IRF7342PBF Equivalent & Substitute Parts

Part Overview

The IRF7342PBF is a dual P-channel MOSFET array manufactured by Infineon Technologies, designed for surface mount applications in the 8-SOIC package. This component features a 55V drain-to-source voltage rating with 3.4A continuous drain current and logic level gate operation. The IRF7342PBF is currently discontinued at DiGi Electronics, necessitating identification of functionally equivalent alternatives that maintain electrical and mechanical compatibility for existing designs.

Substiute Parts

IRF7342PBF
Infineon TechnologiesIn Stock: 2518IRF7342PBF Datasheet
IRF7342PBF
Current Part
IRF7342TRPBF
Infineon TechnologiesIn Stock: 41404IRF7342TRPBF Datasheet
IRF7342TRPBF
MFR Recommended
DMP6110SSD-13
Diodes IncorporatedIn Stock: 87663DMP6110SSD-13 Datasheet
DMP6110SSD-13
MFR Recommended
ZXMP6A17DN8TA
Diodes IncorporatedIn Stock: 17728ZXMP6A17DN8TA Datasheet
ZXMP6A17DN8TA
MFR Recommended

Key Parameters

Parameter Value Unit
Configuration 2 P-Channel (Dual)
Drain to Source Voltage (Vdss) 55 V
Current - Continuous Drain (Id) @ 25°C 3.4 A
Rds On (Max) @ Id, Vgs 105 mOhm @ 3.4A, 10V
Vgs(th) (Max) @ Id 1 V @ 250µA
Gate Charge (Qg) (Max) @ Vgs 38 nC @ 10V
Input Capacitance (Ciss) (Max) @ Vds 690 pF @ 25V
Power - Max 2 W
Operating Temperature Range -55 to 150 °C (TJ)
Mounting Type Surface Mount
Package / Case 8-SOIC (0.154", 3.90mm Width)
Technology MOSFET (Metal Oxide)
FET Feature Logic Level Gate

Substitute Part Grouping Explanation

Substitution eligibility for the IRF7342PBF is determined by the following critical parameters:

Primary Substitution Criteria:

  • Dual P-channel MOSFET configuration in 8-SOIC package
  • Drain-to-source voltage rating of 55V or higher
  • Continuous drain current rating of 3.4A or higher
  • On-state resistance (Rds On) not exceeding 105 mOhm at rated conditions
  • Logic level gate operation capability
  • Surface mount technology with identical package footprint

Secondary Compatibility Parameters:

  • Operating temperature range: -55°C to 150°C (TJ)
  • Gate charge and input capacitance within acceptable design margins
  • RoHS3 compliance and MSL Level 1 rating

The three substitute parts identified meet these criteria with the following distinctions:

IRF7342TRPBF (Infineon Technologies): Identical electrical specifications to the main part with active product status and improved availability. Packaging format differs (Cut Tape & Digi-Reel vs. standard packaging).

DMP6110SSD-13 (Diodes Incorporated): Exceeds voltage rating (60V vs. 55V) and maintains current rating (3.3A vs. 3.4A). Rds On specification differs at different test conditions. Lower maximum power dissipation (1.2W vs. 2W).

ZXMP6A17DN8TA (Diodes Incorporated): Exceeds voltage rating (60V vs. 55V) with reduced continuous drain current (2.7A vs. 3.4A). Higher Rds On specification (125 mOhm vs. 105 mOhm). Includes logic level gate feature.

Parameter Comparison

Parameter IRF7342PBF IRF7342TRPBF DMP6110SSD-13 ZXMP6A17DN8TA
Manufacturer Infineon Technologies Infineon Technologies Diodes Incorporated Diodes Incorporated
Configuration 2 P-Channel 2 P-Channel 2 P-Channel 2 P-Channel
Vdss (V) 55 55 60 60
Id @ 25°C (A) 3.4 3.4 3.3 2.7
Rds On (mOhm) 105 @ 3.4A, 10V 105 @ 3.4A, 10V 105 @ 4.5A, 10V 125 @ 2.3A, 10V
Vgs(th) (V) 1 @ 250µA 1 @ 250µA 3 @ 250µA 1 @ 250µA (Min)
Qg (nC) 38 @ 10V 38 @ 10V 17.2 @ 10V 17.7 @ 10V
Ciss (pF) 690 @ 25V 690 @ 25V 969 @ 30V 637 @ 30V
Power Max (W) 2 2 1.2 1.81
Operating Temp (°C) -55 to 150 -55 to 150 -55 to 150 -55 to 150
Package 8-SOIC 8-SOIC 8-SOIC 8-SOIC
Product Status Discontinued Active Active Active
RoHS Status ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant
MSL Rating 1 (Unlimited) 1 (Unlimited) 1 (Unlimited) 1 (Unlimited)

Engineering Selection Recommendations

Primary Recommendation: IRF7342TRPBF

The IRF7342TRPBF is the direct functional equivalent of the discontinued IRF7342PBF. This part maintains identical electrical specifications across all critical parameters including Vdss, Id, Rds On, Vgs(th), gate charge, and input capacitance. Both components are manufactured by Infineon Technologies under the HEXFET® series designation. The IRF7342TRPBF carries active product status with significantly higher inventory availability (41,300 pcs vs. 2,468 pcs). Packaging format differs only in supplier delivery method (Cut Tape & Digi-Reel vs. standard packaging), with no impact on component functionality or PCB assembly compatibility. RoHS3 compliance and MSL Level 1 rating are maintained. This substitute requires no circuit redesign or thermal analysis modifications.

