IRF7530TR MOSFET Equivalent & Substitute Parts

Part Overview

The IRF7530TR is a dual N-channel MOSFET array manufactured by Infineon Technologies, designed for surface mount applications in the Micro8™ package. This component integrates two N-channel MOSFETs with a maximum drain-source voltage of 20V and continuous drain current of 5.4A per channel. The IRF7530TR is classified as obsolete, indicating it has reached end-of-life status and is no longer recommended for new designs. Finding equivalent or substitute parts is necessary to ensure design continuity, maintain supply chain reliability, and transition to actively supported alternatives.

Substiute Parts

IRF7530TR
Infineon TechnologiesIn Stock: 4304IRF7530TR Datasheet
IRF7530TR
Current Part
IRF7530TRPBF
Infineon TechnologiesIn Stock: 96906IRF7530TRPBF Datasheet
IRF7530TRPBF
Direct

Key Parameters

Parameter Value Unit
Drain to Source Voltage (Vdss) 20 V
Current - Continuous Drain (Id) @ 25°C 5.4 A
Rds On (Max) @ Id, Vgs 30 mOhm @ 5.4A, 4.5V mOhm
Vgs(th) (Max) @ Id 1.2 V @ 250µA
Gate Charge (Qg) (Max) @ Vgs 26 nC @ 4.5V
Input Capacitance (Ciss) (Max) @ Vds 1310 pF @ 15V
Power - Max 1.3 W
Operating Temperature Range -55 to 150 °C (TJ)
Configuration 2 N-Channel (Dual)
Package / Case 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Supplier Device Package Micro8™
Mounting Type Surface Mount

Substitute Part Grouping Explanation

Substitution of the IRF7530TR is determined by strict equivalence across electrical and mechanical parameters. The substitute part must satisfy all of the following criteria:

Electrical Parameters (Must Match Exactly):

  • Drain to Source Voltage (Vdss): 20V
  • Continuous Drain Current (Id) @ 25°C: 5.4A
  • On-State Resistance (Rds On): 30 mOhm @ 5.4A, 4.5V
  • Gate Threshold Voltage (Vgs(th)): 1.2V @ 250µA
  • Gate Charge (Qg): 26nC @ 4.5V
  • Input Capacitance (Ciss): 1310pF @ 15V
  • Maximum Power Dissipation: 1.3W
  • Operating Temperature Range: -55°C to 150°C (TJ)

Mechanical Parameters (Must Match Exactly):

  • Configuration: 2 N-Channel (Dual)
  • Package Type: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
  • Supplier Device Package: Micro8™
  • Mounting Type: Surface Mount

Compliance Parameters:

  • Technology: MOSFET (Metal Oxide)
  • Series: HEXFET®

The IRF7530TRPBF is identified as a direct substitute based on complete alignment with all electrical and mechanical specifications listed above.

Parameter Comparison

Parameter IRF7530TR IRF7530TRPBF Match
Drain to Source Voltage (Vdss) 20V 20V
Current - Continuous Drain (Id) @ 25°C 5.4A 5.4A
Rds On (Max) @ Id, Vgs 30 mOhm @ 5.4A, 4.5V 30 mOhm @ 5.4A, 4.5V
Vgs(th) (Max) @ Id 1.2V @ 250µA 1.2V @ 250µA
Gate Charge (Qg) (Max) @ Vgs 26nC @ 4.5V 26nC @ 4.5V
Input Capacitance (Ciss) (Max) @ Vds 1310pF @ 15V 1310pF @ 15V
Power - Max 1.3W 1.3W
Operating Temperature Range -55°C ~ 150°C (TJ) -55°C ~ 150°C (TJ)
Configuration 2 N-Channel (Dual) 2 N-Channel (Dual)
Package / Case 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Supplier Device Package Micro8™ Micro8™
Mounting Type Surface Mount Surface Mount
Series HEXFET® HEXFET®
Technology MOSFET (Metal Oxide) MOSFET (Metal Oxide)

Engineering Selection Recommendations

IRF7530TRPBF as Primary Substitute:

The IRF7530TRPBF is a direct electrical and mechanical equivalent to the IRF7530TR. Both parts share identical electrical specifications, package geometry, and thermal characteristics. The primary distinction between these parts is their product status and compliance certifications.

