IRFU024NPBF N-Channel MOSFET 55V 17A Equivalent & Substitute Parts

Part Overview

The IRFU024NPBF is an N-Channel MOSFET manufactured by Infineon Technologies, classified as a HEXFET® series device. This component features a 55V drain-to-source voltage rating with 17A continuous drain current capability and 45W maximum power dissipation in a through-hole IPAK (TO-251AA) package. The part is currently listed as obsolete, making identification of functionally equivalent substitutes essential for design continuity and procurement planning. Substitute parts must maintain electrical compatibility across critical parameters including voltage rating, current capacity, on-resistance characteristics, and thermal performance while accommodating available packaging and product status options.

Substiute Parts

IRFU024NPBF

Infineon TechnologiesIn Stock: 25113IRFU024NPBF Datasheet

Current PartRFQ

IRFU024NPBFAKLA1

Infineon TechnologiesIn Stock: 8443IRFU024NPBFAKLA1 Datasheet

MFR RecommendedRFQ

PJD11N06A_L2_00001

Panjit International Inc.In Stock: 1040PJD11N06A_L2_00001 Datasheet

MFR RecommendedRFQ

STD12NF06L-1

STMicroelectronicsIn Stock: 17247STD12NF06L-1 Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the IRFU024NPBF is determined by the following critical parameters:

Primary Electrical Compatibility Criteria:

• Drain-to-Source Voltage (Vdss) must equal or exceed 55V
• Continuous Drain Current (Id) must equal or exceed 17A at thermal conditions
• On-Resistance (Rds On) must not exceed 75 mOhm at specified gate voltage
• Gate Threshold Voltage (Vgs(th)) must be compatible with existing drive circuits
• Power Dissipation capability must support thermal requirements

Secondary Compatibility Criteria:

• Operating temperature range must encompass -55°C to 175°C
• RoHS3 compliance and REACH status must match or exceed original specification
• Moisture Sensitivity Level (MSL) must be 1 (Unlimited) or equivalent

Package and Mounting Considerations:

• Through-hole mounting type is required for PCB assembly compatibility
• IPAK (TO-251AA) package form factor is the primary requirement
• Alternative packages may be considered only if mechanical and thermal characteristics are equivalent

The substitute parts listed below satisfy these criteria with documented electrical equivalence and compliance certifications.

Parameter Comparison

Engineering Selection Recommendations

IRFU024NPBFAKLA1 (Infineon Technologies)

This part is the direct manufacturer-recommended substitute for the obsolete IRFU024NPBF. Electrical parameters are identical across all critical specifications: 55V Vdss, 17A continuous drain current, 75 mOhm Rds On, and 45W power dissipation. The device maintains the same IPAK (TO-251AA) through-hole package form factor, ensuring mechanical and thermal compatibility with existing PCB designs. Product status is Active, providing long-term availability and supply chain stability. RoHS3 compliance and MSL 1 rating match the original specification. This substitute requires no circuit modifications and is the preferred selection for direct replacement applications.

STD12NF06L-1 (STMicroelectronics)

This STripFET™ II series device provides functional equivalence with higher voltage rating (60V Vdss) and comparable current handling (12A continuous drain current). The through-hole I-PAK package maintains mechanical compatibility with the original IPAK form factor. On-resistance is 100 mOhm at 6A and 10V, representing a 33% increase compared to the IRFU024NPBF specification. Power dissipation capability is 42.8W, slightly below the original 45W rating. Operating temperature range extends to 175°C, matching the original specification. RoHS3 compliance and MSL 1 rating are maintained. This substitute is suitable for applications where the higher voltage rating provides design margin and where the increased on-resistance does not compromise thermal or efficiency requirements.

PJD11N06A_L2_00001 (Panjit International Inc.)

This device offers 60V Vdss rating with 11A thermal continuous drain current, representing a 35% reduction in current capacity compared to the IRFU024NPBF. On-resistance is 75 mOhm at 6A and 10V, matching the original specification at lower current. The critical limitation is the Surface Mount TO-252 (DPAK) package, which is incompatible with through-hole PCB assembly methods. Power dissipation is 25W at thermal conditions, significantly below the original 45W rating. Operating temperature maximum is 150°C, 25°C below the original specification. This substitute is not recommended for direct replacement due to package incompatibility and reduced thermal capability. Selection of this part requires PCB redesign and thermal re-evaluation.

Frequently Asked Questions (FAQ)

Q: Can IRFU024NPBFAKLA1 be used as a direct replacement for IRFU024NPBF without circuit modifications?

A: Yes. IRFU024NPBFAKLA1 is the manufacturer-recommended substitute with identical electrical specifications and package form factor. No circuit modifications are required. The only difference is product status: IRFU024NPBFAKLA1 is Active, ensuring continued availability.

Q: What is the primary reason for substituting the IRFU024NPBF?

A: The IRFU024NPBF is classified as Obsolete. Substitution is necessary to ensure long-term component availability, supply chain continuity, and compliance with current manufacturing standards. IRFU024NPBFAKLA1 provides identical performance with Active product status.

Q: Can STD12NF06L-1 replace IRFU024NPBF in high-current applications?

A: STD12NF06L-1 has 12A continuous drain current versus 17A for IRFU024NPBF, representing a 29% reduction in current capacity. Substitution is feasible only if circuit design margins accommodate this current limitation. On-resistance is higher (100 mOhm vs. 75 mOhm), resulting in increased conduction losses. Thermal analysis is required to confirm acceptability.

Q: Why is PJD11N06A_L2_00001 not recommended as a substitute?

A: PJD11N06A_L2_00001 uses Surface Mount TO-252 (DPAK) packaging, incompatible with through-hole PCB assembly. Additionally, continuous drain current is 11A (35% below specification), and power dissipation is 25W (44% below specification). PCB redesign and thermal re-evaluation would be required, making this option unsuitable for direct replacement.

Q: Are all substitute parts RoHS3 compliant?

A: Yes. IRFU024NPBFAKLA1, PJD11N06A_L2_00001, and STD12NF06L-1 are all RoHS3 compliant with MSL 1 (Unlimited) moisture sensitivity rating, matching the original IRFU024NPBF specification.

Q: What is the maximum operating temperature for each substitute?

A: IRFU024NPBFAKLA1 and STD12NF06L-1 support -55°C to 175°C junction temperature, matching the original specification. PJD11N06A_L2_00001 is limited to -55°C to 150°C, 25°C below the original maximum.

Q: How do gate threshold voltages differ among the substitutes?

A: IRFU024NPBF and IRFU024NPBFAKLA1 have Vgs(th) of 4V at 250µA. STD12NF06L-1 has 2V, and PJD11N06A_L2_00001 has 2.5V. Lower threshold voltages may require gate drive circuit verification to ensure adequate switching performance with existing driver circuits.

Q: Is packaging compatibility critical for these substitutes?

A: Yes. IRFU024NPBFAKLA1 and STD12NF06L-1 maintain through-hole IPAK/I-PAK form factors compatible with existing PCB designs. PJD11N06A_L2_00001 uses Surface Mount TO-252 packaging, requiring PCB redesign and is not suitable for direct replacement in through-hole applications.