IRFR1010ZPBF N-Channel MOSFET Equivalent & Substitute Parts

Part Overview

The IRFR1010ZPBF is an N-Channel MOSFET manufactured by Infineon Technologies, rated for 55V drain-to-source voltage with 42A continuous drain current at 25°C. This device is housed in a Surface Mount TO-252AA (DPAK) package and is designed for high-efficiency switching applications requiring moderate voltage and current ratings. The part is currently discontinued at DiGi Electronics, making equivalent and substitute parts necessary for ongoing design support and procurement.

Substiute Parts

IRFR1010ZPBF

Infineon TechnologiesIn Stock: 1778IRFR1010ZPBF Datasheet

Current PartRFQ

FDD86540

onsemiIn Stock: 6873FDD86540 Datasheet

DirectRFQ

STD65N55F3

STMicroelectronicsIn Stock: 15179STD65N55F3 Datasheet

MFR RecommendedRFQ

STD70N6F3

STMicroelectronicsIn Stock: 15468STD70N6F3 Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the IRFR1010ZPBF is determined by the following critical parameters:

Voltage Rating Compatibility: Substitute parts must have a Vdss rating equal to or greater than 55V to maintain voltage margin in the application circuit.

Current Rating Compatibility: Substitute parts must support continuous drain current (Id) at or above 42A at 25°C to ensure thermal and electrical performance equivalence.

On-State Resistance (Rds On): Lower Rds On values indicate improved efficiency and reduced power dissipation. Substitute parts with Rds On at or below 7.5 mOhm @ 10V gate drive are preferred to maintain or improve performance.

Package Compatibility: All substitute parts must use the TO-252-3 DPAK (2 Leads + Tab) surface mount package to ensure mechanical and thermal interface compatibility.

Gate Drive Voltage: Substitute parts must operate with standard 10V gate drive voltage to maintain compatibility with existing driver circuits.

Temperature Range: Operating temperature range of -55°C to 175°C is required for industrial and automotive applications.

Parameter Comparison

Engineering Selection Recommendations

Primary Substitute: STD65N55F3

The STD65N55F3 from STMicroelectronics is the recommended primary substitute for the IRFR1010ZPBF. This device maintains the same 55V Vdss rating and exceeds the current requirement with 80A continuous drain current. The STD65N55F3 is currently in active production status, ensuring long-term availability. It operates across the full temperature range of -55°C to 175°C, matching the original part specification. The device carries ROHS3 compliance and is available in high inventory quantities (15,165 pieces). Gate charge is significantly lower at 45 nC, reducing switching losses in high-frequency applications.

Secondary Substitute: FDD86540

The FDD86540 from onsemi is an alternative substitute with a slightly higher 60V Vdss rating and 50A continuous drain current capability at Tc. This device is currently in active production and offers 6,800 pieces in inventory. The lower on-state resistance of 4.1 mOhm at 21.5A provides improved efficiency characteristics. However, the operating temperature range is limited to -55°C to 150°C, which is 25°C lower than the original specification. This device is suitable for applications not requiring the full upper temperature range.

Tertiary Substitute: STD70N6F3

The STD70N6F3 from STMicroelectronics provides a 60V Vdss rating with 70A continuous drain current. This device is currently marked as obsolete, indicating limited future availability. While it maintains the full -55°C to 175°C operating temperature range and ROHS3 compliance, the obsolete status makes it unsuitable for new designs requiring long-term supply assurance. Existing inventory of 15,365 pieces may support short-term requirements only.

Frequently Asked Questions (FAQ)

Q: Can the FDD86540 be used as a direct replacement for the IRFR1010ZPBF?

A: The FDD86540 is mechanically and electrically compatible in the TO-252-3 DPAK package. However, the operating temperature range is limited to -55°C to 150°C compared to the original -55°C to 175°C specification. Applications operating above 150°C junction temperature require the STD65N55F3 instead.

Q: What is the significance of the lower gate charge in the STD65N55F3?

A: Gate charge of 45 nC in the STD65N55F3 compared to 95 nC in the IRFR1010ZPBF results in faster switching transitions and reduced driver power consumption. This is beneficial in high-frequency switching applications but requires verification that existing gate driver circuits can accommodate the faster switching characteristics.

Q: Why is the STD70N6F3 marked as obsolete?

A: The STD70N6F3 is listed with obsolete product status, indicating that STMicroelectronics has discontinued active production and support. While current inventory exists, future availability cannot be guaranteed. New designs should prioritize the STD65N55F3 for long-term supply security.

Q: Are all substitute parts RoHS compliant?

A: All substitute parts listed (FDD86540, STD65N55F3, and STD70N6F3) carry ROHS3 compliance certification, matching the original IRFR1010ZPBF specification.

Q: What is the impact of higher Vdss ratings in substitute parts?

A: Substitute parts with 60V Vdss ratings (FDD86540 and STD70N6F3) provide additional voltage margin compared to the original 55V specification. This improves reliability in applications with voltage transients but does not negatively impact performance in circuits designed for 55V operation.

Q: Can the on-state resistance differences affect circuit performance?

A: On-state resistance variations between substitute parts affect power dissipation and thermal management. The STD65N55F3 with 8.5 mOhm at 32A and FDD86540 with 4.1 mOhm at 21.5A have different Rds On characteristics measured at different current levels. Thermal analysis should be performed for applications with high continuous current operation.

Q: Is the TO-252-3 DPAK package identical across all substitute parts?

A: All substitute parts use the TO-252-3 DPAK (2 Leads + Tab) surface mount package, ensuring mechanical compatibility with existing PCB layouts and thermal management solutions. No package redesign is required for substitution.