IRFP4868PBF N-Channel 300V 70A MOSFET Equivalent & Substitute Parts

Part Overview

The IRFP4868PBF is an N-Channel MOSFET manufactured by Infineon Technologies, rated for 300V drain-to-source voltage and 70A continuous drain current at 25°C. This device features a TO-247AC package configuration and is designed for through-hole mounting applications. The part carries a "Not For New Designs" product status, indicating that Infineon has discontinued active development and support for this component. Identifying qualified substitute parts is necessary to ensure design continuity, maintain supply chain reliability, and support ongoing production requirements for existing applications utilizing this MOSFET.

Key Parameters

Parameter	Value	Unit
Drain-to-Source Voltage (Vdss)	300	V
Continuous Drain Current (Id) @ 25°C	70	A
On-State Resistance (Rds On) @ 42A, 10V	32	mOhm
Gate Threshold Voltage (Vgs(th)) @ 250µA	5	V
Gate Charge (Qg) @ 10V	270	nC
Power Dissipation (Max)	517	W
Operating Temperature Range	-55 to 175	°C
Package Type	TO-247-3
Mounting Type	Through Hole

Substitute Part Grouping Explanation

Substitute parts for the IRFP4868PBF are selected based on the following critical electrical and mechanical parameters:

Primary Substitution Criteria:

Drain-to-Source Voltage (Vdss): Minimum 300V required
Continuous Drain Current (Id): Minimum 70A at 25°C
Gate Drive Voltage: 10V maximum Rds On specification
Package Configuration: Through-hole mounting with compatible pinout
Gate Threshold Voltage (Vgs(th)): 4.5V to 5V range
Operating Temperature: Minimum -55°C to 150°C range

Substitution Logic: Parts are grouped into two categories based on package compatibility and current rating capacity. Category A includes devices with equivalent or superior current ratings (100A to 140A) in standard TO-247 variants, suitable for direct replacement with potential thermal performance improvements. Category B includes devices with matching 70A current ratings in alternative package configurations (ISOPLUS247™, PLUS247™-3, TO-264AA), which require PCB layout modifications but offer enhanced thermal characteristics or gate charge optimization.

Parameter Comparison

Part Number	Manufacturer	Vdss (V)	Id @ 25°C (A)	Rds On (mOhm)	Qg (nC)	Pd Max (W)	Tj Max (°C)	Package	Status
IRFP4868PBF	Infineon	300	70	32 @ 42A	270 @ 10V	517	175	TO-247AC	Not For New Designs
IXFH100N25P	IXYS	250	100	27 @ 50A	185 @ 10V	600	150	TO-247 (IXTH)	Active
IXFH110N25T	IXYS	250	110	24 @ 55A	157 @ 10V	694	150	TO-247AD (IXFH)	Active
IXFK120N30T	IXYS	300	120	24 @ 60A	265 @ 10V	960	150	TO-264AA (IXFK)	Active
IXFK140N30P	IXYS	300	140	24 @ 70A	185 @ 10V	1040	150	TO-264AA (IXFK)	Active
IXFR140N30P	IXYS	300	70	26 @ 70A	185 @ 10V	300	150	ISOPLUS247™	Active
IXFX120N25P	IXYS	250	120	24 @ 60A	185 @ 10V	700	175	PLUS247™-3	Active
IXFX120N30P3	IXYS	300	120	27 @ 60A	150 @ 10V	1130	150	PLUS247™-3	Active
IXFX120N30T	IXYS	300	120	24 @ 60A	265 @ 10V	960	150	PLUS247™-3	Active
IXFX140N30P	IXYS	300	140	24 @ 70A	185 @ 10V	1040	150	PLUS247™-3	Active
IXTH110N25T	IXYS	250	110	24 @ 55A	157 @ 10V	694	150	TO-247 (IXTH)	Active

Engineering Selection Recommendations

Compliance and Certification Status: All substitute parts listed carry ROHS3 compliance, REACH Unaffected status, and EAR99 ECCN classification, matching the regulatory framework of the IRFP4868PBF. All substitute devices are classified as Active products with ongoing manufacturer support, addressing the obsolescence concern of the original part.

