IS46DR16640C-25DBLA2 Equivalent & Substitute Parts

Part Overview

The IS46DR16640C-25DBLA2 is a 1Gbit DDR2 SDRAM memory IC manufactured by ISSI (Integrated Silicon Solution Inc.). This parallel interface DRAM operates at 400 MHz with a 400 ps access time and is housed in an 84-TWBGA package. The device is actively produced and ROHS3 compliant, making it suitable for applications requiring high-density volatile memory in compact form factors. Equivalent and substitute parts are identified when they share identical or compatible electrical specifications, memory organization, and mechanical packaging within the DDR2 SDRAM category.

Substiute Parts

IS46DR16640C-25DBLA2

ISSI, Integrated Silicon Solution IncIn Stock: 4117IS46DR16640C-25DBLA2 Datasheet

Current PartRFQ

MT47H64M16NF-25E:M

Micron Technology Inc.In Stock: 26632MT47H64M16NF-25E:M Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the IS46DR16640C-25DBLA2 is determined by strict alignment of the following electrical and mechanical parameters:

• Memory capacity: 1Gbit
• Memory organization: 64M x 16
• Technology: SDRAM - DDR2
• Clock frequency: 400 MHz
• Access time: 400 ps
• Write cycle time: 15 ns
• Supply voltage range: 1.7V ~ 1.9V
• Package type: 84-pin BGA (8x12.5mm footprint)
• Mounting: Surface Mount
• Compliance: ROHS3 and REACH requirements

The MT47H64M16NF-25E:M from Micron Technology Inc. meets all these criteria and is classified as a manufacturer-recommended equivalent. Packaging variation between TWBGA and FBGA does not affect electrical compatibility or PCB footprint compatibility, as both maintain the same 84-pin BGA (8x12.5mm) mechanical specification.

Parameter Comparison

Engineering Selection Recommendations

The MT47H64M16NF-25E:M is a direct electrical equivalent to the IS46DR16640C-25DBLA2. Both devices are ROHS3 compliant and REACH unaffected, meeting current regulatory requirements. The primary consideration is operating temperature range: the ISSI part supports -40°C to 105°C, while the Micron part operates from 0°C to 85°C. Selection between these parts depends on the application's thermal environment requirements. Both parts maintain identical electrical performance, memory organization, and physical footprint compatibility. Inventory availability should also be evaluated, as the Micron part currently has higher stock levels (26,540 pcs vs. 4,088 pcs).

Frequently Asked Questions (FAQ)

Q: Can MT47H64M16NF-25E:M replace IS46DR16640C-25DBLA2 in existing designs?

A: Yes, the MT47H64M16NF-25E:M is electrically and mechanically compatible. Both devices share identical memory capacity (1Gbit), organization (64M x 16), clock frequency (400 MHz), access time (400 ps), and supply voltage (1.7V ~ 1.9V). The 84-pin BGA footprint is identical at 8x12.5mm.

Q: What is the difference between TWBGA and FBGA packaging?

A: TWBGA (Thin Wire Ball Grid Array) and FBGA (Fine Ball Grid Array) are both 84-pin BGA packages with identical 8x12.5mm footprints and pin configurations. The packaging designation does not affect electrical performance or PCB compatibility.

Q: Are there temperature range limitations when substituting?

A: The ISSI part operates from -40°C to 105°C, while the Micron part operates from 0°C to 85°C. If your application requires operation below 0°C or above 85°C, the ISSI part is required. For standard commercial temperature ranges (0°C to 85°C), both parts are suitable.

Q: Do both parts meet the same compliance standards?

A: Yes, both the IS46DR16640C-25DBLA2 and MT47H64M16NF-25E:M are ROHS3 compliant and REACH unaffected, meeting current environmental and regulatory requirements.

Q: What is the MSL rating and why does it matter?

A: Both parts have an MSL (Moisture Sensitivity Level) rating of 3 with a 168-hour floor life. This means the components can be exposed to moisture for up to 168 hours after reflow soldering before requiring baking. Proper handling and storage procedures must be followed to maintain this rating.