IS25LQ025B-JDLE Equivalent & Substitute Parts

Part Overview

The IS25LQ025B-JDLE is a 256Kbit NOR Flash memory IC manufactured by ISSI (Integrated Silicon Solution Inc) in an 8-TSSOP surface mount package. This device provides SPI and Quad I/O interface capability with a 104 MHz clock frequency, designed for non-volatile data storage applications requiring compact form factors.

The IS25LQ025B-JDLE is classified as obsolete. Locating equivalent substitute parts is necessary to maintain design continuity, ensure supply chain reliability, and support ongoing production or maintenance requirements for systems utilizing this memory IC.

Key Parameters

Parameter	Value
Memory Type	Non-Volatile FLASH
Memory Format	FLASH - NOR
Memory Size	256Kbit
Memory Organization	32K x 8
Memory Interface	SPI - Quad I/O
Clock Frequency	104 MHz
Voltage Supply Range	2.3V ~ 3.6V
Operating Temperature	-40°C ~ 105°C (TA)
Package Type	8-TSSOP (0.173", 4.40mm Width)
Mounting Type	Surface Mount
RoHS Status	ROHS3 Compliant

Substitute Part Grouping Explanation

Substitute parts for the IS25LQ025B-JDLE are qualified based on the following critical parameters:

Memory Capacity: 256Kbit (32K x 8 organization) — exact match required
Memory Technology: FLASH - NOR — functional equivalence
Package Type: 8-TSSOP with identical physical dimensions (0.173", 4.40mm Width) — PCB layout compatibility
Interface Compatibility: SPI interface support — minimum requirement for functional substitution
Voltage Supply Range: Overlap within 2.3V ~ 3.6V envelope — power supply compatibility
Clock Frequency: 104 MHz or higher — performance equivalence
Operating Temperature Range: Support for -40°C minimum and 105°C maximum — thermal envelope coverage
Compliance: ROHS3 compliance — regulatory alignment

The AT25DF256-XMHN-T meets these substitution criteria as an active product with identical memory capacity, package footprint, and core interface specifications.

Parameter Comparison

Parameter	IS25LQ025B-JDLE	AT25DF256-XMHN-T
Manufacturer	ISSI	Renesas Electronics Corporation
Product Status	Obsolete	Active
Memory Size	256Kbit	256Kbit
Memory Organization	32K x 8	32K x 8
Memory Interface	SPI - Quad I/O	SPI
Clock Frequency	104 MHz	104 MHz
Write Cycle Time	800µs (Page)	2.5ms (Page)
Voltage Supply Range	2.3V ~ 3.6V	1.65V ~ 3.6V
Operating Temperature	-40°C ~ 105°C (TA)	-40°C ~ 85°C (TC)
Package Type	8-TSSOP	8-TSSOP
RoHS Status	ROHS3 Compliant	ROHS3 Compliant
Moisture Sensitivity Level	3 (168 Hours)	1 (Unlimited)

Engineering Selection Recommendations

The AT25DF256-XMHN-T is a qualified substitute for the obsolete IS25LQ025B-JDLE based on matching memory capacity, identical package footprint, and equivalent clock frequency performance.

Key Considerations:

Product Status: The AT25DF256-XMHN-T is an active product with established supply chain availability, addressing the obsolescence status of the original part.
Compliance: Both parts maintain ROHS3 compliance and identical HTSUS classification, ensuring regulatory continuity.
Interface Compatibility: The AT25DF256-XMHN-T supports SPI interface. Applications requiring Quad I/O functionality should verify firmware or driver compatibility with single-channel SPI operation.
Voltage Supply: The AT25DF256-XMHN-T supports a wider lower voltage range (1.65V minimum vs. 2.3V), providing additional design flexibility.
Operating Temperature: The AT25DF256-XMHN-T maximum operating temperature is 85°C (TC) versus 105°C (TA) for the original part. Applications requiring operation above 85°C require thermal design review.
Moisture Sensitivity: The AT25DF256-XMHN-T has superior moisture handling (MSL 1 vs. MSL 3), reducing storage and handling constraints.

Frequently Asked Questions (FAQ)

Q: Can the AT25DF256-XMHN-T directly replace the IS25LQ025B-JDLE in existing designs?

A: The AT25DF256-XMHN-T is pin-compatible and functionally equivalent for SPI interface applications. Designs utilizing Quad I/O mode require verification that the substitute part's single-channel SPI operation meets performance requirements. Package footprint and pinout are identical, enabling direct PCB substitution.

Q: What is the difference between SPI and SPI - Quad I/O interfaces?

A: SPI - Quad I/O uses four data lines for simultaneous data transfer, increasing throughput. Standard SPI uses a single data line. The AT25DF256-XMHN-T operates in SPI mode; applications requiring Quad I/O performance should evaluate whether single-channel operation is acceptable.

Q: Are there thermal considerations when substituting these parts?

A: The AT25DF256-XMHN-T has a maximum operating temperature of 85°C (TC), compared to 105°C (TA) for the original part. Applications operating near or above 85°C require thermal analysis to confirm the substitute part remains within safe operating limits.

Q: What is the significance of Moisture Sensitivity Level (MSL) differences?

A: The AT25DF256-XMHN-T has MSL 1 (unlimited shelf life), while the original part has MSL 3 (168-hour limit after moisture exposure). The substitute part offers superior storage flexibility and reduced handling constraints during manufacturing and assembly.

Q: Are both parts RoHS compliant?

A: Yes, both the IS25LQ025B-JDLE and AT25DF256-XMHN-T are ROHS3 compliant, ensuring regulatory alignment for applications subject to RoHS requirements.

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