IRFR7540TRLPBF N-Channel MOSFET 60V 90A Equivalent & Substitute Parts

Part Overview

The IRFR7540TRLPBF is an N-Channel MOSFET manufactured by Infineon Technologies, rated for 60V drain-to-source voltage and 90A continuous drain current. This device is packaged in TO-252AA (DPAK) surface mount configuration and is designed for high-current switching applications requiring 140W power dissipation capability.

The IRFR7540TRLPBF has been discontinued at DiGi Electronics. Equivalent and substitute parts are available to maintain design continuity and ensure component availability for production and repair applications.

Substiute Parts

IRFR7540TRLPBF
Infineon TechnologiesIn Stock: 832IRFR7540TRLPBF Datasheet
IRFR7540TRLPBF
Current Part
IRFR7540TRPBF
Infineon TechnologiesIn Stock: 3458IRFR7540TRPBF Datasheet
IRFR7540TRPBF
Parametric Equivalent
PSMN7R6-60BS,118
Nexperia USA Inc.In Stock: 8919PSMN7R6-60BS,118 Datasheet
PSMN7R6-60BS,118
MFR Recommended

Key Parameters

Parameter Value Unit
FET Type N-Channel
Drain to Source Voltage (Vdss) 60 V
Current - Continuous Drain (Id) @ 25°C 90 A (Tc)
Rds On (Max) @ Id, Vgs 4.8 mOhm @ 66A, 10V
Power Dissipation (Max) 140 W (Tc)
Operating Temperature Range -55 to 175 °C (TJ)
Mounting Type Surface Mount
Package / Case TO-252-3, DPAK
RoHS Status ROHS3 Compliant

Substitute Part Grouping Explanation

Substitution of the IRFR7540TRLPBF is determined by the following critical parameters:

Electrical Parameters (Must Match or Exceed):

  • Drain to Source Voltage (Vdss): 60V minimum
  • Continuous Drain Current (Id): 90A minimum at 25°C
  • Power Dissipation: 140W minimum
  • Operating Temperature Range: -55°C to 175°C minimum
  • Gate-Source Voltage (Vgs): ±20V maximum

Mechanical Parameters (Must Be Compatible):

  • Mounting Type: Surface Mount
  • Package compatibility with TO-252AA (DPAK) or equivalent footprint

Compliance Parameters:

  • RoHS3 Compliant
  • Moisture Sensitivity Level (MSL): 1 (Unlimited)

Substitute parts are grouped into two categories:

Parametric Equivalent: Parts with identical electrical specifications and compatible packaging, allowing direct substitution without circuit modification.

Manufacturer Recommended Equivalent: Parts with comparable electrical performance and different packaging, requiring mechanical compatibility verification.

Parameter Comparison

Parameter IRFR7540TRLPBF IRFR7540TRPBF PSMN7R6-60BS,118
Manufacturer Infineon Technologies Infineon Technologies Nexperia USA Inc.
FET Type N-Channel N-Channel N-Channel
Vdss 60 V 60 V 60 V
Id @ 25°C 90 A (Tc) 90 A (Tc) 92 A (Tc)
Rds On (Max) 4.8 mOhm @ 66A, 10V 4.8 mOhm @ 66A, 10V 7.8 mOhm @ 25A, 10V
Power Dissipation (Max) 140 W (Tc) 140 W (Tc) 149 W (Tc)
Operating Temperature -55 to 175 °C (TJ) -55 to 175 °C (TJ) -55 to 175 °C (TJ)
Vgs (Max) ±20 V ±20 V ±20 V
Package TO-252-3, DPAK TO-252-3, DPAK TO-263-3, D2PAK
Product Status Discontinued Active Active
RoHS Status ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant

Engineering Selection Recommendations

IRFR7540TRPBF (Parametric Equivalent):

The IRFR7540TRPBF is an active product from Infineon Technologies with identical electrical specifications to the discontinued IRFR7540TRLPBF. Both devices share the same base product number (IRFR7540) and are packaged in TO-252-3 DPAK configuration. The primary difference is packaging format: IRFR7540TRPBF is supplied in Cut Tape (CT) and Digi-Reel format, while the original part was supplied in alternative packaging. This part is ROHS3 compliant and maintains full electrical and thermal compatibility. Direct substitution is supported without circuit or layout modifications.

PSMN7R6-60BS,118 (Manufacturer Recommended Equivalent):

The PSMN7R6-60BS,118 is manufactured by Nexperia USA Inc. and meets the core electrical requirements: 60V Vdss, 92A continuous drain current (exceeding the 90A requirement), and 149W power dissipation (exceeding the 140W requirement). Operating temperature range matches at -55°C to 175°C. This part is ROHS3 compliant.

The PSMN7R6-60BS,118 uses D2PAK (TO-263-3) packaging instead of DPAK (TO-252-3). D2PAK provides larger thermal tab and different pin spacing. Substitution requires verification of printed circuit board layout compatibility and thermal management adequacy. Pin-to-pin compatibility must be confirmed before implementation.

Frequently Asked Questions (FAQ)

Q: Can IRFR7540TRPBF be used as a direct replacement for IRFR7540TRLPBF?

A: Yes. Both parts are manufactured by Infineon Technologies with identical electrical specifications (60V, 90A, 140W) and the same TO-252-3 DPAK package. The difference is packaging format (tape and reel versus alternative format). No circuit or layout modifications are required.

Q: What are the key differences between IRFR7540TRLPBF and PSMN7R6-60BS,118?

A: Both parts meet the 60V voltage rating and exceed the 90A current requirement (PSMN7R6 rated 92A). The primary differences are: (1) Manufacturer—Infineon versus Nexperia; (2) Package—DPAK (TO-252-3) versus D2PAK (TO-263-3); (3) Rds On specification—4.8 mOhm versus 7.8 mOhm at different measurement conditions. The D2PAK package has different pin spacing and thermal tab dimensions.

Q: Is the PSMN7R6-60BS,118 a pin-compatible replacement?

A: No. While both parts are N-Channel MOSFETs with the same voltage and current ratings, the D2PAK package has different pin spacing and thermal tab configuration compared to DPAK. Printed circuit board layout must be verified for compatibility. Pin assignment should be confirmed against device datasheets before substitution.

Q: Are all three parts RoHS3 compliant?

A: Yes. IRFR7540TRLPBF, IRFR7540TRPBF, and PSMN7R6-60BS,118 are all ROHS3 compliant with Moisture Sensitivity Level 1 (Unlimited).

Q: What is the inventory status of these parts?

A: IRFR7540TRLPBF is discontinued. IRFR7540TRPBF has 3443 pieces in stock. PSMN7R6-60BS,118 has 8822 pieces in stock.

Q: Can thermal performance be affected by substituting PSMN7R6-60BS,118?

A: The PSMN7R6-60BS,118 has higher power dissipation rating (149W versus 140W) and different package geometry. D2PAK provides larger thermal tab surface area. Thermal performance depends on printed circuit board copper area, thermal vias, and heatsinking design. Thermal analysis should be performed for applications operating near maximum power dissipation limits.

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