Secondary Recommendation: DMP6110SSD-13

The DMP6110SSD-13 manufactured by Diodes Incorporated provides a higher voltage-rated alternative (60V vs. 55V) suitable for applications where increased voltage margin is beneficial. Continuous drain current rating (3.3A) remains within 3% of the original specification. On-state resistance specification is identical at 105 mOhm, though measured at different current conditions (4.5A vs. 3.4A). Gate charge is significantly reduced (17.2 nC vs. 38 nC), resulting in faster switching characteristics. Maximum power dissipation is reduced to 1.2W, requiring verification that thermal design margins remain adequate for the intended application. This substitute is suitable for designs where lower gate charge and higher voltage rating provide system benefits.

Tertiary Recommendation: ZXMP6A17DN8TA

The ZXMP6A17DN8TA manufactured by Diodes Incorporated offers a 60V voltage rating with reduced continuous drain current (2.7A vs. 3.4A). This part is suitable only for applications where the 2.7A current rating meets design requirements. On-state resistance increases to 125 mOhm, representing a 19% increase from the original specification. Gate charge is reduced to 17.7 nC, providing faster switching performance. Logic level gate operation is maintained. This substitute is appropriate for lower-current applications where the reduced current rating does not constrain system performance.

All three substitute parts maintain RoHS3 compliance, MSL Level 1 rating, and identical operating temperature range. Selection should be based on specific application current requirements, thermal dissipation constraints, and switching speed requirements.

Frequently Asked Questions (FAQ)

Q: Can IRF7342TRPBF be used as a direct replacement for IRF7342PBF without circuit modifications?

A: Yes. The IRF7342TRPBF is electrically and mechanically identical to the IRF7342PBF. All electrical parameters, package dimensions, and pin configurations are equivalent. The only difference is the packaging format (Cut Tape & Digi-Reel vs. standard packaging), which does not affect component performance or PCB assembly compatibility.

Q: What are the key differences between DMP6110SSD-13 and the original IRF7342PBF?

A: The DMP6110SSD-13 has a higher voltage rating (60V vs. 55V), slightly lower continuous drain current (3.3A vs. 3.4A), and significantly lower gate charge (17.2 nC vs. 38 nC). Maximum power dissipation is reduced from 2W to 1.2W. These differences require verification that the application's current and thermal requirements remain within acceptable limits.

Q: Is the ZXMP6A17DN8TA suitable for all applications using the IRF7342PBF?

A: No. The ZXMP6A17DN8TA has a reduced continuous drain current rating (2.7A vs. 3.4A) and higher on-state resistance (125 mOhm vs. 105 mOhm). This substitute is appropriate only for applications where the 2.7A current rating is sufficient and the increased resistance does not exceed thermal or efficiency constraints.

Q: Do all substitute parts use the same 8-SOIC package?

A: Yes. All substitute parts use the 8-SOIC package with identical dimensions (0.154" width, 3.90mm). PCB footprints and assembly processes remain unchanged.

Q: Are there compliance or regulatory differences between the main part and substitutes?

A: No. All parts maintain RoHS3 compliance, MSL Level 1 rating, REACH Unaffected status, and identical ECCN and HTSUS classifications. Regulatory and environmental compliance requirements are equivalent across all options.

Q: What is the impact of reduced gate charge in the DMP6110SSD-13 and ZXMP6A17DN8TA?

A: Reduced gate charge (17.2 nC and 17.7 nC respectively, compared to 38 nC) results in faster switching transitions and lower gate drive power requirements. This may improve overall circuit efficiency and switching speed performance, provided the gate driver circuit is compatible with the lower charge requirements.

Q: How should I select between the three substitute options?

A: Selection depends on three factors: (1) Current requirement—if the application requires 3.4A, use IRF7342TRPBF or DMP6110SSD-13; if 2.7A is sufficient, ZXMP6A17DN8TA is acceptable. (2) Thermal design—verify that reduced maximum power ratings (1.2W or 1.81W) do not exceed thermal constraints. (3) Switching performance—if faster switching is beneficial, DMP6110SSD-13 or ZXMP6A17DN8TA offer reduced gate charge. IRF7342TRPBF is the recommended first choice for direct replacement without design changes.

Q: Can these parts be used interchangeably in existing PCB designs?

A: Yes, from a mechanical and pin-configuration perspective. All parts use the 8-SOIC package with identical pinout. However, electrical parameter differences (particularly current rating and on-state resistance) must be verified against circuit design requirements before implementation.

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