IRF7309PBF Equivalent & Substitute Parts

Part Overview

The IRF7309PBF is a dual MOSFET array integrating N-channel and P-channel transistors in a single 8-SOIC surface mount package. Manufactured by Infineon Technologies under the HEXFET® series, this component is rated for 30V drain-to-source voltage with continuous drain currents of 4A (N-channel) and 3A (P-channel). The IRF7309PBF has been discontinued at DiGi Electronics, necessitating identification of functionally equivalent alternatives for ongoing design support and production requirements. Substitute parts must maintain electrical compatibility across voltage, current, and thermal specifications while conforming to the same package footprint and pin configuration.

Substiute Parts

IRF7309PBF

Infineon TechnologiesIn Stock: 1502IRF7309PBF Datasheet

Current PartRFQ

IRF7309TRPBF

Infineon TechnologiesIn Stock: 22301IRF7309TRPBF Datasheet

DirectRFQ

DMC3032LSD-13

Diodes IncorporatedIn Stock: 2907DMC3032LSD-13 Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the IRF7309PBF are identified based on strict electrical and mechanical compatibility criteria. The substitution logic is governed by the following parameters:

Primary Compatibility Criteria:

• Drain-to-Source Voltage (Vdss): Must equal or exceed 30V
• Package / Case: Must be 8-SOIC (0.154", 3.90mm Width) to ensure PCB footprint compatibility
• Configuration: Must maintain N-channel and P-channel dual MOSFET array topology
• Mounting Type: Must be Surface Mount
• Operating Temperature Range: Must encompass -55°C to 150°C

Secondary Compatibility Criteria:

• Continuous Drain Current (Id): Substitute must support minimum 4A (N-channel) and 3A (P-channel)
• On-Resistance (Rds On): Lower or equal values are acceptable
• Gate Charge (Qg): Lower or equal values are acceptable
• Input Capacitance (Ciss): Lower or equal values are acceptable
• Maximum Power Dissipation: Equal or greater values are acceptable
• RoHS and MSL Compliance: Must maintain ROHS3 Compliant and MSL 1 status

Two substitute parts meet these criteria and are listed below.

Parameter Comparison

Engineering Selection Recommendations

IRF7309TRPBF (Infineon Technologies)

The IRF7309TRPBF is an exact electrical equivalent to the IRF7309PBF, maintaining identical specifications across all key parameters including Vdss, Id, Rds On, Vgs(th), Qg, Ciss, and power dissipation. The primary distinction is packaging format: IRF7309TRPBF is supplied in Cut Tape (CT) and Digi-Reel® format, whereas the original IRF7309PBF was supplied in standard packaging. Both parts share the same 8-SOIC footprint and are manufactured by Infineon Technologies under the HEXFET® series. The IRF7309TRPBF maintains Active product status with 22,200 units in stock, providing immediate availability. This part is the direct functional replacement for the discontinued IRF7309PBF and requires no circuit redesign.

DMC3032LSD-13 (Diodes Incorporated)

The DMC3032LSD-13 is a manufacturer-recommended substitute manufactured by Diodes Incorporated. This part maintains the same 30V Vdss rating, 8-SOIC package footprint, and N/P-channel configuration. The DMC3032LSD-13 offers enhanced electrical performance with higher continuous drain currents (8.1A N-channel, 7A P-channel), lower on-resistance (32mOhm), reduced gate charge (9.2nC), and lower input capacitance (404.5pF). Maximum power dissipation is increased to 2.5W. The gate threshold voltage is specified at 2.1V, which is higher than the IRF7309PBF at 1V. The DMC3032LSD-13 is supplied in Tape & Reel (TR) format with 2,894 units in stock and maintains Active product status. This substitute is suitable for applications where improved thermal performance and lower switching losses are beneficial, provided that the higher gate threshold voltage is compatible with the gate drive circuit.

Both substitutes maintain ROHS3 compliance and MSL 1 rating, ensuring compatibility with standard manufacturing and storage requirements.

Frequently Asked Questions (FAQ)

Q: Can the IRF7309TRPBF be used as a direct replacement for the IRF7309PBF?

A: Yes. The IRF7309TRPBF is electrically identical to the IRF7309PBF across all specified parameters. Both parts share the same 8-SOIC footprint, voltage rating (30V), current ratings (4A/3A), on-resistance, gate charge, and operating temperature range. The only difference is the packaging format (Cut Tape/Digi-Reel vs. standard packaging). No circuit modifications are required.

Q: What is the key difference between the IRF7309TRPBF and DMC3032LSD-13?

A: Both parts maintain the same 30V Vdss rating and 8-SOIC package. The IRF7309TRPBF is an exact electrical match to the original IRF7309PBF. The DMC3032LSD-13 offers higher current ratings (8.1A/7A vs. 4A/3A), lower on-resistance (32mOhm vs. 50mOhm), and higher power dissipation (2.5W vs. 1.4W). However, the DMC3032LSD-13 has a higher gate threshold voltage (2.1V vs. 1V), which may affect gate drive compatibility.

Q: Is the DMC3032LSD-13 suitable for all applications using the IRF7309PBF?

A: The DMC3032LSD-13 is electrically compatible in terms of voltage and package footprint. However, the higher gate threshold voltage (2.1V) must be verified against the gate drive circuit specifications. If the gate drive voltage is marginal or below 5V, the higher threshold may result in incomplete gate drive. Applications with adequate gate drive voltage (typically 10V or higher) will benefit from the improved performance characteristics of the DMC3032LSD-13.

Q: Are all three parts RoHS compliant?

A: Yes. The IRF7309PBF, IRF7309TRPBF, and DMC3032LSD-13 are all ROHS3 compliant with MSL 1 (Unlimited) moisture sensitivity level, meeting standard environmental and manufacturing requirements.

Q: What is the difference between the packaging formats (CT, Digi-Reel, TR)?

A: Cut Tape (CT) and Digi-Reel® are Infineon packaging formats for the IRF7309TRPBF, suitable for automated pick-and-place assembly. Tape & Reel (TR) is the standard format for the DMC3032LSD-13. All three formats are compatible with standard surface mount assembly equipment. The choice between formats depends on production volume and assembly line requirements.

Q: Can I mix IRF7309TRPBF and DMC3032LSD-13 in the same circuit board?

A: Both parts share the same 8-SOIC footprint and can be placed in identical PCB locations. However, mixing different part numbers in the same design is not recommended unless the circuit design explicitly accounts for the parameter differences, particularly the gate threshold voltage variation in the DMC3032LSD-13.

Q: What inventory levels are available for each substitute?

A: IRF7309TRPBF has 22,200 units in stock (Active status). DMC3032LSD-13 has 2,894 units in stock (Active status). Both parts offer immediate availability for production requirements.