IRGS4064DPBF IGBT 600V 20A Equivalent & Substitute Parts

Part Overview

The IRGS4064DPBF is an Infineon Technologies IGBT (Insulated Gate Bipolar Transistor) rated for 600V collector-emitter breakdown voltage with 20A maximum collector current and 101W power dissipation. This component features Trench IGBT technology in a D2PAK surface mount package. The part is classified as Obsolete, necessitating identification of functionally equivalent active alternatives for new designs and ongoing production requirements. Substitute parts must maintain electrical compatibility across voltage, current, and thermal operating ranges while conforming to the same mechanical package specifications.

Substiute Parts

IRGS4064DPBF
Infineon TechnologiesIn Stock: 1144IRGS4064DPBF Datasheet
IRGS4064DPBF
Current Part
IKB10N60TATMA1
Infineon TechnologiesIn Stock: 752IKB10N60TATMA1 Datasheet
IKB10N60TATMA1
MFR Recommended
STGB10H60DF
STMicroelectronicsIn Stock: 1349STGB10H60DF Datasheet
STGB10H60DF
MFR Recommended
STGB10NC60KDT4
STMicroelectronicsIn Stock: 47749STGB10NC60KDT4 Datasheet
STGB10NC60KDT4
MFR Recommended

Key Parameters

Parameter Value Unit
Voltage - Collector Emitter Breakdown (Max) 600 V
Current - Collector (Ic) (Max) 20 A
Current - Collector Pulsed (Icm) 40 A
Power - Max 101 W
Vce(on) (Max) @ Vge, Ic 1.91V @ 15V, 10A V
Gate Charge 32 nC
Switching Energy (on/off) 29µJ / 200µJ µJ
Td (on/off) @ 25°C 27ns / 79ns ns
Reverse Recovery Time (trr) 62 ns
Operating Temperature Range -55 to 175 °C (TJ)
Package / Case TO-263-3, D2PAK -
Mounting Type Surface Mount -
Moisture Sensitivity Level (MSL) 1 (Unlimited) -

Substitute Part Grouping Explanation

Substitution eligibility for the IRGS4064DPBF is determined by strict adherence to the following electrical and mechanical criteria:

Primary Compatibility Requirements:

  • Voltage - Collector Emitter Breakdown: 600V (exact match required)
  • Current - Collector (Ic) (Max): 20A (exact match required)
  • Package / Case: TO-263-3, D2PAK (exact match required)
  • Mounting Type: Surface Mount (exact match required)

Secondary Compatibility Parameters:

  • Power dissipation capability must equal or exceed 101W
  • Operating temperature range must encompass -55°C to 175°C or be compatible with application requirements
  • Gate charge, switching energy, and timing parameters must be within acceptable application tolerances
  • Input type must be Standard

The three substitute parts listed below satisfy all primary compatibility requirements and maintain electrical performance within acceptable operating margins for applications originally designed for the IRGS4064DPBF.

Parameter Comparison

Parameter IRGS4064DPBF (Main) IKB10N60TATMA1 STGB10H60DF STGB10NC60KDT4
Manufacturer Infineon Technologies Infineon Technologies STMicroelectronics STMicroelectronics
Voltage - Collector Emitter Breakdown (Max) 600V 600V 600V 600V
Current - Collector (Ic) (Max) 20A 20A 20A 20A
Current - Collector Pulsed (Icm) 40A 30A 40A 30A
Power - Max 101W 110W 115W 65W
Vce(on) (Max) @ Vge, Ic 1.91V @ 15V, 10A 2.05V @ 15V, 10A 1.95V @ 15V, 10A 2.5V @ 15V, 5A
Gate Charge 32nC 62nC 57nC 19nC
Switching Energy (on/off) 29µJ / 200µJ 430µJ 83µJ / 140µJ 55µJ / 85µJ
Td (on/off) @ 25°C 27ns / 79ns 12ns / 215ns 19.5ns / 103ns 17ns / 72ns
Reverse Recovery Time (trr) 62ns 115ns 107ns 22ns
Operating Temperature Range -55 to 175°C (TJ) -40 to 175°C (TJ) -55 to 175°C (TJ) -55 to 150°C (TJ)
Package / Case TO-263-3, D2PAK TO-263-3, D2PAK TO-263-3, D2PAK TO-263-3, D2PAK
Product Status Obsolete Active Active Active
RoHS Status Not specified ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant

