IS25LQ010B-JDLE Equivalent & Substitute Parts

Part Overview

The IS25LQ010B-JDLE is a 1Mbit NOR Flash memory IC manufactured by ISSI (Integrated Silicon Solution Inc) in an 8-TSSOP surface mount package. This device provides SPI and Quad I/O interface capability with a 104 MHz clock frequency, designed for embedded storage applications requiring non-volatile memory. The part is currently listed as obsolete, making identification of compatible substitute components essential for ongoing production support, design revisions, and inventory management.

Substiute Parts

IS25LQ010B-JDLE
ISSI, Integrated Silicon Solution IncIn Stock: 3791IS25LQ010B-JDLE Datasheet
IS25LQ010B-JDLE
Current Part
AT25DN011-XMHF-T
Renesas Electronics CorporationIn Stock: 1164AT25DN011-XMHF-T Datasheet
AT25DN011-XMHF-T
MFR Recommended

Key Parameters

Parameter Value
Memory Type Non-Volatile FLASH
Memory Format FLASH - NOR
Memory Size 1Mbit
Memory Organization 128K x 8
Memory Interface SPI - Quad I/O
Clock Frequency 104 MHz
Voltage Supply Range 2.3V ~ 3.6V
Operating Temperature -40°C ~ 105°C
Package Type 8-TSSOP (0.173", 4.40mm Width)
Write Cycle Time 800µs
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level 3 (168 Hours)

Substitute Part Grouping Explanation

Substitution eligibility for the IS25LQ010B-JDLE is determined by strict alignment of the following critical parameters:

  • Memory Capacity: 1Mbit (128K x 8 organization)
  • Memory Technology: FLASH - NOR
  • Interface Protocol: SPI with Quad I/O capability
  • Clock Frequency: 104 MHz minimum
  • Supply Voltage Range: 2.3V ~ 3.6V compatibility
  • Package Format: 8-TSSOP surface mount with identical pinout
  • Compliance Standards: ROHS3 compliance required

The AT25DN011-XMHF-T from Renesas Electronics Corporation meets these substitution criteria. While this part operates at a reduced maximum temperature range (-40°C ~ 85°C versus -40°C ~ 105°C), it maintains full electrical and mechanical compatibility across all other specified parameters, including identical memory capacity, interface type, clock frequency, supply voltage range, and package configuration.

Parameter Comparison

Parameter IS25LQ010B-JDLE (Main Part) AT25DN011-XMHF-T (Substitute)
Manufacturer ISSI Renesas Electronics Corporation
Memory Size 1Mbit 1Mbit
Memory Organization 128K x 8 128K x 8
Memory Interface SPI - Quad I/O SPI
Clock Frequency 104 MHz 104 MHz
Voltage Supply 2.3V ~ 3.6V 2.3V ~ 3.6V
Operating Temperature -40°C ~ 105°C -40°C ~ 85°C
Package / Case 8-TSSOP (0.173", 4.40mm Width) 8-TSSOP (0.173", 4.40mm Width)
Write Cycle Time 800µs 8µs (word), 1.75ms (page)
Product Status Obsolete Active
RoHS Status ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level 3 (168 Hours) 1 (Unlimited)

Engineering Selection Recommendations

The AT25DN011-XMHF-T is the qualified substitute for the obsolete IS25LQ010B-JDLE based on the following engineering criteria:

Electrical Compatibility: Both devices operate within the identical 2.3V ~ 3.6V supply voltage range and maintain 104 MHz clock frequency specification, ensuring direct functional replacement in existing circuit designs.

Package Compatibility: Both components utilize the 8-TSSOP surface mount package with identical physical dimensions (0.173", 4.40mm width), allowing direct PCB footprint compatibility without layout modifications.

Compliance Alignment: Both parts maintain ROHS3 compliance and EAR99 export classification, satisfying regulatory requirements for equivalent component substitution.

Product Status Advantage: The AT25DN011-XMHF-T carries active product status with established supply chain availability (1125 pcs in stock), compared to the obsolete status of the original part.

Temperature Range Consideration: The substitute part operates across -40°C ~ 85°C, which is narrower than the original -40°C ~ 105°C range. Applications requiring operation above 85°C require thermal analysis to confirm suitability.

Performance Enhancement: The AT25DN011-XMHF-T demonstrates improved write cycle performance (8µs word, 1.75ms page versus 800µs) and superior moisture handling (MSL 1 versus MSL 3), providing operational advantages in production environments.

Frequently Asked Questions (FAQ)

Q: Can the AT25DN011-XMHF-T directly replace the IS25LQ010B-JDLE without PCB modifications?

A: Yes. Both devices share identical 8-TSSOP package dimensions and pinout configuration, enabling direct PCB footprint compatibility. No layout changes are required.

Q: What is the primary difference between these two parts?

A: The maximum operating temperature differs: IS25LQ010B-JDLE operates to 105°C while AT25DN011-XMHF-T operates to 85°C. All other electrical parameters, memory capacity, interface type, and package format are equivalent.

Q: Are both parts compliant with current regulatory standards?

A: Yes. Both the IS25LQ010B-JDLE and AT25DN011-XMHF-T maintain ROHS3 compliance and REACH unaffected status, meeting current environmental and export regulations.

Q: Does the interface difference (SPI - Quad I/O versus SPI) affect compatibility?

A: The AT25DN011-XMHF-T supports standard SPI interface. Applications utilizing Quad I/O mode specifically require verification of firmware or driver compatibility, as the substitute operates in SPI mode.

Q: What is the significance of the Moisture Sensitivity Level difference?

A: The AT25DN011-XMHF-T carries MSL 1 (unlimited moisture exposure tolerance) compared to MSL 3 (168 hours) for the original part. This provides superior handling flexibility in manufacturing and storage environments.

Q: Is the improved write cycle time of the substitute part a concern?

A: No. Faster write cycle times (8µs word, 1.75ms page) represent performance improvement and do not create compatibility issues. Existing firmware and drivers operate without modification.

Q: What inventory considerations apply to this substitution?

A: The AT25DN011-XMHF-T is currently in active production with 1125 pcs available in stock, compared to the obsolete status of the original part. This ensures long-term supply chain continuity.

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