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IRGS8B60KTRLPBF IGBT 600V 28A Equivalent & Substitute Parts
Part Overview
The IRGS8B60KTRLPBF is an NPT (Non-Punch-Through) IGBT manufactured by Infineon Technologies, rated for 600V collector-emitter breakdown voltage and 28A maximum collector current with 167W power dissipation capability. This component is packaged in D2PAK (TO-263-3) surface mount configuration and is classified as obsolete product status. Due to obsolescence, equivalent substitute parts with active product status are necessary to maintain design continuity and ensure long-term supply chain reliability for new production and redesign applications.
Substiute Parts
Key Parameters
| Parameter | Value | Unit |
|---|---|---|
| Voltage - Collector Emitter Breakdown (Max) | 600 | V |
| Current - Collector (Ic) (Max) | 28 | A |
| Current - Collector Pulsed (Icm) | 34 | A |
| Power - Max | 167 | W |
| Vce(on) (Max) @ Vge, Ic | 2.2V @ 15V, 8A | V |
| Gate Charge | 29 | nC |
| Switching Energy (on/off) | 160/160 | µJ |
| Td (on/off) @ 25°C | 23/140 | ns |
| Operating Temperature Range | -55 to 175 | °C (TJ) |
| Package / Case | TO-263-3, D2PAK | - |
| Mounting Type | Surface Mount | - |
| IGBT Type | NPT | - |
Substitute Part Grouping Explanation
Substitution eligibility for the IRGS8B60KTRLPBF is determined by the following critical parameters:
Mandatory Compatibility Criteria:
- Voltage - Collector Emitter Breakdown (Max): 600V minimum
- Package / Case: TO-263-3 D2PAK surface mount configuration
- Mounting Type: Surface Mount
- Current - Collector (Ic) (Max): Equal to or greater than 28A
- Operating Temperature Range: Must support -55°C to 175°C or equivalent industrial range
Performance Alignment Parameters:
- Vce(on) (Max): Saturation voltage at rated conditions
- Gate Charge: Switching control characteristics
- Switching Energy: On/off energy dissipation profile
- Power - Max: Thermal dissipation capability
Substitute parts are grouped into two categories based on IGBT technology type and current rating capability:
Category 1 - Trench Technology, 30A Rating: IGB15N60TATMA1, IKB15N60TATMA1 These parts provide equivalent 600V voltage rating with 30A collector current, exceeding the 28A requirement. Both utilize Trench or Trench Field Stop technology with active product status and RoHS3 compliance.
Category 2 - Higher Current Capability: IGB20N60H3ATMA1 This part provides 40A collector current with Trench Field Stop technology, offering increased current headroom for applications requiring higher performance margins.
Category 3 - STMicroelectronics Alternatives: STGB7NC60HDT4, STGB14NC60KDT4, STGB15H60DF These parts meet 600V voltage and D2PAK package requirements with current ratings from 25A to 30A, providing cross-manufacturer substitution options with active product status.
Parameter Comparison
| Parameter | IRGS8B60KTRLPBF (Main) | IGB15N60TATMA1 | IKB15N60TATMA1 | IGB20N60H3ATMA1 | STGB7NC60HDT4 | STGB14NC60KDT4 | STGB15H60DF |
|---|---|---|---|---|---|---|---|
| Manufacturer | Infineon | Infineon | Infineon | Infineon | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Voltage - Collector Emitter Breakdown (Max) | 600V | 600V | 600V | 600V | 600V | 600V | 600V |
| Current - Collector (Ic) (Max) | 28A | 30A | 30A | 40A | 25A | 25A | 30A |
| Current - Collector Pulsed (Icm) | 34A | 45A | 45A | 80A | 50A | 50A | 60A |
| Power - Max | 167W | 130W | 130W | 170W | 80W | 80W | 115W |
| Vce(on) (Max) @ Vge, Ic | 2.2V @ 15V, 8A | 2.05V @ 15V, 15A | 2.05V @ 15V, 15A | 2.4V @ 15V, 20A | 2.5V @ 15V, 7A | 2.5V @ 15V, 7A | 2.0V @ 15V, 15A |
| Gate Charge | 29nC | 87nC | 87nC | 120nC | 35nC | 34.4nC | 81nC |
| Switching Energy (on/off) | 160/160µJ | 570µJ | 570µJ | 690µJ | 95/115µJ | 82/155µJ | 136/207µJ |
| Td (on/off) @ 25°C | 23/140ns | 17/188ns | 17/188ns | 16/194ns | 18.5/72ns | 22.5/116ns | 24.5/118ns |
| Operating Temperature Range | -55 to 175°C | -40 to 175°C | -40 to 175°C | -40 to 175°C | -55 to 150°C | -55 to 150°C | -55 to 175°C |
| Package / Case | TO-263-3, D2PAK | TO-263-3, D2PAK | TO-263-3, D2PAK | TO-263-3, D2PAK | TO-263-3, D2PAK | TO-263-3, D2PAK | TO-263-3, D2PAK |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Product Status | Obsolete | Active | Active | Active | Active | Active | Active |
| RoHS Status | - | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant |
| REACH Status | REACH Unaffected | REACH Unaffected | REACH Unaffected | REACH Unaffected | REACH Unaffected | REACH Unaffected | REACH Unaffected |
Engineering Selection Recommendations
Primary Recommendation - Infineon TrenchStop® Series (IGB15N60TATMA1 or IKB15N60TATMA1):
Both IGB15N60TATMA1 and IKB15N60TATMA1 are direct functional equivalents from Infineon Technologies with active product status. These parts maintain the same manufacturer ecosystem, ensuring consistent design support and long-term availability. Both are RoHS3 compliant and REACH unaffected. The 30A collector current rating exceeds the 28A requirement of the original part. Operating temperature range extends to 175°C, matching the original specification. These parts are suitable for direct PCB layout replacement without modification.
