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IRGS15B60KDPBF Equivalent & Substitute Parts
Part Overview
The IRGS15B60KDPBF is an NPT IGBT rated for 600V collector-emitter breakdown voltage with 31A maximum collector current and 208W power dissipation in a D2PAK surface mount package. Manufactured by Infineon Technologies, this component is classified as obsolete product status. Due to its obsolete designation, equivalent and substitute parts from active product lines are necessary for new designs and ongoing production requirements. Substitute parts maintain compatibility through identical or functionally equivalent electrical ratings and the same D2PAK (TO-263-3) mechanical package.
Substiute Parts
Key Parameters
| Parameter | Value | Unit |
|---|---|---|
| Voltage - Collector Emitter Breakdown (Max) | 600 | V |
| Current - Collector (Ic) (Max) | 31 | A |
| Current - Collector Pulsed (Icm) | 62 | A |
| Power - Max | 208 | W |
| Vce(on) (Max) @ Vge, Ic | 2.2V @ 15V, 15A | V |
| Gate Charge | 56 | nC |
| Operating Temperature Range | -55 to 150 | °C |
| Package / Case | TO-263-3, D2PAK | - |
| Mounting Type | Surface Mount | - |
Substitute Part Grouping Explanation
Substitution eligibility for the IRGS15B60KDPBF is determined by the following criteria:
Primary Electrical Parameters:
- Voltage - Collector Emitter Breakdown: 600V (exact match required)
- Current - Collector (Ic) (Max): 30A minimum (IRGS15B60KDPBF rated 31A)
- Package / Case: TO-263-3, D2PAK (mechanical compatibility required)
- Mounting Type: Surface Mount (identical)
Secondary Compatibility Factors:
- Input Type: Standard (all candidates match)
- Moisture Sensitivity Level: 1 (Unlimited) (all candidates match)
- REACH Status: REACH Unaffected (all candidates match)
The substitute parts listed below satisfy these criteria and are classified as active products, ensuring long-term availability and support compared to the obsolete IRGS15B60KDPBF.
Parameter Comparison
| Parameter | IRGS15B60KDPBF | IKB15N60TATMA1 | STGB19NC60KDT4 | STGB14NC60KDT4 | STGB15H60DF | STGB19NC60HDT4 |
|---|---|---|---|---|---|---|
| Manufacturer | Infineon | Infineon | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Voltage - Collector Emitter Breakdown (Max) | 600V | 600V | 600V | 600V | 600V | 600V |
| Current - Collector (Ic) (Max) | 31A | 30A | 35A | 25A | 30A | 40A |
| Current - Collector Pulsed (Icm) | 62A | 45A | 75A | 50A | 60A | 60A |
| Power - Max | 208W | 130W | 125W | 80W | 115W | 130W |
| Vce(on) (Max) @ Vge, Ic | 2.2V @ 15V, 15A | 2.05V @ 15V, 15A | 2.75V @ 15V, 12A | 2.5V @ 15V, 7A | 2V @ 15V, 15A | 2.5V @ 15V, 12A |
| Gate Charge | 56nC | 87nC | 55nC | 34.4nC | 81nC | 53nC |
| Td (on/off) @ 25°C | 34ns/184ns | 17ns/188ns | 30ns/105ns | 22.5ns/116ns | 24.5ns/118ns | 25ns/97ns |
| Operating Temperature Range | -55 to 150°C | -40 to 175°C | -55 to 150°C | -55 to 150°C | -55 to 175°C | -55 to 150°C |
| Package / Case | TO-263-3, D2PAK | TO-263-3, D2PAK | TO-263-3, D2PAK | TO-263-3, D2PAK | TO-263-3, D2PAK | TO-263-3, D2PAK |
| Product Status | Obsolete | Active | Active | Active | Active | Active |
| RoHS Status | - | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant |
Engineering Selection Recommendations
Primary Substitutes (Highest Compatibility):
IKB15N60TATMA1 (Infineon Technologies, Active Status): This Trench Field Stop IGBT maintains the same manufacturer lineage as the IRGS15B60KDPBF. It delivers 30A continuous current against the original 31A specification, with superior on-state voltage (2.05V vs. 2.2V) and faster switching times (17ns turn-on vs. 34ns). Operating temperature range extends to 175°C. ROHS3 compliance and active product status ensure long-term availability. Suitable for applications where the 1A current reduction is acceptable and improved thermal performance is beneficial.
STGB15H60DF (STMicroelectronics, Active Status): This Trench Field Stop IGBT from the STMicroelectronics portfolio provides 30A continuous current with the lowest on-state voltage (2V @ 15V, 15A) among all substitutes. Operating temperature range extends to 175°C. ROHS3 compliance and active product status provide supply security. Recommended for designs prioritizing reduced conduction losses and extended temperature operation.
