IS25LQ512B-JDLE Equivalent & Substitute Parts

Part Overview

The IS25LQ512B-JDLE is a 512Kbit NOR Flash memory IC manufactured by ISSI (Integrated Silicon Solution Inc) in an 8-TSSOP surface mount package. This device provides SPI and Quad I/O interface capability with a 104 MHz clock frequency, designed for non-volatile data storage applications requiring compact form factors.

The IS25LQ512B-JDLE is classified as obsolete. Locating equivalent substitute parts is necessary to maintain design continuity, ensure supply chain availability, and support ongoing production or maintenance requirements for systems utilizing this memory IC.

Key Parameters

Parameter	Value
Memory Type	Non-Volatile FLASH
Memory Format	FLASH - NOR
Memory Size	512Kbit
Memory Organization	64K x 8
Memory Interface	SPI - Quad I/O
Clock Frequency	104 MHz
Voltage Supply Range	2.3V ~ 3.6V
Operating Temperature	-40°C ~ 105°C (TA)
Package Type	8-TSSOP (0.173", 4.40mm Width)
Mounting Type	Surface Mount
RoHS Status	ROHS3 Compliant

Substitute Part Grouping Explanation

Substitution of the IS25LQ512B-JDLE is determined by strict alignment of the following critical parameters:

Memory Capacity: 512Kbit (64K x 8 organization) — substitute must match exactly
Package Type: 8-TSSOP surface mount with identical physical dimensions (0.173", 4.40mm Width)
Memory Interface: SPI protocol support with minimum 104 MHz clock frequency capability
Non-Volatile FLASH Technology: NOR Flash memory type required
Voltage Supply Compatibility: Operating voltage range must encompass or be compatible with system requirements
Operating Temperature Range: Must support the required thermal environment
RoHS Compliance: ROHS3 certification required for regulatory alignment

The AT25XE512C-XMHN-T meets these substitution criteria through equivalent memory capacity, identical package specifications, compatible SPI interface, and matching compliance certifications.

Parameter Comparison

Parameter	IS25LQ512B-JDLE (Main Part)	AT25XE512C-XMHN-T (Substitute)
Manufacturer	ISSI	Renesas Electronics Corporation
Memory Type	Non-Volatile FLASH	Non-Volatile FLASH
Memory Format	FLASH - NOR	FLASH - NOR
Memory Size	512Kbit	512Kbit
Memory Organization	64K x 8	64K x 8
Memory Interface	SPI - Quad I/O	SPI
Clock Frequency	104 MHz	104 MHz
Write Cycle Time	800µs (Page)	12µs (Word), 3ms (Page)
Voltage Supply Range	2.3V ~ 3.6V	1.65V ~ 3.6V
Operating Temperature	-40°C ~ 105°C (TA)	-40°C ~ 85°C (TC)
Package Type	8-TSSOP (0.173", 4.40mm Width)	8-TSSOP (0.173", 4.40mm Width)
Mounting Type	Surface Mount	Surface Mount
RoHS Status	ROHS3 Compliant	ROHS3 Compliant
Product Status	Obsolete	Active

Engineering Selection Recommendations

The AT25XE512C-XMHN-T is a qualified substitute for the IS25LQ512B-JDLE based on the following engineering criteria:

Functional Equivalence: Both devices provide 512Kbit NOR Flash memory with 64K x 8 organization, identical package geometry (8-TSSOP), and 104 MHz clock frequency operation. Pin-compatible surface mount configuration enables direct PCB replacement.

Supply Chain Status: The AT25XE512C-XMHN-T maintains active product status with current inventory availability (3485 Pcs), whereas the IS25LQ512B-JDLE is obsolete. This substitution ensures continued access to functionally equivalent memory components.

Regulatory Compliance: Both parts maintain ROHS3 compliance and REACH unaffected status, satisfying environmental and regulatory requirements for equivalent component selection.

Operating Conditions: The AT25XE512C-XMHN-T operates across a wider voltage supply range (1.65V ~ 3.6V) compared to the main part (2.3V ~ 3.6V), providing enhanced flexibility for system integration. The maximum operating temperature of 85°C (TC) is lower than the main part's 105°C (TA); system thermal requirements must be evaluated for compatibility.

Interface Consideration: The main part supports SPI with Quad I/O capability, while the substitute provides standard SPI interface. Applications requiring Quad I/O functionality must assess whether standard SPI operation is acceptable for the intended application.

Frequently Asked Questions (FAQ)

Q: Can the AT25XE512C-XMHN-T directly replace the IS25LQ512B-JDLE on existing PCBs?

A: Yes, the AT25XE512C-XMHN-T is pin-compatible and package-equivalent (8-TSSOP, identical physical dimensions). Direct PCB replacement is possible without layout modifications.

Q: What is the primary difference between these two parts?

A: The main part (IS25LQ512B-JDLE) is obsolete with limited availability, while the substitute (AT25XE512C-XMHN-T) is an active product with current inventory. Both provide 512Kbit NOR Flash memory at 104 MHz. The substitute offers a wider voltage supply range (1.65V ~ 3.6V vs. 2.3V ~ 3.6V) but operates at a lower maximum temperature (85°C vs. 105°C).

Q: Does the substitute support Quad I/O operation?

A: The AT25XE512C-XMHN-T provides standard SPI interface. The main part supports SPI with Quad I/O capability. Applications requiring Quad I/O functionality must assess whether standard SPI operation meets system requirements.

Q: Are both parts RoHS compliant?

A: Yes, both the IS25LQ512B-JDLE and AT25XE512C-XMHN-T are ROHS3 compliant and REACH unaffected, meeting environmental and regulatory standards.

Q: What is the operating temperature difference, and does it affect substitution?

A: The main part operates to 105°C (TA), while the substitute operates to 85°C (TC). System thermal environment must be evaluated to ensure the substitute's maximum operating temperature is not exceeded during normal operation.

Q: Are there any packaging or moisture sensitivity differences?

A: Both parts use 8-TSSOP surface mount packaging. The main part has MSL 3 (168 Hours), while the substitute has MSL 1 (Unlimited), indicating the substitute has superior moisture resistance and lower handling restrictions.

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