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IRFBC40SPBF N-Channel 600V MOSFET Equivalent & Substitute Parts
Part Overview
The IRFBC40SPBF is an N-Channel Metal Oxide Semiconductor Field Effect Transistor (MOSFET) manufactured by Vishay Siliconix, rated for 600V drain-to-source voltage with a continuous drain current of 6.2A at 25°C. The device is packaged in a Surface Mount TO-263 (D2PAK) configuration and is classified as Active product status. This component is commonly used in switching applications, power conversion circuits, and high-voltage switching topologies where reliable N-Channel switching performance is required. Equivalent and substitute parts are identified to provide design flexibility, accommodate supply chain variations, and support alternative sourcing strategies while maintaining electrical and mechanical compatibility within specified parameter ranges.
Substiute Parts
Key Parameters
| Parameter | Value | Unit |
|---|---|---|
| Drain to Source Voltage (Vdss) | 600 | V |
| Continuous Drain Current (Id) @ 25°C | 6.2 | A (Tc) |
| Rds On (Max) @ Id, Vgs | 1.2 | Ohm @ 3.7A, 10V |
| Gate Threshold Voltage Vgs(th) (Max) @ Id | 4 | V @ 250µA |
| Gate Charge (Qg) (Max) @ Vgs | 60 | nC @ 10V |
| Power Dissipation (Max) | 3.1 (Ta), 130 (Tc) | W |
| Operating Temperature Range | -55 to 150 | °C (TJ) |
| Mounting Type | Surface Mount | — |
| Package / Case | TO-263-3, D2PAK | — |
| RoHS Status | ROHS3 Compliant | — |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | — |
Substitute Part Grouping Explanation
Substitute parts for the IRFBC40SPBF are identified based on strict electrical and mechanical compatibility criteria. All substitute devices must satisfy the following core parameters:
Mandatory Compatibility Parameters:
- Drain to Source Voltage (Vdss): 600V minimum
- FET Type: N-Channel
- Technology: MOSFET (Metal Oxide)
- Mounting Type: Surface Mount
- Package Family: TO-263 (D2PAK) or equivalent footprint-compatible package
- Operating Temperature Range: -55°C to 150°C (TJ) minimum
- RoHS3 Compliance
- MSL Rating: 1 (Unlimited)
Electrical Performance Criteria: Substitute parts are grouped based on continuous drain current (Id) rating and on-state resistance (Rds On). The IRFBC40SPBF operates at 6.2A continuous drain current with Rds On of 1.2 Ohm @ 3.7A, 10V. Substitute devices may have equal or superior current ratings and comparable or lower on-state resistance values, provided all other electrical parameters remain within acceptable operating ranges for the intended application.
Gate Charge and Input Capacitance: Gate charge (Qg) and input capacitance (Ciss) values influence switching speed and gate drive requirements. Substitute parts with lower gate charge values reduce switching losses and simplify gate drive circuit design, while higher values require proportionally increased gate drive capability.
Parameter Comparison
| Parameter | IRFBC40SPBF (Main) | FQB7N60TM | R6004KNJTL | STB6N60M2 | STD7ANM60N |
|---|---|---|---|---|---|
| Manufacturer | Vishay Siliconix | onsemi | Rohm Semiconductor | STMicroelectronics | STMicroelectronics |
| Drain to Source Voltage (Vdss) | 600V | 600V | 600V | 600V | 600V |
| Continuous Drain Current (Id) @ 25°C | 6.2A (Tc) | 7.4A (Tc) | 4A (Tc) | 4.5A (Tc) | 5A (Tc) |
| Rds On (Max) @ Id, Vgs | 1.2Ω @ 3.7A, 10V | 1Ω @ 3.7A, 10V | 980mΩ @ 1.5A, 10V | 1.2Ω @ 2.25A, 10V | 900mΩ @ 2.5A, 10V |
| Gate Threshold Voltage Vgs(th) (Max) @ Id | 4V @ 250µA | 5V @ 250µA | 5V @ 1mA | 4V @ 250µA | 4V @ 250µA |
| Gate Charge (Qg) (Max) @ Vgs | 60nC @ 10V | 38nC @ 10V | 10.2nC @ 10V | 8nC @ 10V | 14nC @ 10V |
| Input Capacitance (Ciss) (Max) @ Vds | 1300pF @ 25V | 1430pF @ 25V | 280pF @ 25V | 232pF @ 100V | 363pF @ 50V |
| Power Dissipation (Max) | 3.1W (Ta), 130W (Tc) | 3.13W (Ta), 142W (Tc) | 58W (Tc) | 60W (Tc) | 45W (Tc) |
| Operating Temperature Range | -55°C to 150°C (TJ) | -55°C to 150°C (TJ) | -55°C to 150°C (TJ) | -55°C to 150°C (TJ) | -55°C to 150°C (TJ) |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Package / Case | TO-263-3, D2PAK | TO-263-3, D2PAK | TO-263-3, D2PAK | TO-263-3, D2PAK | TO-252-3, DPAK |
| Product Status | Active | Obsolete | Active | Active | Active |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant |
| MSL Rating | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) |
Engineering Selection Recommendations
FQB7N60TM (onsemi): This device provides superior continuous drain current (7.4A) and lower on-state resistance (1Ω) compared to the IRFBC40SPBF, with equivalent voltage rating and operating temperature range. The FQB7N60TM is RoHS3 compliant and MSL 1 rated. However, the product status is listed as Obsolete, which may impact long-term availability and supply chain reliability. Selection of this part should account for obsolescence risk and inventory planning considerations.
