IRF6635 Equivalent & Substitute Parts

Part Overview

The IRF6635 is an N-Channel 30V 32A MOSFET manufactured by Infineon Technologies, featuring DIRECTFET™ MX surface mount packaging. This device is classified as obsolete, indicating discontinued production and limited availability for new designs. The part operates across a temperature range of -40°C to 150°C (junction temperature) and is designed for applications requiring moderate current handling with low on-resistance characteristics.

Due to its obsolete status, identifying functionally equivalent substitute parts is essential for design continuity, procurement reliability, and long-term product support. Substitute parts must maintain electrical compatibility across critical parameters including drain-source voltage rating, continuous drain current capability, on-resistance characteristics, and gate charge specifications.

Substiute Parts

IRF6635
Infineon TechnologiesIn Stock: 5229IRF6635 Datasheet
IRF6635
Current Part
PSMN1R7-30YL,115
Nexperia USA Inc.In Stock: 3411PSMN1R7-30YL,115 Datasheet
PSMN1R7-30YL,115
MFR Recommended

Key Parameters

Parameter Value Unit
FET Type N-Channel
Drain to Source Voltage (Vdss) 30 V
Current - Continuous Drain (Id) @ 25°C 32A (Ta), 180A (Tc) A
Rds On (Max) @ Id, Vgs 1.8 mOhm @ 32A, 10V mOhm
Vgs(th) (Max) @ Id 2.35V @ 250µA V
Gate Charge (Qg) (Max) @ Vgs 71 nC @ 4.5V nC
Input Capacitance (Ciss) (Max) @ Vds 5970 pF @ 15V pF
Operating Temperature Range -40 to 150 °C (TJ)
Mounting Type Surface Mount
RoHS Status RoHS non-compliant

Substitute Part Grouping Explanation

Substitution of the IRF6635 is determined by strict equivalence across the following critical electrical and mechanical parameters:

Electrical Compatibility Criteria:

  • Drain-Source Voltage (Vdss): Must equal 30V to ensure safe operation in existing circuit topologies
  • FET Type: Must remain N-Channel to maintain circuit polarity and gate drive compatibility
  • Technology: Must be MOSFET (Metal Oxide) to preserve switching characteristics and gate threshold behavior
  • On-Resistance (Rds On): Substitute must not exceed the original specification to prevent thermal runaway and maintain efficiency
  • Gate Charge (Qg): Substitute specifications must be compatible with existing gate drive circuitry
  • Vgs(th) and Vgs(Max): Must fall within compatible ranges to ensure proper gate drive voltage margins

Mechanical Compatibility Criteria:

  • Mounting Type: Must be Surface Mount to fit existing PCB layouts
  • Package compatibility: Substitute packages must be physically compatible or require minimal PCB redesign

The PSMN1R7-30YL,115 from Nexperia USA Inc. satisfies these substitution criteria through equivalent voltage rating, N-Channel topology, and compatible electrical characteristics within the specified parameter ranges.

Parameter Comparison

Parameter IRF6635 (Infineon) PSMN1R7-30YL,115 (Nexperia) Compatibility
FET Type N-Channel N-Channel Equivalent
Technology MOSFET (Metal Oxide) MOSFET (Metal Oxide) Equivalent
Drain to Source Voltage (Vdss) 30V 30V Equivalent
Current - Continuous Drain (Id) @ 25°C 32A (Ta), 180A (Tc) 100A (Tc) Substitute exceeds specification
Rds On (Max) @ Id, Vgs 1.8 mOhm @ 32A, 10V 1.7 mOhm @ 15A, 10V Substitute meets specification
Vgs(th) (Max) @ Id 2.35V @ 250µA 2.15V @ 1mA Compatible
Gate Charge (Qg) (Max) @ Vgs 71 nC @ 4.5V 77.9 nC @ 10V Substitute within acceptable range
Input Capacitance (Ciss) (Max) @ Vds 5970 pF @ 15V 5057 pF @ 12V Substitute lower capacitance
Vgs (Max) ±20V ±20V Equivalent
Operating Temperature Range -40 to 150°C (TJ) -55 to 175°C (TJ) Substitute exceeds specification
Mounting Type Surface Mount Surface Mount Equivalent
Product Status Obsolete Active Substitute actively manufactured
RoHS Status RoHS non-compliant ROHS3 Compliant Substitute meets current compliance
Moisture Sensitivity Level (MSL) 3 (168 Hours) 1 (Unlimited) Substitute superior handling

Engineering Selection Recommendations

Product Status Consideration: The IRF6635 is classified as obsolete, indicating end-of-life status with no ongoing manufacturing. The PSMN1R7-30YL,115 maintains active product status, ensuring continued availability, manufacturing support, and supply chain reliability for current and future production requirements.

