IRFSL4229PBF N-Channel MOSFET 250V 45A Equivalent & Substitute Parts

Part Overview

The IRFSL4229PBF is an N-Channel MOSFET manufactured by Infineon Technologies, rated for 250V drain-to-source voltage and 45A continuous drain current in a Through Hole TO-262 package. This device is classified as Obsolete product status. Due to obsolescence, identifying functionally compatible substitute parts is essential for design continuity, production planning, and long-term component availability assurance.

Substiute Parts

IRFSL4229PBF
Infineon TechnologiesIn Stock: 3159IRFSL4229PBF Datasheet
IRFSL4229PBF
Current Part
IPI200N25N3GAKSA1
Infineon TechnologiesIn Stock: 672IPI200N25N3GAKSA1 Datasheet
IPI200N25N3GAKSA1
MFR Recommended

Key Parameters

Parameter Value Unit
Drain to Source Voltage (Vdss) 250 V
Continuous Drain Current (Id) @ 25°C 45 A (Tc)
On-State Resistance (Rds On Max) @ Id, Vgs 48 mOhm @ 26A, 10V mOhm
Gate Threshold Voltage (Vgs(th) Max) @ Id 5 V @ 250µA
Gate Charge (Qg Max) @ Vgs 110 nC @ 10V
Power Dissipation (Max) 330 W (Tc)
Operating Temperature Range -40 to 175 °C (TJ)
Package Type TO-262-3 Through Hole

Substitute Part Grouping Explanation

Substitution of the IRFSL4229PBF is determined by the following critical electrical and mechanical parameters:

Electrical Compatibility Criteria:

  • Drain-to-Source Voltage (Vdss) must equal or exceed 250V
  • Continuous Drain Current (Id) must meet or exceed 45A at 25°C
  • On-State Resistance (Rds On) characteristics must support equivalent or superior switching performance
  • Gate Threshold Voltage (Vgs(th)) must fall within acceptable control voltage ranges
  • Operating temperature range must encompass -40°C to 175°C minimum

Mechanical Compatibility Criteria:

  • Package type must be TO-262-3 (Through Hole, I2PAK configuration)
  • Pin configuration must maintain identical footprint compatibility
  • Mounting type must remain Through Hole

The substitute part IPI200N25N3GAKSA1 satisfies these criteria through equivalent voltage rating, superior current handling capability, improved on-state resistance characteristics, and identical package configuration.

Parameter Comparison

Parameter IRFSL4229PBF IPI200N25N3GAKSA1 Compatibility Status
Manufacturer Infineon Technologies Infineon Technologies Same Manufacturer
FET Type N-Channel N-Channel Compatible
Technology MOSFET (Metal Oxide) MOSFET (Metal Oxide) Compatible
Drain to Source Voltage (Vdss) 250 V 250 V Equivalent
Continuous Drain Current (Id) @ 25°C 45 A (Tc) 64 A (Tc) Substitute Exceeds Requirement
Rds On (Max) @ Id, Vgs 48 mOhm @ 26A, 10V 20 mOhm @ 64A, 10V Substitute Superior
Gate Threshold Voltage (Vgs(th) Max) @ Id 5 V @ 250µA 4 V @ 270µA Compatible
Gate Charge (Qg Max) @ Vgs 110 nC @ 10V 86 nC @ 10V Substitute Superior
Power Dissipation (Max) 330 W (Tc) 300 W (Tc) Substitute Slightly Lower
Operating Temperature Range -40 to 175 °C (TJ) -55 to 175 °C (TJ) Substitute Exceeds Range
Package Type TO-262-3 TO-262-3 Identical
Mounting Type Through Hole Through Hole Compatible
Product Status Obsolete Obsolete Both Obsolete
REACH Status REACH Unaffected REACH Unaffected Compatible
ECCN EAR99 EAR99 Compatible

Engineering Selection Recommendations

Substitution Feasibility:

The IPI200N25N3GAKSA1 functions as a direct substitute for the IRFSL4229PBF based on the following engineering factors:

  1. Voltage Rating Equivalence: Both devices maintain identical 250V Vdss rating, ensuring circuit voltage compatibility without modification.