Direct Replacement Candidates (Minimal PCB Modification): The IXFR140N30P provides the closest functional match with identical 300V/70A ratings and ISOPLUS247™ package compatibility. This part maintains the same current and voltage specifications while offering improved on-state resistance (26 mOhm vs. 32 mOhm) and reduced gate charge (185 nC vs. 270 nC). The ISOPLUS247™ package shares the same three-pin configuration as TO-247AC, requiring only minor footprint adjustments.

Enhanced Performance Alternatives (Standard TO-247 Variants): The IXFH110N25T and IXTH110N25T both deliver 110A continuous current in standard TO-247 packages with superior gate charge characteristics (157 nC). These devices operate at 250V, which is acceptable for 300V-rated applications with appropriate design margin. The IXFH110N25T (HiPerFET™ Trench technology) provides 24 mOhm on-state resistance, delivering thermal performance improvements over the original part.

High-Current Alternatives (Requires PCB Layout Redesign): The IXFX120N30P3, IXFX120N30T, and IXFX140N30P utilize PLUS247™-3 package variants with enhanced thermal performance. These parts support 120A to 140A continuous current at 300V, enabling significant thermal margin improvements. The IXFX120N30P3 offers the lowest gate charge (150 nC) among 300V options, reducing gate drive circuit complexity.

TO-264AA Package Options (Requires Significant PCB Redesign): The IXFK120N30T and IXFK140N30P provide maximum power dissipation ratings (960W and 1040W respectively) in TO-264AA packages. These devices are suitable for applications requiring substantial thermal headroom but necessitate complete PCB layout redesign due to package footprint differences.

Frequently Asked Questions (FAQ)

Q: Can IXFR140N30P directly replace IRFP4868PBF without PCB modifications?

A: The IXFR140N30P uses the ISOPLUS247™ package, which shares the same three-pin TO-247 pinout configuration. Direct replacement is possible with minimal footprint adjustments. Verify PCB pad spacing and thermal via placement compatibility with the specific ISOPLUS247™ package dimensions before implementation.

Q: What is the voltage derating consideration when using 250V-rated devices in a 300V application?

A: Devices rated for 250V Vdss (such as IXFH100N25P, IXFH110N25T, IXFX120N25P) can be used in 300V applications only when the actual operating voltage remains below 250V with adequate safety margin. Circuit design must ensure peak transient voltages do not exceed the device rating. This approach is acceptable for applications with inherent voltage clamping or snubber networks.

Q: How do gate charge differences affect circuit performance?

A: Gate charge (Qg) directly impacts gate drive circuit design and switching speed. The IRFP4868PBF requires 270 nC at 10V drive voltage. Substitute parts with lower gate charge (such as IXFX120N30P3 at 150 nC) reduce gate drive power dissipation and enable faster switching transitions. Higher gate charge devices require proportionally larger gate drive current capacity but do not prevent substitution if the existing gate driver can supply the required current.

Q: Are PLUS247™-3 and TO-247AC packages mechanically compatible?

A: PLUS247™-3 and TO-247AC packages share similar three-pin configurations but differ in thermal pad design and overall package dimensions. PLUS247™-3 variants feature enhanced thermal characteristics through improved die attach and lead frame design. PCB footprints are not directly interchangeable; layout modifications are required for PLUS247™-3 adoption.

Q: What thermal performance improvement can be expected from substitute parts?

A: Substitute parts with lower on-state resistance (24 mOhm vs. 32 mOhm) reduce conduction losses by approximately 25% at rated current. Parts with higher power dissipation ratings (600W to 1040W vs. 517W) indicate improved thermal design. Actual thermal performance depends on PCB copper area, thermal via density, and heatsink interface design. Thermal simulation or testing is required to quantify improvements for specific applications.

Q: Can parts with 150°C maximum junction temperature replace the IRFP4868PBF rated to 175°C?

A: Substitution is acceptable when circuit design ensures actual junction temperature remains below 150°C. The IRFP4868PBF's 175°C rating provides additional margin for high-temperature environments. If the application requires operation near 175°C, substitute parts with 150°C ratings are not suitable without thermal redesign to reduce operating temperature.

Q: Which substitute part offers the best overall compatibility for existing designs?

A: The IXFR140N30P provides optimal compatibility, matching the 300V/70A specifications with identical pinout and minimal package footprint differences. The IXFX120N30T offers superior performance with 120A capability and active product status, requiring only standard TO-247-3 variant footprint adjustment. Selection depends on whether design priority is minimal modification (IXFR140N30P) or enhanced thermal performance (IXFX120N30T).

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