IS43LR16640A-6BL Equivalent & Substitute Parts

Part Overview

The IS43LR16640A-6BL is a 1Gbit SDRAM Mobile LPDDR memory IC manufactured by ISSI (Integrated Silicon Solution Inc). This parallel interface DRAM operates at 166 MHz with a 5 ns access time in a 60-pin TWBGA (8x10) package. The device is actively produced and widely used in mobile computing and embedded applications requiring low-power DRAM solutions.

Substitute parts become necessary when the primary part experiences supply constraints, extended lead times, or when design flexibility permits selection from qualified alternatives meeting identical electrical and mechanical specifications.

Substiute Parts

IS43LR16640A-6BL

ISSI, Integrated Silicon Solution IncIn Stock: 2951IS43LR16640A-6BL Datasheet

Current PartRFQ

W94AD6KBHX5I

Winbond ElectronicsIn Stock: 2910W94AD6KBHX5I Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

The W94AD6KBHX5I (Winbond Electronics) qualifies as a direct substitute based on the following matched electrical and mechanical parameters:

• Memory capacity: 1Gbit (identical)
• Memory organization: 64M x 16 (identical)
• Memory type: Volatile DRAM (identical)
• Technology: SDRAM - Mobile LPDDR (identical)
• Memory interface: Parallel (identical)
• Access time: 5 ns (identical)
• Write cycle time: 15 ns (identical)
• Voltage supply range: 1.7V ~ 1.95V (identical)
• Mounting type: Surface Mount (identical)
• Package classification: 60-TFBGA (identical)
• RoHS compliance: ROHS3 Compliant (identical)
• MSL rating: 3 (168 Hours) (identical)

The substitute part operates at 200 MHz clock frequency (versus 166 MHz for the primary part) and features an extended operating temperature range (-40°C ~ 85°C versus 0°C ~ 70°C). These differences represent enhanced performance and environmental specifications that do not restrict substitution in applications designed for the primary part.

Parameter Comparison

Engineering Selection Recommendations

Both the IS43LR16640A-6BL and W94AD6KBHX5I are active production devices with ROHS3 compliance and identical MSL ratings. Selection between these parts should be based on:

• Supply availability and lead time requirements
• Application operating temperature range requirements (the Winbond device supports extended temperature operation)
• PCB layout constraints related to package footprint differences (TWBGA 8x10 versus VFBGA 8x9)
• Inventory management and procurement strategy

Both devices meet the electrical specifications for 1Gbit SDRAM Mobile LPDDR applications with parallel interface architecture.

Frequently Asked Questions (FAQ)

Q: Can the W94AD6KBHX5I replace the IS43LR16640A-6BL in existing designs?

A: Yes, provided the PCB layout accommodates the package footprint difference (60-TWBGA 8x10 versus 60-VFBGA 8x9). The electrical specifications, memory organization, and interface characteristics are identical.

Q: What is the significance of the clock frequency difference (166 MHz versus 200 MHz)?

A: The substitute part operates at a higher clock frequency. This represents enhanced performance capability and does not restrict substitution in applications designed for the lower frequency primary part.

Q: Are there temperature range considerations for substitution?

A: The Winbond device supports an extended operating temperature range (-40°C ~ 85°C) compared to the ISSI device (0°C ~ 70°C). Applications operating within the ISSI temperature range will function with either device. Applications requiring extended low-temperature operation must use the Winbond substitute.

Q: Do both parts have identical compliance certifications?

A: Yes. Both devices are ROHS3 compliant, REACH unaffected, and carry identical MSL ratings of 3 (168 Hours).

Q: What package considerations apply to substitution?

A: The primary part uses a 60-TWBGA (8x10) package while the substitute uses a 60-VFBGA (8x9) package. Both are 60-pin TFBGA classifications with identical pin assignments. PCB layout verification is required to confirm footprint compatibility.