IRLR6225PBF N-Channel MOSFET 20V 100A Equivalent & Substitute Parts

Part Overview

The IRLR6225PBF is an N-Channel MOSFET manufactured by Infineon Technologies, designed for surface mount applications in the DPAK package. This device features a 20V drain-to-source voltage rating with 100A continuous drain current capability and 63W power dissipation at case temperature. The part is classified as discontinued at DiGi Electronics, making equivalent and substitute parts necessary for ongoing design support and procurement.

Substiute Parts

IRLR6225PBF

Infineon TechnologiesIn Stock: 1364IRLR6225PBF Datasheet

Current PartRFQ

AOD424

Alpha & Omega Semiconductor Inc.In Stock: 17708AOD424 Datasheet

MFR RecommendedRFQ

PH2925U,115

Nexperia USA Inc.In Stock: 4966PH2925U,115 Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the IRLR6225PBF is determined by the following critical parameters:

Primary Substitution Criteria:

• FET Type: N-Channel topology
• Drain to Source Voltage (Vdss): Minimum 20V rating
• Continuous Drain Current (Id): Minimum 100A at case temperature
• Package Compatibility: Surface mount with compatible thermal and electrical characteristics
• On-Resistance (Rds On): Maximum 4.4 mOhm to maintain electrical performance
• Operating Temperature Range: Minimum -50°C to 150°C overlap
• Regulatory Compliance: ROHS3 and REACH status alignment

The substitute parts identified meet these criteria with the following considerations:

AOD424 (Alpha & Omega Semiconductor Inc.): Shares identical Vdss (20V) and package footprint (TO-252 DPAK). Continuous drain current is 45A at case temperature, which is below the 100A specification of the main part. This part is suitable only for applications with reduced current requirements.

PH2925U,115 (Nexperia USA Inc.): Exceeds Vdss specification at 25V and maintains 100A continuous drain current at case temperature. Package is LFPAK56 (Power-SO8), which differs from DPAK. This part provides superior voltage margin and equivalent current handling with different thermal and mechanical characteristics.

Parameter Comparison

Engineering Selection Recommendations

For Direct Replacement (Identical Electrical Performance):

PH2925U,115 is the preferred substitute when the application circuit can accommodate a package change from DPAK to LFPAK56. This part maintains 100A continuous drain current, delivers superior on-resistance (3 mOhm vs. 4 mOhm), and provides higher voltage margin (25V vs. 20V). The part is in active production status with established supply chain availability. ROHS3 and REACH compliance are maintained. Thermal performance is equivalent at 62.5W power dissipation.

For Package-Constrained Applications:

AOD424 maintains the TO-252 DPAK package footprint and is electrically compatible at the 20V Vdss level. However, the 45A continuous drain current specification is 55% below the IRLR6225PBF rating. This part is suitable only for circuit designs where the actual operating current does not exceed 45A at case temperature. The part is in active production with high inventory availability (17,638 pieces).

Regulatory and Compliance Alignment:

All substitute parts maintain ROHS3 compliance and REACH unaffected status, matching the original part's regulatory posture. Moisture sensitivity level (MSL 1, Unlimited) is consistent across all options.

Frequently Asked Questions (FAQ)

Q: Can AOD424 be used as a direct replacement for IRLR6225PBF?

A: AOD424 shares the same package (TO-252 DPAK) and voltage rating (20V Vdss). However, the continuous drain current is 45A versus 100A. Use AOD424 only if your application current requirement does not exceed 45A at case temperature. For applications requiring the full 100A capability, AOD424 is not suitable.

Q: What are the advantages of PH2925U,115 over the original IRLR6225PBF?

A: PH2925U,115 offers three key advantages: (1) higher Vdss rating (25V vs. 20V), providing additional voltage margin; (2) lower on-resistance (3 mOhm vs. 4 mOhm), reducing conduction losses; (3) active production status with established supply availability. The trade-off is a different package (LFPAK56 vs. DPAK), requiring PCB layout modification.

Q: Is the LFPAK56 package compatible with DPAK footprints?

A: No. LFPAK56 (Power-SO8) and DPAK (TO-252-3) are mechanically and electrically different packages. PCB redesign is required to accommodate PH2925U,115. Verify thermal pad dimensions and lead spacing before layout conversion.

Q: Are all substitute parts available in the same packaging format (Tape & Reel)?

A: AOD424 and PH2925U,115 are both supplied in Tape & Reel (TR) format. Verify packaging specifications with your supplier for specific order quantities and reel configurations.

Q: What is the impact of switching from IRLR6225PBF to PH2925U,115 on thermal management?

A: Power dissipation is nearly identical (62.5W vs. 63W at case temperature). The LFPAK56 package has different thermal characteristics than DPAK. Verify thermal resistance (θJC) specifications and PCB thermal design for your specific application before implementation.

Q: Are there any gate drive voltage differences between these parts?

A: All three parts accept ±12V or ±10V gate drive voltage. IRLR6225PBF and AOD424 support ±12V maximum. PH2925U,115 supports ±10V maximum. Ensure your gate drive circuit operates within the specified limits for the selected part.

Q: What is the lead time and stock status for each substitute?

A: PH2925U,115 has the highest inventory (4,903 pieces), followed by AOD424 (17,638 pieces). IRLR6225PBF stock is limited (1,337 pieces) due to discontinued status. Contact your distributor for current lead times and allocation policies.