IRLS3034PBF N-Channel 40V 195A MOSFET Equivalent & Substitute Parts

Part Overview

The IRLS3034PBF is an N-Channel MOSFET manufactured by Infineon Technologies, rated for 40V drain-to-source voltage with 195A continuous drain current at 25°C. This device is packaged in D2PAK (TO-263-3) surface mount configuration and is designed for high-current switching applications. The part is discontinued at DiGi Electronics, necessitating identification of functionally equivalent alternatives that maintain electrical and mechanical compatibility within the specified parameter ranges.

Substiute Parts

IRLS3034PBF
Infineon TechnologiesIn Stock: 1414IRLS3034PBF Datasheet
IRLS3034PBF
Current Part
BUK661R9-40C,118
Nexperia USA Inc.In Stock: 2390BUK661R9-40C,118 Datasheet
BUK661R9-40C,118
MFR Recommended
CSD18510KTTT
Texas InstrumentsIn Stock: 1490CSD18510KTTT Datasheet
CSD18510KTTT
MFR Recommended
FDB9406-F085
onsemiIn Stock: 2908FDB9406-F085 Datasheet
FDB9406-F085
MFR Recommended
IXTA340N04T4
IXYSIn Stock: 1137IXTA340N04T4 Datasheet
IXTA340N04T4
MFR Recommended
PSMN1R1-40BS,118
Nexperia USA Inc.In Stock: 4735PSMN1R1-40BS,118 Datasheet
PSMN1R1-40BS,118
MFR Recommended
PSMN2R2-40BS,118
Nexperia USA Inc.In Stock: 708PSMN2R2-40BS,118 Datasheet
PSMN2R2-40BS,118
MFR Recommended

Key Parameters

Parameter Value Unit Specification Basis
Drain-to-Source Voltage (Vdss) 40 V Maximum rated voltage
Continuous Drain Current (Id) @ 25°C 195 A (Tc) Maximum continuous current capability
On-State Resistance (Rds On) @ 195A, 10V 1.7 mOhm Conduction loss parameter
Gate Threshold Voltage (Vgs(th)) @ 250µA 2.5 V Gate drive requirement
Power Dissipation (Max) 375 W (Tc) Thermal management limit
Operating Temperature Range -55 to 175 °C (TJ) Junction temperature limits
Package Type D2PAK (TO-263-3) Surface mount, 2 leads + tab
Technology MOSFET (Metal Oxide) Semiconductor type

Substitute Part Grouping Explanation

Substitution eligibility for the IRLS3034PBF is determined by the following criteria:

Mandatory Electrical Parameters:

  • Drain-to-Source Voltage (Vdss): Must equal or exceed 40V
  • Continuous Drain Current (Id): Must support the application's current requirement; parts with lower Id ratings are acceptable if thermal and circuit design accommodate reduced current capacity
  • On-State Resistance (Rds On): Lower values reduce conduction losses; higher values increase heat dissipation
  • Gate Threshold Voltage (Vgs(th)): Must be compatible with available gate drive voltage
  • Operating Temperature Range: Must span -55°C to 175°C (TJ)

Mandatory Mechanical Parameters:

  • Package Type: D2PAK (TO-263-3) surface mount configuration with 2 leads + tab
  • Mounting Type: Surface mount

Compliance & Status:

  • RoHS3 Compliant
  • REACH Unaffected
  • Moisture Sensitivity Level (MSL): 1 (Unlimited) preferred for reliability

The substitute parts listed below meet these criteria with variations in current rating, on-state resistance, and power dissipation that reflect different semiconductor technologies and manufacturing processes.

Parameter Comparison

Part Number Manufacturer Vdss (V) Id @ 25°C (A) Rds On (mOhm) Vgs(th) (V) Power Diss. (W) Package Status
IRLS3034PBF Infineon 40 195 1.7 @ 195A, 10V 2.5 @ 250µA 375 (Tc) D2PAK Discontinued
PSMN1R1-40BS,118 Nexperia USA Inc. 40 120 1.3 @ 25A, 10V 4.0 @ 1mA 306 (Tc) D2PAK Active
BUK661R9-40C,118 Nexperia USA Inc. 40 120 1.9 @ 25A, 10V 2.8 @ 1mA 306 (Tc) D2PAK Obsolete
FDB9406-F085 onsemi 40 110 1.8 @ 80A, 10V 4.0 @ 250µA 176 (Tj) D2PAK Obsolete
IXTA340N04T4 IXYS 40 340 1.7 @ 100A, 10V 4.0 @ 250µA 480 (Tc) D2PAK Last Time Buy
CSD18510KTTT Texas Instruments 40 274 2.6 @ 100A, 10V 2.3 @ 250µA 250 (Ta) TO-263 (DDPAK-3) Active
PSMN2R2-40BS,118 Nexperia USA Inc. 40 100 2.2 @ 25A, 10V 4.0 @ 1mA 306 (Tc) D2PAK Active