R6004KNJTL (Rohm Semiconductor): This device is rated for 4A continuous drain current, which is lower than the IRFBC40SPBF (6.2A). The R6004KNJTL features lower gate charge (10.2nC) and significantly reduced input capacitance (280pF), resulting in faster switching characteristics and reduced gate drive power requirements. The part is Active status, RoHS3 compliant, and MSL 1 rated. This substitute is suitable for applications where the 4A current rating is sufficient and lower switching losses are beneficial.
STB6N60M2 (STMicroelectronics): This device is rated for 4.5A continuous drain current with on-state resistance of 1.2Ω, matching the IRFBC40SPBF resistance specification. The STB6N60M2 features significantly lower gate charge (8nC) and input capacitance (232pF), enabling improved switching performance. The part is Active status, RoHS3 compliant, MSL 1 rated, and includes REACH compliance documentation. This substitute is suitable for applications where the 4.5A current rating is adequate and reduced switching losses are advantageous.
STD7ANM60N (STMicroelectronics): This device is rated for 5A continuous drain current with on-state resistance of 900mΩ, providing lower conduction losses than the IRFBC40SPBF. The STD7ANM60N features low gate charge (14nC) and moderate input capacitance (363pF). The part is Active status, RoHS3 compliant, MSL 1 rated, REACH compliant, and carries AEC-Q101 automotive qualification. The package is TO-252-3 (DPAK), which differs from the IRFBC40SPBF TO-263 (D2PAK) package; PCB layout modifications are required for this substitution. This substitute is suitable for automotive-grade applications where the 5A current rating is sufficient and lower on-state resistance is beneficial.
Frequently Asked Questions (FAQ)
Q: Can the FQB7N60TM directly replace the IRFBC40SPBF in my circuit?
A: The FQB7N60TM is electrically compatible with the IRFBC40SPBF, as both devices share identical 600V voltage rating, equivalent operating temperature range, and compatible D2PAK packaging. The FQB7N60TM provides higher current capability (7.4A vs. 6.2A) and lower on-state resistance (1Ω vs. 1.2Ω), making it a direct upgrade in terms of electrical performance. However, the FQB7N60TM is classified as Obsolete product status, which may affect future availability and supply chain continuity.
Q: What is the primary difference between the R6004KNJTL and the IRFBC40SPBF?
A: The R6004KNJTL is rated for 4A continuous drain current, compared to the IRFBC40SPBF at 6.2A. The R6004KNJTL features significantly lower gate charge (10.2nC vs. 60nC) and reduced input capacitance (280pF vs. 1300pF), resulting in faster switching speed and lower gate drive power consumption. The R6004KNJTL is suitable for applications where the 4A current rating is sufficient and switching efficiency is prioritized. Both devices are Active status and RoHS3 compliant.
Q: Is the STD7ANM60N package compatible with the IRFBC40SPBF footprint?
A: No. The STD7ANM60N uses TO-252-3 (DPAK) packaging, while the IRFBC40SPBF uses TO-263-3 (D2PAK) packaging. These packages have different pin configurations and footprints. Direct PCB substitution is not possible without circuit board redesign. However, the electrical characteristics are compatible, and the STD7ANM60N can be used as a functional replacement with appropriate PCB layout modifications.
Q: Which substitute part offers the lowest on-state resistance?
A: The STD7ANM60N offers the lowest on-state resistance at 900mΩ @ 2.5A, 10V, followed by the R6004KNJTL at 980mΩ @ 1.5A, 10V. Lower on-state resistance reduces conduction losses and heat dissipation in switching applications. Selection between these parts depends on the required continuous drain current rating and application thermal constraints.
Q: Are all substitute parts RoHS3 compliant?
A: Yes. All substitute parts listed (FQB7N60TM, R6004KNJTL, STB6N60M2, and STD7ANM60N) are RoHS3 compliant and carry MSL 1 (Unlimited) moisture sensitivity ratings, matching the IRFBC40SPBF compliance profile.
Q: What is the significance of gate charge differences among these devices?
A: Gate charge (Qg) determines the amount of charge required to switch the MOSFET from off to on state. Lower gate charge values reduce switching losses and simplify gate drive circuit design. The IRFBC40SPBF has 60nC gate charge, while the STB6N60M2 has only 8nC. Devices with lower gate charge switch faster and generate less heat during switching transitions, improving overall circuit efficiency.
Q: Can I use the STB6N60M2 in a high-current application requiring 6.2A continuous drain current?
A: The STB6N60M2 is rated for 4.5A continuous drain current, which is below the 6.2A requirement of the IRFBC40SPBF. Using the STB6N60M2 in an application requiring 6.2A continuous current would exceed the device rating and result in thermal stress, reduced reliability, and potential device failure. The STB6N60M2 is suitable only for applications where the 4.5A current rating is adequate.
Q: What are the thermal considerations when selecting a substitute part?
A: Power dissipation ratings vary among substitute parts. The IRFBC40SPBF dissipates 130W (Tc), while the FQB7N60TM dissipates 142W (Tc), the STB6N60M2 dissipates 60W (Tc), and the STD7ANM60N dissipates 45W (Tc). Lower power dissipation reduces thermal management requirements. Selection should account for application duty cycle, ambient temperature, and available heatsinking capability to ensure device junction temperature remains within the -55°C to 150°C operating range.
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