IRF6619 N-Channel MOSFET Equivalent & Substitute Parts

Part Overview

The IRF6619 is an N-Channel MOSFET manufactured by Infineon Technologies, featuring a 20V drain-to-source voltage rating and 30A continuous drain current capability in a DirectFET™ MX surface mount package. This component is classified as obsolete, necessitating identification of equivalent substitute parts for ongoing design support and procurement continuity. The IRF6619 series maintains consistent electrical and mechanical specifications across packaging variants, enabling direct substitution within defined parameters.

Substiute Parts

IRF6619
Infineon TechnologiesIn Stock: 3388IRF6619 Datasheet
IRF6619
Current Part
IRF6619TR1
Infineon TechnologiesIn Stock: 2041IRF6619TR1 Datasheet
IRF6619TR1
Parametric Equivalent
IRF6619TR1PBF
Infineon TechnologiesIn Stock: 1385IRF6619TR1PBF Datasheet
IRF6619TR1PBF
Parametric Equivalent

Key Parameters

Parameter Value Unit
Drain-to-Source Voltage (Vdss) 20 V
Continuous Drain Current @ 25°C (Ta) 30 A
Continuous Drain Current @ 25°C (Tc) 150 A
On-State Resistance (Rds On Max) @ 30A, 10V 2.2 mOhm
Gate Threshold Voltage (Vgs(th) Max) @ 250µA 2.45 V
Gate Charge (Qg Max) @ 4.5V 57 nC
Input Capacitance (Ciss Max) @ 10V 5040 pF
Operating Temperature Range -40 to 150 °C
Package Type DirectFET™ Isometric MX Surface Mount

Substitute Part Grouping Explanation

Substitution of the IRF6619 is determined by electrical parameter equivalence and mechanical compatibility. The substitute parts IRF6619TR1 and IRF6619TR1PBF maintain identical electrical specifications across all critical parameters: Vdss, continuous drain current, on-state resistance, gate threshold voltage, gate charge, and input capacitance. Both substitute parts operate within the same temperature range and utilize the same DirectFET™ MX package geometry.

The primary distinction between substitute parts lies in packaging format and compliance certifications. IRF6619TR1 is supplied in Cut Tape (CT) format with RoHS non-compliant status, while IRF6619TR1PBF is supplied in Tape & Reel (TR) format with RoHS3 compliance and improved moisture sensitivity level (MSL 1 versus MSL 3). These differences do not affect electrical interchangeability but influence procurement, handling, and regulatory requirements.

Parameter Comparison

Parameter IRF6619 IRF6619TR1 IRF6619TR1PBF
Manufacturer Infineon Technologies Infineon Technologies Infineon Technologies
FET Type N-Channel N-Channel N-Channel
Vdss 20 V 20 V 20 V
Id @ 25°C (Ta) 30 A 30 A 30 A
Id @ 25°C (Tc) 150 A 150 A 150 A
Rds On (Max) @ 30A, 10V 2.2 mOhm 2.2 mOhm 2.2 mOhm
Vgs(th) (Max) @ 250µA 2.45 V 2.45 V 2.45 V
Gate Charge (Qg Max) @ 4.5V 57 nC 57 nC 57 nC
Ciss (Max) @ 10V 5040 pF 5040 pF 5040 pF
Operating Temperature -40 to 150 °C -40 to 150 °C -40 to 150 °C
Package DirectFET™ Isometric MX DirectFET™ Isometric MX DirectFET™ Isometric MX
Packaging Format Cut Tape (CT) Cut Tape (CT) Tape & Reel (TR)
Product Status Obsolete Obsolete Obsolete
RoHS Status Non-compliant Non-compliant RoHS3 Compliant
MSL Rating 3 (168 Hours) 3 (168 Hours) 1 (Unlimited)

Engineering Selection Recommendations

IRF6619TR1 serves as a direct electrical equivalent with identical electrical performance and package geometry. This part maintains the same Cut Tape packaging format as the original IRF6619. Selection of IRF6619TR1 is appropriate for applications where RoHS compliance is not a regulatory requirement and standard moisture sensitivity handling (MSL 3) is acceptable.

IRF6619TR1PBF provides enhanced compliance and handling characteristics. This variant achieves RoHS3 compliance and features improved moisture sensitivity level (MSL 1), eliminating time-sensitive bake-out requirements associated with MSL 3 components. The Tape & Reel packaging format supports automated assembly processes and high-volume production environments. IRF6619TR1PBF is the preferred selection for new designs, regulatory-compliant applications, and manufacturing environments requiring extended shelf life without moisture conditioning.

Both substitute parts are electrically interchangeable with the original IRF6619 across all specified parameters. Selection between IRF6619TR1 and IRF6619TR1PBF depends on packaging requirements, compliance mandates, and supply chain logistics rather than electrical performance.

Frequently Asked Questions (FAQ)

Q: Are IRF6619TR1 and IRF6619TR1PBF electrically identical to the original IRF6619?

A: Yes. All three parts share identical electrical specifications including Vdss (20V), continuous drain current (30A at Ta, 150A at Tc), on-state resistance (2.2 mOhm @ 30A, 10V), gate threshold voltage (2.45V @ 250µA), gate charge (57 nC @ 4.5V), and input capacitance (5040 pF @ 10V). They operate within the same temperature range (-40 to 150°C) and utilize the same DirectFET™ MX package geometry.

Q: What is the difference between Cut Tape and Tape & Reel packaging?

A: Cut Tape (CT) packaging supplies individual components on tape segments, suitable for manual assembly and small-quantity procurement. Tape & Reel (TR) packaging supplies components on continuous reels, optimized for automated pick-and-place assembly equipment and high-volume manufacturing. Both formats contain identical components; the difference is in supply format and handling methodology.

Q: Why does IRF6619TR1PBF have MSL 1 rating while IRF6619 and IRF6619TR1 have MSL 3?

A: MSL (Moisture Sensitivity Level) rating indicates the component's sensitivity to moisture absorption during storage. MSL 3 components require bake-out conditioning within 168 hours of exposure to ambient humidity before soldering. MSL 1 components have unlimited shelf life without moisture conditioning requirements. IRF6619TR1PBF's improved MSL rating reduces handling complexity and storage constraints.

Q: Is RoHS3 compliance required for my application?

A: RoHS3 compliance is mandatory for products sold in the European Union and many other regulated markets. If your application or end-market requires RoHS compliance, IRF6619TR1PBF is the appropriate selection. For applications without regulatory compliance requirements, IRF6619TR1 provides equivalent electrical performance at potentially lower cost.

Q: Can I substitute these parts in existing PCB designs without layout modifications?

A: Yes. All three parts utilize the same DirectFET™ Isometric MX package geometry and pinout. PCB layouts, footprints, and assembly processes require no modification for substitution between IRF6619, IRF6619TR1, and IRF6619TR1PBF.

Q: What inventory levels are available for each part?

A: IRF6619 has 3330 pieces in stock, IRF6619TR1 has 1979 pieces in stock, and IRF6619TR1PBF has 1361 pieces in stock. Inventory levels should be verified with your supplier for current availability.

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