IRFBC30ASTRL N-Channel 600V 3.6A MOSFET Equivalent & Substitute Parts

Part Overview

The IRFBC30ASTRL is an N-Channel MOSFET manufactured by Vishay Siliconix, rated for 600V drain-to-source voltage with 3.6A continuous drain current at 25°C. The device is housed in a Surface Mount TO-263 (D2PAK) package and dissipates a maximum of 74W at the case temperature. This part is classified as obsolete, making identification of equivalent and substitute components necessary for ongoing design support, production continuity, and system maintenance. Equivalent parts maintain identical electrical and mechanical specifications, while substitute parts provide functional alternatives with comparable or enhanced performance characteristics within the same package family.

Key Parameters

Parameter	Value	Unit
FET Type	N-Channel	—
Technology	MOSFET (Metal Oxide)	—
Drain to Source Voltage (Vdss)	600	V
Current - Continuous Drain (Id) @ 25°C	3.6	A (Tc)
Drive Voltage (Max Rds On)	10	V
Rds On (Max) @ Id, Vgs	2.2	Ohm @ 2.2A, 10V
Vgs(th) (Max) @ Id	4.5	V @ 250µA
Gate Charge (Qg) (Max) @ Vgs	23	nC @ 10V
Vgs (Max)	±30	V
Input Capacitance (Ciss) (Max) @ Vds	510	pF @ 25V
Power Dissipation (Max)	74	W (Tc)
Operating Temperature	-55 to 150	°C (TJ)
Mounting Type	Surface Mount	—
Package / Case	TO-263-3, D2PAK (2 Leads + Tab)	—
Moisture Sensitivity Level (MSL)	1 (Unlimited)	—

Substitute Part Grouping Explanation

Substitution of the IRFBC30ASTRL is determined by strict adherence to the following critical parameters:

Electrical Compatibility Criteria:

Drain to Source Voltage (Vdss) must equal or exceed 600V
Continuous Drain Current (Id) must equal or exceed 3.6A at 25°C
Gate-Source Voltage (Vgs) maximum must be ±30V or greater
On-state resistance (Rds On) must not exceed 2.2Ohm at specified conditions
Gate Charge (Qg) and Input Capacitance (Ciss) must remain within acceptable switching performance parameters

Mechanical Compatibility Criteria:

Mounting type must be Surface Mount
Package must be TO-263 (D2PAK) or equivalent footprint
Lead configuration must be 2 Leads + Tab

Environmental & Compliance Criteria:

Moisture Sensitivity Level must be 1 (Unlimited) or equivalent
Operating temperature range must support -55°C to 150°C (TJ)

Parts meeting all electrical, mechanical, and environmental criteria are classified as direct equivalents or functional substitutes. The IRFBC30ASTRL has two identified alternatives: the IRFBC30ASTRLPBF (parametric equivalent) and the STB4NK60ZT4 (manufacturer-recommended substitute with enhanced specifications).

Parameter Comparison

Parameter	IRFBC30ASTRL	IRFBC30ASTRLPBF	STB4NK60ZT4
Manufacturer	Vishay Siliconix	Vishay Siliconix	STMicroelectronics
FET Type	N-Channel	N-Channel	N-Channel
Technology	MOSFET (Metal Oxide)	MOSFET (Metal Oxide)	MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss)	600V	600V	600V
Current - Continuous Drain (Id) @ 25°C	3.6A (Tc)	3.6A (Tc)	4A (Tc)
Drive Voltage (Max Rds On)	10V	10V	10V
Rds On (Max) @ Id, Vgs	2.2Ohm @ 2.2A, 10V	2.2Ohm @ 2.2A, 10V	2Ohm @ 2A, 10V
Vgs(th) (Max) @ Id	4.5V @ 250µA	4.5V @ 250µA	4.5V @ 50µA
Gate Charge (Qg) (Max) @ Vgs	23nC @ 10V	23nC @ 10V	26nC @ 10V
Vgs (Max)	±30V	±30V	±30V
Input Capacitance (Ciss) (Max) @ Vds	510pF @ 25V	510pF @ 25V	510pF @ 25V
Power Dissipation (Max)	74W (Tc)	74W (Tc)	70W (Tc)
Operating Temperature	-55°C ~ 150°C (TJ)	-55°C ~ 150°C (TJ)	150°C (TJ)
Mounting Type	Surface Mount	Surface Mount	Surface Mount
Package / Case	TO-263-3, D2PAK	TO-263-3, D2PAK	TO-263-3, D2PAK
Product Status	Obsolete	Active	Active
RoHS Status	RoHS non-compliant	ROHS3 Compliant	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	1 (Unlimited)	1 (Unlimited)	1 (Unlimited)

Engineering Selection Recommendations

IRFBC30ASTRLPBF (Parametric Equivalent)

The IRFBC30ASTRLPBF is a direct parametric equivalent to the IRFBC30ASTRL, manufactured by Vishay Siliconix. This part maintains identical electrical specifications across all critical parameters: 600V Vdss, 3.6A continuous drain current, 2.2Ohm Rds On, and 74W power dissipation. The primary distinction is product status: the IRFBC30ASTRLPBF is classified as Active, whereas the original part is Obsolete. Additionally, the IRFBC30ASTRLPBF carries ROHS3 compliance certification, compared to the non-compliant status of the IRFBC30ASTRL. Packaging is specified as Cut Tape (CT) with significantly higher inventory availability (15,600 pieces in stock versus 1,026 pieces for the original). This part is suitable for direct replacement in applications requiring strict parameter matching and RoHS compliance.

