ISL5857IBZ Equivalent & Substitute Parts

Part Overview

The ISL5857IBZ is a 12-bit digital-to-analog converter (DAC) manufactured by Renesas Electronics Corporation, designed for data acquisition applications. This single-channel DAC features current-unbuffered output with differential capability and operates across a 2.7V to 3.6V supply range. The device is classified as obsolete, making identification of functionally equivalent substitute parts essential for ongoing system support and component procurement.

Substiute Parts

ISL5857IBZ

Renesas Electronics CorporationIn Stock: 1134ISL5857IBZ Datasheet

Current PartRFQ

ISL5857IAZ

Renesas Electronics CorporationIn Stock: 3223ISL5857IAZ Datasheet

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Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the ISL5857IBZ are identified based on strict electrical and mechanical compatibility criteria. The following parameters must remain constant across all substitute candidates:

• 12-bit resolution
• Single D/A converter channel
• Current-unbuffered output with differential capability
• Parallel data interface
• External and internal reference support
• 2.7V to 3.6V analog and digital supply voltage range
• ±0.5 LSB INL/DNL specifications
• Current source architecture
• -40°C to 85°C operating temperature range
• ROHS3 compliance and REACH unaffected status

The ISL5857IAZ qualifies as a direct substitute based on identical electrical specifications. The primary difference is packaging format: the ISL5857IBZ uses 28-SOIC while the ISL5857IAZ uses 28-TSSOP. Both packages are surface-mount configurations with equivalent pin counts and electrical performance.

Parameter Comparison

Engineering Selection Recommendations

Both the ISL5857IBZ and ISL5857IAZ are classified as obsolete products. Selection between these parts depends on PCB layout constraints and available inventory.

The ISL5857IBZ (28-SOIC package) provides a wider body profile (7.50mm) suitable for applications with standard PCB trace spacing. The ISL5857IAZ (28-TSSOP package) offers a narrower footprint (4.40mm), enabling higher component density on space-constrained boards.

Both devices maintain identical electrical performance, compliance certifications (ROHS3, REACH unaffected), and moisture sensitivity ratings. PCB redesign may be required to accommodate package geometry differences, including trace routing and solder pad dimensions.

Frequently Asked Questions (FAQ)

Q: Can ISL5857IAZ directly replace ISL5857IBZ without circuit modification?

A: Electrical substitution is valid. However, package geometry differs: ISL5857IBZ uses 28-SOIC while ISL5857IAZ uses 28-TSSOP. PCB layout modifications are required to accommodate different pin footprints and body dimensions.

Q: Are there any performance differences between these parts?

A: No. Both devices share identical electrical specifications including 12-bit resolution, ±0.5 LSB INL/DNL accuracy, current-unbuffered output, differential capability, and operating temperature range.

Q: What is the significance of the package width difference?

A: The 28-SOIC package (7.50mm width) and 28-TSSOP package (4.40mm width) affect PCB real estate and trace routing. TSSOP enables higher component density; SOIC provides standard spacing compatibility.

Q: Do both parts require identical handling and storage conditions?

A: Yes. Both devices carry MSL 3 (168 Hours) moisture sensitivity ratings, requiring equivalent storage and handling protocols.

Q: Are both parts suitable for new designs?

A: Both ISL5857IBZ and ISL5857IAZ are classified as obsolete. For new designs, evaluation of current-generation DAC alternatives from Renesas or other manufacturers is recommended based on application requirements.