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IS25LQ010B-JDLE Equivalent & Substitute Parts
Part Overview
The IS25LQ010B-JDLE is a 1Mbit NOR Flash memory IC manufactured by ISSI (Integrated Silicon Solution Inc) in an 8-TSSOP surface mount package. This device provides SPI and Quad I/O interface capability with a 104 MHz clock frequency, designed for embedded storage applications requiring non-volatile memory. The part is currently listed as obsolete, making identification of compatible substitute components essential for ongoing production support, design revisions, and inventory management.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Memory Type | Non-Volatile FLASH |
| Memory Format | FLASH - NOR |
| Memory Size | 1Mbit |
| Memory Organization | 128K x 8 |
| Memory Interface | SPI - Quad I/O |
| Clock Frequency | 104 MHz |
| Voltage Supply Range | 2.3V ~ 3.6V |
| Operating Temperature | -40°C ~ 105°C |
| Package Type | 8-TSSOP (0.173", 4.40mm Width) |
| Write Cycle Time | 800µs |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level | 3 (168 Hours) |
Substitute Part Grouping Explanation
Substitution eligibility for the IS25LQ010B-JDLE is determined by strict alignment of the following critical parameters:
- Memory Capacity: 1Mbit (128K x 8 organization)
- Memory Technology: FLASH - NOR
- Interface Protocol: SPI with Quad I/O capability
- Clock Frequency: 104 MHz minimum
- Supply Voltage Range: 2.3V ~ 3.6V compatibility
- Package Format: 8-TSSOP surface mount with identical pinout
- Compliance Standards: ROHS3 compliance required
The AT25DN011-XMHF-T from Renesas Electronics Corporation meets these substitution criteria. While this part operates at a reduced maximum temperature range (-40°C ~ 85°C versus -40°C ~ 105°C), it maintains full electrical and mechanical compatibility across all other specified parameters, including identical memory capacity, interface type, clock frequency, supply voltage range, and package configuration.
Parameter Comparison
| Parameter | IS25LQ010B-JDLE (Main Part) | AT25DN011-XMHF-T (Substitute) |
|---|---|---|
| Manufacturer | ISSI | Renesas Electronics Corporation |
| Memory Size | 1Mbit | 1Mbit |
| Memory Organization | 128K x 8 | 128K x 8 |
| Memory Interface | SPI - Quad I/O | SPI |
| Clock Frequency | 104 MHz | 104 MHz |
| Voltage Supply | 2.3V ~ 3.6V | 2.3V ~ 3.6V |
| Operating Temperature | -40°C ~ 105°C | -40°C ~ 85°C |
| Package / Case | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP (0.173", 4.40mm Width) |
| Write Cycle Time | 800µs | 8µs (word), 1.75ms (page) |
| Product Status | Obsolete | Active |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant |
| Moisture Sensitivity Level | 3 (168 Hours) | 1 (Unlimited) |
Engineering Selection Recommendations
The AT25DN011-XMHF-T is the qualified substitute for the obsolete IS25LQ010B-JDLE based on the following engineering criteria:
Electrical Compatibility: Both devices operate within the identical 2.3V ~ 3.6V supply voltage range and maintain 104 MHz clock frequency specification, ensuring direct functional replacement in existing circuit designs.
Package Compatibility: Both components utilize the 8-TSSOP surface mount package with identical physical dimensions (0.173", 4.40mm width), allowing direct PCB footprint compatibility without layout modifications.
Compliance Alignment: Both parts maintain ROHS3 compliance and EAR99 export classification, satisfying regulatory requirements for equivalent component substitution.
Product Status Advantage: The AT25DN011-XMHF-T carries active product status with established supply chain availability (1125 pcs in stock), compared to the obsolete status of the original part.
Temperature Range Consideration: The substitute part operates across -40°C ~ 85°C, which is narrower than the original -40°C ~ 105°C range. Applications requiring operation above 85°C require thermal analysis to confirm suitability.
Performance Enhancement: The AT25DN011-XMHF-T demonstrates improved write cycle performance (8µs word, 1.75ms page versus 800µs) and superior moisture handling (MSL 1 versus MSL 3), providing operational advantages in production environments.
Frequently Asked Questions (FAQ)
Q: Can the AT25DN011-XMHF-T directly replace the IS25LQ010B-JDLE without PCB modifications?
A: Yes. Both devices share identical 8-TSSOP package dimensions and pinout configuration, enabling direct PCB footprint compatibility. No layout changes are required.
Q: What is the primary difference between these two parts?
A: The maximum operating temperature differs: IS25LQ010B-JDLE operates to 105°C while AT25DN011-XMHF-T operates to 85°C. All other electrical parameters, memory capacity, interface type, and package format are equivalent.
Q: Are both parts compliant with current regulatory standards?
A: Yes. Both the IS25LQ010B-JDLE and AT25DN011-XMHF-T maintain ROHS3 compliance and REACH unaffected status, meeting current environmental and export regulations.
Q: Does the interface difference (SPI - Quad I/O versus SPI) affect compatibility?
A: The AT25DN011-XMHF-T supports standard SPI interface. Applications utilizing Quad I/O mode specifically require verification of firmware or driver compatibility, as the substitute operates in SPI mode.
Q: What is the significance of the Moisture Sensitivity Level difference?
A: The AT25DN011-XMHF-T carries MSL 1 (unlimited moisture exposure tolerance) compared to MSL 3 (168 hours) for the original part. This provides superior handling flexibility in manufacturing and storage environments.
Q: Is the improved write cycle time of the substitute part a concern?
A: No. Faster write cycle times (8µs word, 1.75ms page) represent performance improvement and do not create compatibility issues. Existing firmware and drivers operate without modification.
Q: What inventory considerations apply to this substitution?
A: The AT25DN011-XMHF-T is currently in active production with 1125 pcs available in stock, compared to the obsolete status of the original part. This ensures long-term supply chain continuity.
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