX2113G?

A: No. The IX2113G uses 14-DIP through-hole packaging while the FAN73912MX uses 16-SOIC surface mount packaging. Pin assignments differ, requiring complete PCB redesign and layout modification.

Q: What is the minimum supply voltage for the FAN73912MX?

A: The FAN73912MX requires a minimum supply voltage of 12V. The IX2113G operates from 10V minimum. Applications with supply voltages between 10V and 12V cannot use the FAN73912MX without supply circuit modification.

Q: Are the logic input voltage thresholds identical between these devices?

A: Yes. Both the IX2113G and FAN73912MX specify VIL of 6V and VIH of 9.5V, ensuring compatible signal conditioning and control circuitry.

Q: Does the FAN73912MX provide sufficient output current for IX2113G applications?

A: Yes. The FAN73912MX provides 2A source current and 3A sink current, meeting or exceeding the 2A source and 2A sink specification of the IX2113G.

Q: What is the impact of the reduced operating temperature range in the FAN73912MX?

A: The FAN73912MX maximum junction temperature is 125°C versus 150°C for the IX2113G. Applications requiring sustained operation above 125°C must use alternative gate driver solutions.

Q: Are both devices RoHS compliant?

A: Yes. Both the IX2113G and FAN73912MX are ROHS3 compliant, meeting environmental and regulatory requirements for component procurement and system deployment.

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