Secondary Recommendation - Higher Current Capability (IGB20N60H3ATMA1):
The IGB20N60H3ATMA1 provides 40A collector current with Trench Field Stop technology, offering increased thermal and electrical margin for demanding applications. This part maintains 600V voltage rating, D2PAK packaging, and active product status with RoHS3 compliance. Maximum power dissipation of 170W exceeds the original 167W specification. This selection is appropriate when application requirements demand higher current headroom or improved thermal performance.
Cross-Manufacturer Alternative (STMicroelectronics STGB Series):
STGB7NC60HDT4 and STGB14NC60KDT4 provide 25A current rating with PowerMESH™ technology, meeting minimum voltage and package requirements. STGB15H60DF offers 30A current rating with Trench Field Stop technology. All three STMicroelectronics options are active products with RoHS3 compliance. These alternatives are suitable when cross-manufacturer qualification is required or when STMicroelectronics supply chain preference exists.
Compliance Considerations:
All recommended substitute parts carry RoHS3 compliance and REACH unaffected status, matching the regulatory profile of the original IRGS8B60KTRLPBF. All parts are classified under ECCN EAR99 and HTSUS 8541.29.0095, maintaining consistent export and tariff classification.
Frequently Asked Questions (FAQ)
Q: Can IGB15N60TATMA1 or IKB15N60TATMA1 be used as direct replacements for IRGS8B60KTRLPBF without circuit modification?
A: Yes. Both parts share identical 600V voltage rating, D2PAK surface mount packaging, and -55°C to 175°C operating temperature range (IGB15N60TATMA1 and IKB15N60TATMA1 operate to -40°C minimum). The 30A collector current rating exceeds the 28A requirement. PCB layout and gate drive circuitry require no modification. Thermal design should account for the 130W maximum power dissipation versus the original 167W specification.
Q: What is the difference between IGB15N60TATMA1 and IKB15N60TATMA1?
A: Both parts are rated 600V, 30A with identical electrical characteristics at rated test conditions. IKB15N60TATMA1 includes specified reverse recovery time (trr) of 34ns, providing additional switching performance data. Both utilize Trench or Trench Field Stop technology. Selection between these parts depends on application-specific reverse recovery requirements and design margin preferences.
Q: Why does IGB20N60H3ATMA1 have higher gate charge (120nC) compared to the original part (29nC)?
A: Gate charge is determined by IGBT technology type and current rating. IGB20N60H3ATMA1 utilizes Trench Field Stop technology with 40A current rating, resulting in higher gate charge than the NPT technology original part rated at 28A. Higher gate charge requires proportionally increased gate drive current but does not prevent functional substitution. Gate drive circuit design must accommodate the specified gate charge value.
Q: Are STMicroelectronics STGB parts suitable for applications originally designed for Infineon IRGS8B60KTRLPBF?
A: Yes, with design review. STGB7NC60HDT4 and STGB14NC60KDT4 meet 600V voltage and D2PAK package requirements but are rated 25A, below the original 28A specification. These parts are suitable for applications operating below 25A continuous current. STGB15H60DF provides 30A rating and is functionally equivalent. All STMicroelectronics options require gate drive circuit evaluation due to different gate charge specifications (34.4-81nC range).
Q: What is the impact of lower maximum power dissipation in IGB15N60TATMA1 (130W) versus the original IRGS8B60KTRLPBF (167W)?
A: The 130W maximum power rating of IGB15N60TATMA1 reflects thermal design specifications at specified junction temperature and case conditions. Actual power dissipation in application depends on switching frequency, duty cycle, and load current. If application power dissipation is below 130W, no thermal design modification is required. If application approaches or exceeds 130W, thermal management (heatsink, PCB copper area) must be enhanced or IGB20N60H3ATMA1 (170W) selected.
Q: Can multiple substitute parts be used interchangeably in production?
A: Yes, provided each substitute part is individually qualified against application requirements. IGB15N60TATMA1, IKB15N60TATMA1, and IGB20N60H3ATMA1 are functionally interchangeable from Infineon. STMicroelectronics STGB parts require separate gate drive circuit evaluation. Production design should specify primary and approved alternate parts with documented electrical and thermal validation for each option.
Q: What packaging options are available for substitute parts?
A: All substitute parts are supplied in D2PAK (TO-263-3) surface mount package, matching the original IRGS8B60KTRLPBF. Infineon parts are available in Tape & Reel (TR) packaging. STMicroelectronics STGB7NC60HDT4 and STGB14NC60KDT4 are supplied in Cut Tape (CT) & Digi-Reel® format. STGB15H60DF is supplied in Tape & Reel (TR). Packaging format does not affect electrical or thermal performance; selection depends on production volume and assembly process requirements.
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