Engineering Selection Recommendations

Primary Recommendation for Direct Replacement:

PSMN1R1-40BS,118 (Nexperia USA Inc.) is the preferred substitute when current capacity of 120A is acceptable for the application. This part maintains D2PAK packaging, 40V Vdss rating, and Active product status. The lower on-state resistance (1.3 mOhm vs. 1.7 mOhm) reduces conduction losses. MSL rating of 1 (Unlimited) ensures reliability in moisture-sensitive environments.

Alternative for Higher Current Capacity:

IXTA340N04T4 (IXYS) provides 340A continuous drain current, exceeding the original 195A specification. This part maintains 1.7 mOhm on-state resistance and D2PAK packaging. However, product status is Last Time Buy, indicating limited future availability. Power dissipation rating of 480W (Tc) supports high-current applications.

Alternative for Active Product Status with Thermal Optimization:

CSD18510KTTT (Texas Instruments) is an Active product rated for 274A continuous drain current. Package variant is TO-263 (DDPAK-3) with 3 leads + tab, providing improved thermal performance compared to standard D2PAK. Gate threshold voltage of 2.3V @ 250µA closely matches the original part. MSL rating of 2 (1 Year) requires moisture control during storage and assembly.

Lower Current Alternative:

PSMN2R2-40BS,118 (Nexperia USA Inc.) is suitable for applications where 100A continuous drain current is sufficient. This Active product maintains D2PAK packaging and 40V Vdss. On-state resistance of 2.2 mOhm is higher than the original, resulting in increased conduction losses.

Compliance Basis:

All recommended substitutes are RoHS3 Compliant and REACH Unaffected, matching the original part's regulatory status. Selection should prioritize Active product status for long-term supply assurance.

Frequently Asked Questions (FAQ)

Q1: Can PSMN1R1-40BS,118 directly replace IRLS3034PBF in all applications?

A: PSMN1R1-40BS,118 maintains electrical compatibility (40V Vdss, D2PAK package, -55°C to 175°C operating range) and is suitable for applications requiring up to 120A continuous drain current. If the original design requires the full 195A capability, this part is not suitable. Verify circuit current requirements before substitution.

Q2: What is the difference between D2PAK and TO-263 (DDPAK-3) packages?

A: D2PAK (TO-263-3) contains 2 leads plus a tab for thermal connection. TO-263 (DDPAK-3) contains 3 leads plus a tab, providing an additional source connection for improved thermal and electrical performance. Both are surface mount packages with similar footprints, but DDPAK-3 offers superior heat dissipation. PCB layout modifications may be required for the additional lead.

Q3: Why do some substitute parts have higher on-state resistance?

A: On-state resistance varies with semiconductor technology, die size, and manufacturing process. Higher Rds On values increase conduction losses and heat generation. Lower values reduce losses but may increase cost. Selection depends on thermal design and efficiency requirements of the application.

Q4: Is CSD18510KTTT compatible with existing PCB layouts designed for D2PAK?

A: CSD18510KTTT uses TO-263 (DDPAK-3) packaging with an additional source lead. While the primary drain and gate connections are compatible, the extra lead requires PCB layout modification. Verify footprint compatibility before design implementation.

Q5: What does "Last Time Buy" product status mean for IXTA340N04T4?

A: Last Time Buy indicates the manufacturer has announced end-of-life production. Limited inventory remains available, but no future manufacturing is planned. This part is suitable for current projects but not recommended for long-term production designs. Transition to Active alternatives such as PSMN1R1-40BS,118 or CSD18510KTTT for sustained supply.

Q6: Are all substitute parts RoHS3 Compliant?

A: Yes. All substitute parts listed meet RoHS3 Compliance and REACH Unaffected requirements, matching the original IRLS3034PBF regulatory status.

Q7: What is the significance of Moisture Sensitivity Level (MSL) ratings?

A: MSL 1 (Unlimited) indicates the part tolerates unlimited time at room temperature without moisture absorption concerns. MSL 2 (1 Year) requires moisture control; parts must be stored in dry conditions and used within one year of packaging opening. CSD18510KTTT carries MSL 2, requiring stricter handling protocols compared to MSL 1 alternatives.

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