IS43DR16640B-3DBL Equivalent & Substitute Parts

Part Overview

The IS43DR16640B-3DBL is a 1Gbit DDR2 SDRAM memory IC manufactured by ISSI (Integrated Silicon Solution Inc.) in a 84-TWBGA package. This device operates at 333 MHz with a 450 ps access time and is designed for parallel memory applications requiring 64M x 16 organization. The part is marked as Not For New Designs, making identification of functionally equivalent alternatives essential for ongoing production support and legacy system maintenance.

Substiute Parts

IS43DR16640B-3DBL
ISSI, Integrated Silicon Solution IncIn Stock: 17301IS43DR16640B-3DBL Datasheet
IS43DR16640B-3DBL
Current Part
IS43DR16640B-25DBLI
ISSI, Integrated Silicon Solution IncIn Stock: 16328IS43DR16640B-25DBLI Datasheet
IS43DR16640B-25DBLI
MFR Recommended
IS43DR16640B-3DBLI
ISSI, Integrated Silicon Solution IncIn Stock: 17996IS43DR16640B-3DBLI Datasheet
IS43DR16640B-3DBLI
MFR Recommended
IS46DR16640B-25EBLA1
ISSI, Integrated Silicon Solution IncIn Stock: 687IS46DR16640B-25EBLA1 Datasheet
IS46DR16640B-25EBLA1
MFR Recommended
MT47H64M16NF-25E AAT:M
Micron Technology Inc.In Stock: 2551MT47H64M16NF-25E AAT:M Datasheet
MT47H64M16NF-25E AAT:M
MFR Recommended
MT47H64M16NF-25E AIT:M
Micron Technology Inc.In Stock: 1980MT47H64M16NF-25E AIT:M Datasheet
MT47H64M16NF-25E AIT:M
MFR Recommended
MT47H64M16NF-25E IT:M
Micron Technology Inc.In Stock: 26799MT47H64M16NF-25E IT:M Datasheet
MT47H64M16NF-25E IT:M
MFR Recommended
MT47H64M16NF-25E:M
Micron Technology Inc.In Stock: 26632MT47H64M16NF-25E:M Datasheet
MT47H64M16NF-25E:M
MFR Recommended
NDB16PFC-4DET
Insignis Technology CorporationIn Stock: 1106NDB16PFC-4DET Datasheet
NDB16PFC-4DET
MFR Recommended

Key Parameters

Parameter Value
Memory Type Volatile DRAM
Technology SDRAM - DDR2
Memory Size 1Gbit
Memory Organization 64M x 16
Memory Interface Parallel
Clock Frequency 333 MHz
Access Time 450 ps
Voltage Supply 1.7V ~ 1.9V
Operating Temperature 0°C ~ 70°C (TA)
Package 84-TWBGA (8x12.5)
RoHS Status ROHS3 Compliant
MSL Rating 3 (168 Hours)

Substitute Part Grouping Explanation

Substitution of the IS43DR16640B-3DBL is determined by strict compatibility across the following parameters:

Critical Matching Parameters:

  • Memory Size: 1Gbit
  • Memory Organization: 64M x 16
  • Technology: SDRAM - DDR2
  • Memory Interface: Parallel
  • Package Type: 84-TWBGA or 84-FBGA (8x12.5)
  • Voltage Supply Range: 1.7V ~ 1.9V
  • Write Cycle Time: 15ns

Performance Parameters (Speed Grade):

  • Clock Frequency: 333 MHz or higher
  • Access Time: 450 ps or faster

Substitute parts are grouped into two categories based on performance characteristics: parts operating at 333 MHz (direct speed-grade match) and parts operating at 400 MHz (higher performance, backward compatible). All substitutes maintain identical memory capacity, organization, and electrical specifications while differing in operating temperature ranges and product status.

Parameter Comparison

Part Number Manufacturer Memory Size Organization Clock Frequency Access Time Package Voltage Supply Operating Temperature Product Status
IS43DR16640B-3DBL ISSI 1Gbit 64M x 16 333 MHz 450 ps 84-TWBGA 1.7V ~ 1.9V 0°C ~ 70°C Not For New Designs
IS43DR16640B-3DBLI ISSI 1Gbit 64M x 16 333 MHz 450 ps 84-TWBGA 1.7V ~ 1.9V -40°C ~ 85°C Not For New Designs
IS43DR16640B-25DBLI ISSI 1Gbit 64M x 16 400 MHz 400 ps 84-TWBGA 1.7V ~ 1.9V -40°C ~ 85°C Not For New Designs
IS46DR16640B-25EBLA1 ISSI 1Gbit 64M x 16 400 MHz 400 ps 84-TWBGA 1.7V ~ 1.9V -40°C ~ 85°C Active
MT47H64M16NF-25E IT:M Micron Technology Inc. 1Gbit 64M x 16 400 MHz 400 ps 84-FBGA 1.7V ~ 1.9V -40°C ~ 95°C Active
MT47H64M16NF-25E:M Micron Technology Inc. 1Gbit 64M x 16 400 MHz 400 ps 84-FBGA 1.7V ~ 1.9V 0°C ~ 85°C Active
MT47H64M16NF-25E AAT:M Micron Technology Inc. 1Gbit 64M x 16 400 MHz 400 ps 84-FBGA 1.7V ~ 1.9V -40°C ~ 105°C Active
MT47H64M16NF-25E AIT:M Micron Technology Inc. 1Gbit 64M x 16 400 MHz 400 ps 84-FBGA 1.7V ~ 1.9V -40°C ~ 95°C Active
NDB16PFC-4DET Insignis Technology Corporation 1Gbit 64M x 16 400 MHz N/A 84-FBGA 1.7V ~ 1.9V 0°C ~ 85°C Active