Secondary Substitutes (Current-Dependent Applications):
STGB19NC60HDT4 (STMicroelectronics, Active Status): This PowerMESH™ IGBT offers 40A continuous current, exceeding the original 31A specification. Suitable for applications requiring higher current capacity or thermal margin. ROHS3 compliant with active status.
STGB19NC60KDT4 (STMicroelectronics, Active Status): This PowerMESH™ IGBT provides 35A continuous current with fast switching characteristics (30ns turn-on, 105ns turn-off). ROHS3 compliant with active status. Applicable where moderate current increase and improved switching performance are advantageous.
STGB14NC60KDT4 (STMicroelectronics, Active Status): This PowerMESH™ IGBT delivers 25A continuous current, below the original specification. Suitable only for applications where the original design includes current margin or where reduced power dissipation is prioritized. ROHS3 compliant with active status.
All substitute parts maintain identical D2PAK mechanical packaging, surface mount mounting type, and 600V voltage rating. Selection should be based on specific application current requirements, thermal constraints, and switching frequency demands.
Frequently Asked Questions (FAQ)
Q1: Can IKB15N60TATMA1 directly replace IRGS15B60KDPBF in existing designs?
A: IKB15N60TATMA1 is mechanically and electrically compatible for most applications. The 1A reduction in continuous current (30A vs. 31A) is typically acceptable in designs with thermal margin. The improved on-state voltage (2.05V vs. 2.2V) reduces conduction losses. Verify that your application does not operate at the absolute maximum 31A continuous current specification. Both parts use identical D2PAK packaging and standard input gate drive.
Q2: What is the primary difference between NPT and Trench Field Stop IGBT types?
A: The IRGS15B60KDPBF uses NPT (Non-Punch-Through) technology, while IKB15N60TATMA1 and STGB15H60DF use Trench Field Stop technology. Trench Field Stop IGBTs typically exhibit lower on-state voltage and faster switching times, reducing both conduction and switching losses. This results in lower overall power dissipation and improved thermal performance in the same package.
Q3: Why do some substitutes have lower power ratings despite similar current ratings?
A: Power rating is calculated from on-state voltage and current: P = Vce(on) × Ic. STGB14NC60KDT4 has lower power (80W) because it is rated at lower test current (7A vs. 15A). IKB15N60TATMA1 has lower power (130W) due to lower maximum continuous current (30A vs. 31A). Always verify power dissipation calculations for your specific operating point rather than relying solely on maximum power rating.
Q4: Are all substitute parts ROHS3 compliant?
A: Yes. All active substitute parts listed (IKB15N60TATMA1, STGB19NC60KDT4, STGB14NC60KDT4, STGB15H60DF, STGB19NC60HDT4) are ROHS3 compliant. The original IRGS15B60KDPBF does not specify RoHS status. For new designs and production, ROHS3-compliant substitutes are required for regulatory compliance in most markets.
Q5: What is the impact of different gate charge values on circuit design?
A: Gate charge (Qg) affects gate drive circuit design and switching speed. IRGS15B60KDPBF has 56nC gate charge. Substitutes range from 34.4nC (STGB14NC60KDT4) to 87nC (IKB15N60TATMA1). Lower gate charge reduces gate drive power requirements and enables faster switching. Higher gate charge may require stronger gate drive but can improve noise immunity. Verify that your gate drive circuit can supply the required gate current for the selected substitute.
Q6: Can STGB19NC60HDT4 (40A) be used in place of IRGS15B60KDPBF (31A)?
A: Yes, STGB19NC60HDT4 is mechanically and electrically compatible. The higher current rating (40A vs. 31A) provides additional thermal margin and allows operation at higher current levels if needed. However, verify that your PCB thermal design and gate drive circuit are suitable for the higher current device. The higher current rating does not automatically improve performance; it simply provides additional capacity.
Q7: What packaging considerations apply to D2PAK substitution?
A: All substitute parts use TO-263-3 (D2PAK) packaging with identical pin configuration: Gate (pin 1), Collector/Tab (pin 2), and Emitter (pin 3). PCB footprints are directly compatible. Thermal interface requirements (heatsink mounting) are identical. No PCB redesign is required for mechanical substitution.
Q8: Why is IRGS15B60KDPBF classified as obsolete?
A: Obsolete status indicates that Infineon Technologies has discontinued this product line. Existing inventory may be available from authorized distributors, but long-term supply cannot be guaranteed. Active substitute parts from Infineon (IKB15N60TATMA1) and STMicroelectronics (STGB series) ensure continued availability for new designs and production continuity.
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