Engineering Selection Recommendations

IKB10N60TATMA1 (Infineon Technologies)

This substitute is an active product featuring NPT Trench Field Stop IGBT technology. It maintains the 600V/20A electrical ratings and D2PAK package compatibility. Power dissipation capability of 110W exceeds the original 101W specification. The part is ROHS3 compliant and carries unlimited moisture sensitivity rating. Operating temperature range extends to -40°C minimum, which is 15°C higher than the original part's -55°C specification. This substitute is suitable for applications where the lower temperature limit is not a critical constraint. Gate charge of 62nC and switching energy of 430µJ represent increases from the original specifications and should be evaluated for driver circuit compatibility.

STGB10H60DF (STMicroelectronics)

This substitute is an active product featuring Trench Field Stop IGBT technology. It maintains the 600V/20A electrical ratings and D2PAK package compatibility. Power dissipation capability of 115W exceeds the original 101W specification. The part is ROHS3 compliant and carries unlimited moisture sensitivity rating. Operating temperature range of -55°C to 175°C matches the original part exactly. Vce(on) of 1.95V is closely aligned with the original 1.91V specification. Switching energy parameters of 83µJ (on) and 140µJ (off) are lower than the original part, indicating improved switching performance. This substitute demonstrates the closest overall electrical alignment with the IRGS4064DPBF.

STGB10NC60KDT4 (STMicroelectronics)

This substitute is an active product featuring PowerMESH™ IGBT technology. It maintains the 600V/20A electrical ratings and D2PAK package compatibility. The part is ROHS3 compliant and carries unlimited moisture sensitivity rating. Operating temperature range extends to -55°C to 150°C, which is 25°C lower than the original part's maximum junction temperature. Power dissipation capability of 65W is significantly lower than the original 101W specification. Gate charge of 19nC and switching energy parameters of 55µJ (on) and 85µJ (off) are substantially lower than the original part, indicating faster switching characteristics. This substitute is suitable for applications with reduced thermal requirements and where lower switching losses are beneficial.

Frequently Asked Questions (FAQ)

Q: Can the IKB10N60TATMA1 be used in applications requiring operation below -40°C?

A: No. The IKB10N60TATMA1 specifies a minimum operating temperature of -40°C (TJ), whereas the original IRGS4064DPBF operates to -55°C. Applications requiring operation below -40°C must use STGB10H60DF or STGB10NC60KDT4.

Q: What is the significance of the gate charge differences between substitute parts?

A: Gate charge directly affects driver circuit requirements. The original IRGS4064DPBF has 32nC gate charge. IKB10N60TATMA1 (62nC) and STGB10H60DF (57nC) require higher gate charge, potentially necessitating driver circuit evaluation. STGB10NC60KDT4 (19nC) requires lower gate charge, which may improve driver efficiency.

Q: Are all substitute parts mechanically compatible with the original D2PAK footprint?

A: Yes. All three substitute parts use TO-263-3 D2PAK package specifications, ensuring mechanical and thermal interface compatibility with existing PCB designs.

Q: Which substitute part offers the best thermal performance?

A: STGB10H60DF provides 115W power dissipation capability, the highest among all options. However, STGB10NC60KDT4 is rated for only 65W, which may be limiting in high-power applications.

Q: Are all substitute parts RoHS compliant?

A: Yes. All three substitute parts are ROHS3 compliant, meeting current environmental and regulatory requirements.

Q: What is the impact of switching energy differences on circuit performance?

A: Lower switching energy reduces power losses during switching transitions. STGB10NC60KDT4 exhibits the lowest switching energy (55µJ on, 85µJ off), while IKB10N60TATMA1 exhibits the highest (430µJ). Applications sensitive to switching losses should prioritize STGB10H60DF or STGB10NC60KDT4.

Q: Can STGB10NC60KDT4 be used as a direct replacement in all applications?

A: No. The 65W power dissipation rating is significantly lower than the original 101W specification. Applications requiring sustained power dissipation above 65W must use IKB10N60TATMA1 or STGB10H60DF.

Q: What packaging format is available for high-volume procurement?

A: IKB10N60TATMA1 is supplied in Tape & Reel (TR) format. STGB10H60DF and STGB10NC60KDT4 are supplied in Cut Tape (CT) & Digi-Reel® format. Packaging selection should align with assembly process requirements.

Request Quote (Ships tomorrow)