Engineering Selection Recommendations

ISSI Direct Substitutes (333 MHz Speed Grade): IS43DR16640B-3DBLI provides identical electrical and performance characteristics to the original part with extended operating temperature range (-40°C to 85°C versus 0°C to 70°C). This part maintains the same 333 MHz clock frequency and 450 ps access time, making it a direct functional replacement. Both parts carry Not For New Designs status and ROHS3 compliance.

ISSI Higher Performance Substitutes (400 MHz Speed Grade): IS43DR16640B-25DBLI and IS46DR16640B-25EBLA1 operate at 400 MHz with 400 ps access time, providing improved performance while maintaining backward compatibility with systems designed for 333 MHz operation. IS46DR16640B-25EBLA1 carries Active product status, indicating ongoing manufacturer support. Both parts support the full industrial temperature range (-40°C to 85°C).

Micron Technology Substitutes (400 MHz, Automotive Grade): MT47H64M16NF-25E variants from Micron Technology offer 400 MHz operation with extended temperature ranges. The AAT:M variant supports -40°C to 105°C operation and carries AEC-Q100 automotive qualification. The IT:M and AIT:M variants are qualified for automotive applications with -40°C to 95°C operating range. All Micron parts use 84-FBGA packaging and maintain Active product status. The :M variant operates at 0°C to 85°C without automotive qualification.

Alternative Manufacturer Substitute: NDB16PFC-4DET from Insignis Technology Corporation provides 1Gbit DDR2 SDRAM in 84-FBGA package with 400 MHz operation and Active product status. This part operates within 0°C to 85°C temperature range and maintains ROHS3 compliance.

Frequently Asked Questions (FAQ)

Q: Can IS43DR16640B-25DBLI replace IS43DR16640B-3DBL in existing designs? A: Yes. IS43DR16640B-25DBLI is functionally compatible as a direct substitute. Both parts share identical memory capacity (1Gbit), organization (64M x 16), voltage supply (1.7V ~ 1.9V), and package (84-TWBGA). The 25DBLI variant operates at 400 MHz versus 333 MHz, providing improved performance. The extended temperature range (-40°C to 85°C) of the 25DBLI accommodates a wider operating environment than the original part (0°C to 70°C).

Q: What is the difference between TWBGA and FBGA packaging? A: Both TWBGA (Thin Wire Ball Grid Array) and FBGA (Fine Ball Grid Array) are 84-pin packages with identical 8x12.5mm dimensions. The primary difference lies in ball pitch and manufacturing process. TWBGA is used by ISSI, while FBGA is used by Micron Technology and Insignis. Both package types are mechanically and electrically compatible for this memory application, though PCB layout and reflow profiles may require validation.

Q: Are Micron MT47H64M16NF-25E variants suitable for automotive applications? A: Micron offers automotive-qualified variants: MT47H64M16NF-25E AAT:M and MT47H64M16NF-25E AIT:M both carry AEC-Q100 qualification. These parts support extended temperature ranges (-40°C to 105°C and -40°C to 95°C respectively) suitable for automotive environments. The IT:M and :M variants are not automotive-qualified but support industrial and commercial temperature ranges.

Q: What is the significance of Product Status "Not For New Designs"? A: Parts marked "Not For New Designs" indicate the manufacturer is discontinuing or has discontinued active development. IS43DR16640B-3DBL and related ISSI parts carry this status. For new designs, Active status parts such as IS46DR16640B-25EBLA1, Micron MT47H64M16NF-25E variants, or NDB16PFC-4DET are recommended. For legacy system support, Not For New Designs parts remain functionally valid.

Q: Can NDB16PFC-4DET from Insignis replace ISSI or Micron parts? A: Yes, NDB16PFC-4DET is functionally compatible. It provides identical 1Gbit capacity, 64M x 16 organization, 400 MHz operation, and 84-FBGA packaging. The part operates within 0°C to 85°C temperature range and maintains ROHS3 compliance. Validation of supplier qualification and supply chain continuity is recommended for production use.

Q: What parameters must remain constant for substitution? A: Memory capacity (1Gbit), organization (64M x 16), technology (DDR2 SDRAM), interface type (Parallel), voltage supply (1.7V ~ 1.9V), and write cycle time (15ns) must remain constant. Clock frequency and access time may improve (higher frequency, faster access time) without compromising compatibility. Operating temperature range may be extended. Package type may vary between TWBGA and FBGA provided mechanical and electrical compatibility is validated.

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