STB4NK60ZT4 (Manufacturer-Recommended Substitute)

The STB4NK60ZT4, manufactured by STMicroelectronics, is a manufacturer-recommended substitute that exceeds the electrical specifications of the IRFBC30ASTRL. This device maintains the same 600V Vdss rating and TO-263 (D2PAK) package configuration but provides enhanced performance: 4A continuous drain current (versus 3.6A), reduced Rds On of 2Ohm at 2A, 10V (versus 2.2Ohm), and improved gate threshold voltage response at 4.5V @ 50µA. The STB4NK60ZT4 incorporates SuperMESH™ technology and is classified as Active with ROHS3 compliance. Power dissipation is rated at 70W (Tc), slightly lower than the original 74W. This part is suitable for applications where enhanced current handling and reduced on-state losses provide system benefits. Inventory availability is 9,585 pieces. The operating temperature specification lists 150°C (TJ) without explicit lower temperature bound notation, whereas the original specifies -55°C to 150°C (TJ).

Both substitute parts are surface-mounted in TO-263 (D2PAK) packages with identical lead configurations and MSL ratings. Selection between the parametric equivalent and the manufacturer-recommended substitute depends on application requirements: the IRFBC30ASTRLPBF for strict parameter matching and compliance continuity, or the STB4NK60ZT4 for enhanced electrical performance and reduced thermal dissipation.

Frequently Asked Questions (FAQ)

Q: Can the IRFBC30ASTRLPBF be used as a direct replacement for the IRFBC30ASTRL?

A: Yes. The IRFBC30ASTRLPBF is a parametric equivalent with identical electrical specifications. All critical parameters—Vdss, Id, Rds On, Vgs(th), Qg, and Ciss—match the original part. The primary differences are product status (Active versus Obsolete) and RoHS compliance (ROHS3 versus non-compliant). Both parts use the same TO-263 (D2PAK) package with identical lead configuration and MSL rating.

Q: What are the advantages of using the STB4NK60ZT4 over the IRFBC30ASTRLPBF?

A: The STB4NK60ZT4 provides enhanced electrical performance: 4A continuous drain current versus 3.6A, reduced Rds On of 2Ohm versus 2.2Ohm, and lower power dissipation of 70W versus 74W. These improvements result in reduced thermal dissipation and improved current handling capacity. Both parts maintain 600V Vdss and TO-263 (D2PAK) package compatibility. The STB4NK60ZT4 incorporates SuperMESH™ technology for optimized switching characteristics.

Q: Are all three parts pin-compatible?

A: Yes. The IRFBC30ASTRL, IRFBC30ASTRLPBF, and STB4NK60ZT4 all use the TO-263 (D2PAK) package with 2 Leads + Tab configuration. Pin-to-pin compatibility is confirmed for direct PCB substitution without layout modifications.

Q: What is the significance of the RoHS compliance difference?

A: The IRFBC30ASTRL is RoHS non-compliant, while both the IRFBC30ASTRLPBF and STB4NK60ZT4 are ROHS3 compliant. For applications subject to RoHS regulations or customer requirements, the compliant alternatives are mandatory. Both substitute parts meet current environmental and material restriction standards.

Q: Can the STB4NK60ZT4 be used in applications designed for the IRFBC30ASTRL?

A: Yes, with consideration of enhanced specifications. The STB4NK60ZT4 meets or exceeds all critical electrical parameters of the IRFBC30ASTRL: equal Vdss (600V), higher Id (4A versus 3.6A), lower Rds On (2Ohm versus 2.2Ohm), and compatible Vgs (±30V). The package and thermal characteristics are compatible. Applications benefit from improved performance and reduced power dissipation. The operating temperature specification should be verified for lower temperature operation below -55°C if required.

Q: What is the difference between Cut Tape (CT) and Digi-Reel® packaging?

A: Cut Tape (CT) refers to components supplied on tape that is cut into individual segments for handling and assembly. Digi-Reel® is a proprietary packaging format. The IRFBC30ASTRLPBF is supplied in Cut Tape (CT), while the STB4NK60ZT4 is available in both Cut Tape (CT) and Digi-Reel® formats. Both packaging types are suitable for automated assembly processes; selection depends on production equipment compatibility and inventory management preferences.

Q: Are there any gate charge or input capacitance differences that affect circuit design?

A: Gate Charge (Qg) and Input Capacitance (Ciss) are nearly identical across all three parts. The IRFBC30ASTRL and IRFBC30ASTRLPBF both specify 23nC @ 10V and 510pF @ 25V. The STB4NK60ZT4 specifies 26nC @ 10V (slightly higher) and 510pF @ 25V (identical). These minor differences have negligible impact on gate drive circuit design and switching performance in typical applications.

Q: What is the Moisture Sensitivity Level (MSL) rating, and why is it important?

A: All three parts carry MSL 1 (Unlimited), indicating no moisture sensitivity restrictions. Components with MSL 1 do not require special moisture control during storage, handling, or assembly. This simplifies supply chain management and manufacturing processes compared to higher MSL ratings.

Q: Which part should be selected for new designs?

A: For new designs, the IRFBC30ASTRLPBF or STB4NK60ZT4 are appropriate choices, as both are Active products with current manufacturer support. The IRFBC30ASTRL is Obsolete and should not be specified for new designs. Selection between the two active alternatives depends on performance requirements: the IRFBC30ASTRLPBF for parameter-matched replacement, or the STB4NK60ZT4 for enhanced electrical performance and reduced thermal dissipation.

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