IRF644STRLPBF N-Channel MOSFET Equivalent & Substitute Parts

Part Overview

The IRF644STRLPBF is an N-Channel Metal Oxide Semiconductor Field Effect Transistor (MOSFET) manufactured by Vishay Siliconix. This device is rated for 250V drain-to-source voltage with a continuous drain current of 14A at 25°C case temperature. The component is housed in a Surface Mount TO-263 (D2PAK) package and is designed for applications requiring high-voltage switching and power management. The part maintains Active product status and is RoHS3 compliant with MSL Level 1 (Unlimited moisture sensitivity). Substitute parts are identified when original inventory is unavailable, when procurement lead times require alternative sourcing, or when design flexibility permits equivalent device selection within the same electrical and mechanical specifications.

Substiute Parts

IRF644STRLPBF

Vishay SiliconixIn Stock: 1698IRF644STRLPBF Datasheet

Current PartRFQ

IRF644STRRPBF

Vishay SiliconixIn Stock: 1858IRF644STRRPBF Datasheet

Parametric EquivalentRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the IRF644STRLPBF are identified based on strict electrical and mechanical parameter equivalence. The substitution logic is based on the following critical parameters that must remain constant across all equivalent devices:

Electrical Parameters (Must Match):

• Drain to Source Voltage (Vdss): 250V
• Continuous Drain Current (Id) @ 25°C: 14A (Tc)
• Drive Voltage (Max Rds On): 10V
• Rds On (Max) @ Id, Vgs: 280mOhm @ 8.4A, 10V
• Vgs(th) (Max) @ Id: 4V @ 250µA
• Gate Charge (Qg) (Max) @ Vgs: 68nC @ 10V
• Vgs (Max): ±20V
• Input Capacitance (Ciss) (Max) @ Vds: 1300pF @ 25V
• Power Dissipation (Max): 3.1W (Ta), 125W (Tc)
• Operating Temperature Range: -55°C to 150°C (TJ)

Mechanical Parameters (Must Match):

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Mounting Type: Surface Mount
• Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
• Supplier Device Package: TO-263 (D2PAK)

Compliance Parameters (Must Match):

• RoHS Status: ROHS3 Compliant
• Moisture Sensitivity Level (MSL): 1 (Unlimited)
• Product Status: Active

Substitute parts sharing identical electrical, mechanical, and compliance specifications are classified as parametric equivalents and are suitable for direct replacement in circuit designs without modification to PCB layout, thermal management, or gate drive circuitry.

Parameter Comparison

Engineering Selection Recommendations

The IRF644STRRPBF is a direct parametric equivalent to the IRF644STRLPBF. Both devices are manufactured by Vishay Siliconix and share identical electrical specifications, mechanical packaging, and compliance certifications. Selection between these two part numbers is based on procurement availability and inventory status rather than technical performance differences.

Both parts maintain Active product status, ensuring continued manufacturer support and availability through authorized distribution channels. Both devices are RoHS3 compliant and carry MSL Level 1 (Unlimited) moisture sensitivity classification, indicating no special storage or handling requirements beyond standard component handling practices.

The TO-263 (D2PAK) surface mount package is identical across both devices, permitting direct PCB layout reuse without modification to thermal management structures, solder pad dimensions, or component placement.

Selection of either part number is appropriate for applications requiring 250V drain-to-source voltage capability, 14A continuous drain current, and the specified thermal and electrical performance characteristics. No design modifications, circuit re-evaluation, or thermal re-analysis are required when substituting between these equivalent devices.

Frequently Asked Questions (FAQ)

Q: Can the IRF644STRRPBF be used as a direct replacement for the IRF644STRLPBF in existing circuit designs?

A: Yes. The IRF644STRRPBF is a parametric equivalent with identical electrical specifications, gate drive requirements, thermal characteristics, and package dimensions. Direct substitution is permitted without circuit modification or PCB redesign.

Q: Are there differences in the TO-263 (D2PAK) package between these two part numbers?

A: No. Both devices use the identical TO-263-3 D2PAK (2 Leads + Tab) surface mount package. PCB footprints, solder pad layouts, and thermal tab dimensions are identical, permitting direct component interchange on the same PCB assembly.

Q: Do both parts require identical gate drive voltage and current specifications?

A: Yes. Both devices share identical gate threshold voltage (Vgs(th)) of 4V @ 250µA, maximum gate voltage (Vgs) of ±20V, and gate charge (Qg) of 68nC @ 10V. Gate drive circuits designed for one part number operate identically with the other.

Q: What is the difference between the IRF644STRLPBF and IRF644STRRPBF part numbers?

A: The difference lies in the packaging designation suffix. The "L" in STRLPBF and "R" in STRRPBF indicate different tape and reel configurations for automated assembly. Both devices are electrically and mechanically identical. Selection is based on manufacturing line compatibility and inventory availability.

Q: Are both parts suitable for high-temperature applications?

A: Yes. Both devices operate across the identical temperature range of -55°C to 150°C (TJ). Thermal design calculations, heat sink requirements, and operating point analysis remain unchanged between the two part numbers.

Q: Do both parts comply with RoHS and environmental regulations?

A: Yes. Both IRF644STRLPBF and IRF644STRRPBF are RoHS3 compliant and carry identical ECCN (EAR99) and HTSUS (8541.29.0095) classifications. Both devices carry MSL Level 1 (Unlimited) moisture sensitivity, requiring no special storage or desiccant handling.

Q: Can these parts be used interchangeably in production assembly?

A: Yes. Both parts are qualified for surface mount automated assembly and carry identical moisture sensitivity levels. Production line changeover between these part numbers requires only bill-of-materials (BOM) update and component reel configuration adjustment; no process parameter changes are necessary.

Q: What thermal performance can be expected from both devices?

A: Both devices dissipate a maximum of 3.1W at ambient temperature (Ta) and 125W at case temperature (Tc). Thermal management design, heat sink selection, and PCB copper area requirements are identical for both part numbers.