Compliance and Certification: The IRF6635 is RoHS non-compliant, reflecting its legacy manufacturing timeline. The PSMN1R7-30YL,115 achieves ROHS3 compliance, meeting current regulatory requirements for electronic component procurement in regulated industries and markets with mandatory RoHS enforcement.

Electrical Performance: Both devices share identical 30V drain-source voltage ratings and N-Channel MOSFET topology. The PSMN1R7-30YL,115 demonstrates superior continuous drain current capability (100A at Tc versus 32A at Ta for the IRF6635), lower on-resistance (1.7 mOhm versus 1.8 mOhm), and extended operating temperature range (-55 to 175°C versus -40 to 150°C). These characteristics provide enhanced thermal performance and design margin.

Moisture Sensitivity: The PSMN1R7-30YL,115 features MSL 1 (unlimited moisture sensitivity level) compared to the IRF6635's MSL 3 (168 hours), reducing handling and storage constraints during manufacturing and logistics operations.

Package Considerations: The IRF6635 uses DIRECTFET™ MX packaging, while the PSMN1R7-30YL,115 uses LFPAK56 (Power-SO8) packaging. PCB layout modifications are required for physical accommodation, though electrical functionality remains equivalent.

Frequently Asked Questions (FAQ)

Q: Can the PSMN1R7-30YL,115 directly replace the IRF6635 without circuit modifications?

A: Electrical substitution is valid based on equivalent voltage rating, FET type, and on-resistance characteristics. However, package geometry differs (DIRECTFET™ MX versus LFPAK56), requiring PCB layout redesign for physical placement and thermal management. Gate drive circuitry compatibility must be verified against the substitute's gate charge and threshold voltage specifications.

Q: What are the key electrical parameters that determine substitution compatibility?

A: Substitution compatibility is determined by: (1) identical Drain-Source Voltage rating (30V), (2) matching FET type (N-Channel), (3) equivalent or superior on-resistance (Rds On ≤ 1.8 mOhm), (4) compatible gate threshold voltage (Vgs(th)), (5) gate charge within acceptable range for existing gate drive circuits, and (6) matching maximum gate voltage (±20V).

Q: Does the higher continuous drain current of the PSMN1R7-30YL,115 affect circuit operation?

A: Higher current rating (100A versus 32A) does not negatively affect circuit operation. The substitute provides additional current handling capacity and thermal margin, reducing junction temperature rise during operation. This characteristic improves reliability and extends device lifetime in applications operating below the substitute's maximum current rating.

Q: What compliance advantages does the PSMN1R7-30YL,115 offer?

A: The PSMN1R7-30YL,115 achieves ROHS3 compliance, meeting current regulatory requirements in markets with mandatory RoHS enforcement. The IRF6635's RoHS non-compliant status may restrict procurement in regulated industries and future-generation product designs.

Q: How do package differences impact thermal performance?

A: The LFPAK56 package used by the PSMN1R7-30YL,115 provides different thermal characteristics compared to the DIRECTFET™ MX package. Thermal analysis specific to the substitute package geometry and PCB layout is required to ensure equivalent or improved thermal performance in the target application.

Q: Is gate drive circuit redesign necessary for the substitute part?

A: Gate drive circuit verification is required. The PSMN1R7-30YL,115 exhibits gate charge of 77.9 nC @ 10V compared to the IRF6635's 71 nC @ 4.5V. Existing gate drive circuitry must be evaluated to confirm adequate drive current and voltage margins for reliable switching performance with the substitute device.

Q: What is the impact of the extended operating temperature range?

A: The PSMN1R7-30YL,115 operates across -55 to 175°C (TJ) versus the IRF6635's -40 to 150°C (TJ). The extended range provides additional design margin for applications operating at temperature extremes and improves reliability in thermal cycling environments.

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