The IRF7530TR is classified as obsolete, indicating discontinued manufacturing and no further support from Infineon Technologies. The IRF7530TRPBF is classified as "Not For New Designs," indicating it remains available but is not recommended for new product development.

From a compliance perspective, the IRF7530TRPBF carries RoHS3 compliance certification, whereas the IRF7530TR is RoHS non-compliant. Both parts maintain REACH Unaffected status and share identical ECCN (EAR99) and HTSUS (8541.29.0095) classifications.

Inventory availability differs significantly: the IRF7530TR has 4,200 pieces in stock, while the IRF7530TRPBF has 96,830 pieces available. The IRF7530TRPBF is supplied in Cut Tape (CT) and Digi-Reel® packaging, providing flexibility for both manual and automated assembly processes.

For applications requiring RoHS3 compliance or where long-term supply chain stability is a priority, the IRF7530TRPBF is the appropriate selection. Both parts are functionally interchangeable at the circuit level.

Frequently Asked Questions (FAQ)

Q: Can the IRF7530TRPBF be used as a direct replacement for the IRF7530TR in existing designs?

A: Yes. The IRF7530TRPBF is electrically and mechanically identical to the IRF7530TR. All electrical parameters, including voltage ratings, current ratings, on-state resistance, gate charge, and capacitance specifications are identical. The package type, pin configuration, and mounting method are also identical. No circuit modifications are required for substitution.

Q: What is the difference between IRF7530TR and IRF7530TRPBF?

A: The primary differences are product status and compliance certification. The IRF7530TR is obsolete, while the IRF7530TRPBF is classified as "Not For New Designs." The IRF7530TRPBF carries RoHS3 compliance, whereas the IRF7530TR is RoHS non-compliant. Packaging format differs: IRF7530TRPBF is supplied in Cut Tape and Digi-Reel formats. Inventory levels also differ, with IRF7530TRPBF having significantly higher availability.

Q: Are there any thermal or performance differences between these parts?

A: No. Both parts have identical maximum power dissipation (1.3W), operating temperature range (-55°C to 150°C TJ), and all thermal-related electrical parameters. Performance in thermal management applications is equivalent.

Q: What does "Not For New Designs" mean for the IRF7530TRPBF?

A: "Not For New Designs" indicates that while the part remains available for purchase and is fully functional, the manufacturer does not recommend its use in new product development. This classification typically precedes obsolescence. For new designs, alternative parts with active support status should be evaluated if available.

Q: Is the Micro8™ package compatible with standard 8-TSSOP and 8-MSOP footprints?

A: Yes. The Micro8™ package designation refers to the 8-TSSOP and 8-MSOP package types with 0.118" (3.00mm) width. Both the IRF7530TR and IRF7530TRPBF use this identical package specification and are compatible with the same PCB footprints and assembly processes.

Q: What is the significance of RoHS3 compliance on the IRF7530TRPBF?

A: RoHS3 compliance indicates the part meets Restriction of Hazardous Substances Directive requirements, restricting the use of specific hazardous materials in electrical and electronic equipment. If your application or end market requires RoHS compliance, the IRF7530TRPBF is the appropriate selection. The IRF7530TR, being RoHS non-compliant, may not be suitable for such applications.

Q: Can I use these parts in high-frequency switching applications?

A: Both parts have identical gate charge (26nC @ 4.5V) and input capacitance (1310pF @ 15V) specifications, which determine switching speed characteristics. Application suitability depends on your specific frequency requirements and circuit design. Consult the detailed datasheet for switching time specifications and thermal considerations at your intended operating frequency.

Q: What packaging options are available for the IRF7530TRPBF?

A: The IRF7530TRPBF is supplied in Cut Tape (CT) and Digi-Reel® packaging formats. Cut Tape is suitable for manual assembly and small-quantity applications. Digi-Reel format is designed for automated pick-and-place assembly processes in high-volume manufacturing.

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