  2. Current Capability: The substitute part provides 64A continuous drain current, exceeding the original 45A specification. This provides operational margin and thermal headroom in existing circuit designs.

  3. On-State Resistance Improvement: The substitute exhibits 20 mOhm Rds On compared to 48 mOhm in the original part. This reduction improves switching efficiency and reduces power dissipation during conduction.

  4. Gate Charge Reduction: Lower gate charge (86 nC versus 110 nC) results in faster switching transitions and reduced gate drive power requirements.

  5. Package Compatibility: Identical TO-262-3 Through Hole package ensures mechanical and electrical pin compatibility without PCB redesign.

  6. Temperature Range Extension: The substitute supports -55°C to 175°C operating range, exceeding the original -40°C to 175°C specification.

  7. Regulatory Compliance: Both devices maintain REACH Unaffected status and EAR99 ECCN classification, ensuring equivalent compliance posture.

  8. Manufacturer Continuity: Both parts originate from Infineon Technologies, maintaining design consistency and supply chain reliability.

Substitution Limitation:

Power dissipation rating of the substitute (300W) is marginally lower than the original (330W). In applications operating at maximum thermal limits, thermal analysis is required to confirm adequate margin.

Frequently Asked Questions (FAQ)

Q: Can the IPI200N25N3GAKSA1 be used as a direct replacement for IRFSL4229PBF without circuit modification?

A: Yes. Both devices share identical 250V Vdss rating, TO-262-3 package configuration, and pin assignment. The substitute provides superior electrical characteristics (higher current rating, lower Rds On, lower gate charge) without requiring circuit redesign. Thermal analysis is recommended for applications operating near maximum power dissipation limits.

Q: What are the key electrical advantages of the substitute part?

A: The IPI200N25N3GAKSA1 provides three primary electrical improvements: (1) 64A continuous drain current versus 45A, providing 42% additional current capacity; (2) 20 mOhm on-state resistance versus 48 mOhm, reducing conduction losses by 58%; (3) 86 nC gate charge versus 110 nC, reducing switching losses and gate drive power by 22%.

Q: Are there any thermal considerations when substituting these parts?

A: The substitute part has a maximum power dissipation rating of 300W compared to 330W in the original. For applications operating above 300W, verify that thermal management (heatsinking, airflow) remains adequate. The superior Rds On characteristic of the substitute typically results in lower actual power dissipation during normal operation.

Q: Do both parts have identical package dimensions and pin spacing?

A: Yes. Both devices use the TO-262-3 Long Leads package (I2PAK, TO-262AA designation). Pin spacing, lead length, and mounting hole positions are identical, enabling direct PCB compatibility without layout modification.

Q: What is the operating temperature range difference between these parts?

A: The original IRFSL4229PBF operates from -40°C to 175°C. The substitute IPI200N25N3GAKSA1 extends the lower temperature limit to -55°C, providing 15°C additional cold-temperature capability. Both maintain identical 175°C maximum junction temperature.

Q: Are there any gate drive voltage differences that affect circuit design?

A: Gate threshold voltage (Vgs(th)) differs slightly: 5V for the original versus 4V for the substitute. Both values fall within standard gate drive voltage ranges (±20V to ±30V maximum). Existing gate drive circuits require no modification.

Q: What is the moisture sensitivity level for both parts?

A: Both devices carry MSL 1 (Unlimited) rating, indicating no moisture sensitivity restrictions. Standard handling and storage procedures apply without special desiccant or humidity control requirements.

Q: Are both parts compliant with current regulatory standards?

A: Both devices maintain REACH Unaffected status and EAR99 ECCN classification. Regulatory compliance posture is equivalent between the original and substitute part.

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