ISL6294IBZ Equivalent & Substitute Parts

Part Overview

The ISL6294IBZ is a lithium ion/polymer battery charger IC manufactured by Renesas Electronics Corporation, designed for single-cell battery charging applications. This component is classified as obsolete, which necessitates identification of equivalent substitute parts for ongoing design requirements and production continuity. The ISL6294IBZ operates as a constant-current programmable charger with integrated over-temperature fault protection, suitable for portable electronic devices requiring reliable charging management.

Substiute Parts

ISL6294IBZ

Renesas Electronics CorporationIn Stock: 9687ISL6294IBZ Datasheet

Current PartRFQ

ISL6294IRZ-T

Renesas Electronics CorporationIn Stock: 36893ISL6294IRZ-T Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the ISL6294IBZ is determined by strict alignment of the following electrical and mechanical parameters:

• Battery chemistry and cell count (Lithium Ion/Polymer, single cell)
• Battery pack voltage specification (4.2V)
• Maximum supply voltage (6.5V)
• Operating temperature range (-40°C ~ 85°C)
• Charging current capability and programmability
• Fault protection features (over-temperature)
• RoHS and regulatory compliance status

The ISL6294IRZ-T qualifies as a substitute based on matching all critical electrical parameters and regulatory certifications. Both parts share the same base product number (ISL6294), manufacturer, and functional specifications. The primary difference is packaging format and maximum charge current capability.

Parameter Comparison

Engineering Selection Recommendations

The ISL6294IRZ-T is an active substitute for the obsolete ISL6294IBZ. Both components maintain identical electrical specifications for battery voltage, supply voltage, operating temperature range, and charging control methodology. The substitute part offers increased maximum charge current capability (900mA versus 600mA), which provides design flexibility for higher-current charging applications while remaining backward-compatible with lower-current requirements.

The ISL6294IRZ-T is currently in active production status with substantial inventory availability, ensuring supply chain continuity. Both parts maintain equivalent regulatory compliance, including ROHS3 certification and REACH unaffected status. The packaging transition from 8-SOIC to 8-VFDFN format requires PCB layout modification but does not affect electrical functionality or thermal performance characteristics.

Frequently Asked Questions (FAQ)

Q: Can the ISL6294IRZ-T directly replace the ISL6294IBZ without circuit modifications?

A: Electrical substitution is valid based on matching supply voltage, battery voltage, operating temperature, and charging control specifications. However, the package format differs (8-SOIC to 8-VFDFN), requiring PCB layout redesign. Pin-to-pin compatibility must be verified against detailed datasheets before implementation.

Q: What is the significance of the increased maximum charge current in the ISL6294IRZ-T?

A: The ISL6294IRZ-T supports 900mA maximum charge current compared to 600mA in the ISL6294IBZ. This higher capability does not prevent use in applications requiring lower charging currents, as the charging current is programmable in both parts. Applications designed for 600mA operation remain compatible.

Q: Why is the ISL6294IBZ listed as obsolete?

A: Obsolete status indicates the manufacturer has discontinued production. The ISL6294IRZ-T represents the active equivalent within the ISL6294 product family, ensuring continued availability and support for new designs and production requirements.

Q: Are there compliance differences between these parts?

A: Both parts maintain identical regulatory compliance: ROHS3 certification, REACH unaffected status, and MSL Level 1 (unlimited moisture sensitivity). No compliance barriers exist for substitution.

Q: What packaging considerations apply to the ISL6294IRZ-T?

A: The ISL6294IRZ-T uses 8-VFDFN (Very Fine Pitch Dual Flat No-Lead) with exposed pad, compared to the 8-SOIC format of the main part. The VFDFN package offers reduced footprint and improved thermal characteristics through the exposed pad, but requires updated PCB design and assembly processes compatible with fine-pitch surface mount technology.