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IRGP4750DPBF IGBT 650V TO-247 Equivalent & Substitute Parts
Part Overview
The IRGP4750DPBF is a 650V, 70A IGBT manufactured by Infineon Technologies in TO-247-3 package configuration. This device is classified as Obsolete product status, necessitating identification of functionally equivalent substitute components for ongoing system support and new procurement requirements. The part operates across a junction temperature range of -40°C to 175°C and delivers maximum power dissipation of 273W, making it suitable for industrial switching applications requiring high voltage and moderate current handling.
Substiute Parts
Key Parameters
| Parameter | Value | Unit |
|---|---|---|
| Voltage - Collector Emitter Breakdown (Max) | 650 | V |
| Current - Collector (Ic) (Max) | 70 | A |
| Current - Collector Pulsed (Icm) | 105 | A |
| Vce(on) (Max) @ Vge, Ic | 2V @ 15V, 35A | V |
| Power - Max | 273 | W |
| Gate Charge | 105 | nC |
| Td (on/off) @ 25°C | 50/105 | ns |
| Operating Temperature Range | -40 to 175 | °C (TJ) |
| Mounting Type | Through Hole | - |
| Package / Case | TO-247-3 | - |
Substitute Part Grouping Explanation
Substitution of the IRGP4750DPBF is determined by alignment of critical electrical and mechanical parameters within acceptable tolerances for the target application. The primary substitution candidate is the IKW50N60DTPXKSA1, which shares the following compatibility criteria:
Voltage Rating Compatibility: The substitute operates at 600V maximum collector-emitter breakdown voltage, which is 50V lower than the original 650V specification. This represents a 7.7% reduction in voltage margin and is acceptable for applications operating below 600V system voltage.
Current Handling: The substitute provides 80A maximum collector current, exceeding the original 70A specification by 14.3%, with pulsed current capability of 150A versus 105A original specification.
Package Compatibility: Both devices utilize TO-247-3 through-hole package configuration, ensuring mechanical and thermal interface compatibility.
Operating Temperature: Both devices maintain identical -40°C to 175°C junction temperature operating range.
IGBT Type Difference: The substitute employs Trench Field Stop technology versus the original standard IGBT architecture, resulting in different switching energy and gate charge characteristics.
Parameter Comparison
| Parameter | IRGP4750DPBF (Original) | IKW50N60DTPXKSA1 (Substitute) | Unit |
|---|---|---|---|
| Manufacturer | Infineon Technologies | Infineon Technologies | - |
| Category | Transistors, IGBTs | Transistors, IGBTs | - |
| Voltage - Collector Emitter Breakdown (Max) | 650 | 600 | V |
| Current - Collector (Ic) (Max) | 70 | 80 | A |
| Current - Collector Pulsed (Icm) | 105 | 150 | A |
| Vce(on) (Max) @ Vge, Ic | 2V @ 15V, 35A | 1.8V @ 15V, 50A | V |
| Power - Max | 273 | 319.2 | W |
| Gate Charge | 105 | 249 | nC |
| Td (on/off) @ 25°C | 50/105 | 20/215 | ns |
| Operating Temperature Range | -40 to 175 | -40 to 175 | °C (TJ) |
| Mounting Type | Through Hole | Through Hole | - |
| Package / Case | TO-247-3 | TO-247-3 | - |
| Product Status | Obsolete | Not For New Designs | - |
| REACH Status | REACH Unaffected | REACH Unaffected | - |
| ECCN | EAR99 | EAR99 | - |
Engineering Selection Recommendations
Substitution Feasibility: The IKW50N60DTPXKSA1 is a valid substitute for the IRGP4750DPBF in applications where the 600V voltage rating is sufficient for the system design. The 50V reduction in voltage margin must be evaluated against actual operating conditions and safety margins in the target circuit.
Compliance Status: Both components maintain REACH Unaffected and EAR99 ECCN classifications, ensuring regulatory equivalence. The substitute carries RoHS3 compliance certification, whereas the original part status does not specify RoHS compliance.
Product Lifecycle Consideration: The original IRGP4750DPBF is classified as Obsolete, while the substitute IKW50N60DTPXKSA1 is classified as Not For New Designs. Neither component is recommended for new design implementations. For legacy system support requiring component replacement, the substitute provides functional continuity with documented parameter differences.
Thermal and Switching Characteristics: The substitute exhibits lower on-state voltage (1.8V versus 2V at comparable test conditions), reducing conduction losses. However, the substitute demonstrates significantly higher gate charge (249nC versus 105nC) and asymmetric switching delays (20ns on-time versus 50ns, 215ns off-time versus 105ns), which may impact gate driver requirements and circuit timing.
Frequently Asked Questions (FAQ)
Q: Can the IKW50N60DTPXKSA1 directly replace the IRGP4750DPBF in existing designs?
A: Direct mechanical and thermal replacement is possible due to identical TO-247-3 package configuration. Electrical compatibility requires verification that the application operates below 600V system voltage and that gate driver circuitry can accommodate the higher gate charge (249nC) and different switching delay characteristics of the substitute.
Q: What is the significance of the 50V voltage rating difference?
A: The IRGP4750DPBF provides 650V breakdown voltage while the substitute provides 600V. Applications operating at system voltages below 600V are compatible. Applications requiring the full 650V margin must retain the original component or identify alternative substitutes with matching voltage specifications.
Q: How do the switching energy differences affect circuit performance?
A: The substitute exhibits higher switching energy (1.53mJ on-time versus 1.3mJ, 850µJ off-time versus 500µJ). This results in increased switching losses and heat dissipation. Thermal management design must account for the higher power dissipation capability (319.2W versus 273W) and verify that existing heat sink designs remain adequate.
Q: Are there compatibility concerns with existing gate driver circuits?
A: The substitute requires 249nC gate charge versus 105nC for the original part, representing a 137% increase. Gate driver output impedance and current capability must be verified to ensure adequate charge delivery within the specified switching time windows. The asymmetric switching delays (20ns on versus 215ns off) differ significantly from the original (50ns on versus 105ns off) and may require gate driver timing adjustments.
Q: What is the difference between standard IGBT and Trench Field Stop technology?
A: The substitute employs Trench Field Stop (TFS) architecture, which is a different IGBT technology from the standard IGBT in the original part. TFS technology typically provides improved switching performance and lower on-state voltage at the cost of higher gate charge and different switching characteristics. The specific performance trade-offs are reflected in the parameter comparison table.
Q: Is the substitute suitable for new design implementations?
A: No. The substitute is classified as Not For New Designs. For new designs, alternative components with active product status should be identified. The substitute is appropriate only for legacy system support and component replacement in existing applications.
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