IRF630STRR Equivalent & Substitute Parts

Part Overview

The IRF630STRR is an N-Channel MOSFET manufactured by Vishay Siliconix, rated for 200V drain-to-source voltage with 9A continuous drain current in a surface mount TO-263 (D2PAK) package. This device is classified as obsolete, which necessitates identification of equivalent and substitute components for ongoing design support and procurement.

The IRF630STRR serves in switching and amplification applications requiring moderate voltage and current handling in compact surface mount form factors. Due to its obsolete status, equivalent parts with active product status or superior electrical characteristics are available to ensure design continuity and supply chain reliability.

Key Parameters

Parameter	Value	Unit
Drain to Source Voltage (Vdss)	200	V
Continuous Drain Current (Id) @ 25°C	9	A
Drive Voltage (Max Rds On)	10	V
Rds On (Max) @ Id, Vgs	400 mOhm @ 5.4A, 10V	mOhm
Gate Threshold Voltage (Vgs(th)) @ Id	4	V @ 250µA
Gate Charge (Qg) @ Vgs	43	nC @ 10V
Maximum Gate Voltage (Vgs)	±20	V
Input Capacitance (Ciss) @ Vds	800	pF @ 25V
Power Dissipation (Max)	3 (Ta), 74 (Tc)	W
Operating Temperature Range	-55 to 150	°C (TJ)
Package Type	TO-263 (D2PAK)	Surface Mount
FET Type	N-Channel
Technology	MOSFET (Metal Oxide)

Substitute Part Grouping Explanation

Substitution of the IRF630STRR is determined by electrical and mechanical compatibility across the following critical parameters:

Electrical Compatibility Criteria:

Drain to Source Voltage (Vdss): Must equal or exceed 200V
Continuous Drain Current (Id): Must equal or exceed 9A at 25°C
Gate Threshold Voltage (Vgs(th)): Must be compatible with 4V @ 250µA specification
Maximum Gate Voltage (Vgs): Must support ±20V operation
FET Type: Must be N-Channel
Technology: Must be MOSFET (Metal Oxide)

Mechanical Compatibility Criteria:

Mounting Type: Surface Mount required
Package: TO-263 (D2PAK) or equivalent footprint compatibility
Lead Configuration: 2 Leads + Tab standard

Substitute Categories:

Parametric Equivalents (IRF630STRLPBF, IRF630STRRPBF): Identical electrical specifications to the main part with active product status and RoHS3 compliance. These parts are direct replacements with no performance trade-offs.

Manufacturer Recommended Alternatives (IRF630NSTRLPBF, RCJ120N20TL, STB19NF20): Parts that meet or exceed the electrical requirements of the IRF630STRR while offering enhanced performance characteristics such as lower on-resistance, reduced gate charge, or higher current ratings. These alternatives provide design flexibility and improved thermal performance.

Parameter Comparison

Parameter	IRF630STRR	IRF630STRLPBF	IRF630STRRPBF	IRF630NSTRLPBF	RCJ120N20TL	STB19NF20
Manufacturer	Vishay Siliconix	Vishay Siliconix	Vishay Siliconix	Infineon Technologies	Rohm Semiconductor	STMicroelectronics
Vdss (V)	200	200	200	200	200	200
Id @ 25°C (A)	9	9	9	9.3	12	15
Rds On (Max) @ 10V (mOhm)	400 @ 5.4A	400 @ 5.4A	400 @ 5.4A	300 @ 5.4A	325 @ 6A	160 @ 7.5A
Vgs(th) @ 250µA (V)	4	4	4	4	5.25 @ 1mA	4
Qg @ 10V (nC)	43	43	43	35	15	24
Ciss @ 25V (pF)	800	800	800	575	740	800
Vgs (Max) (V)	±20	±20	±20	±20	±30	±20
Power Dissipation (Tc) (W)	74	74	74	82	40	90
Operating Temperature (°C)	-55 to 150	-55 to 150	-55 to 150	-55 to 175	to 150	-55 to 150
Package	TO-263 (D2PAK)	TO-263 (D2PAK)	TO-263 (D2PAK)	D2PAK	LPTS	D2PAK
Product Status	Obsolete	Active	Active	Obsolete	Active	Active
RoHS Status	Non-compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant

Engineering Selection Recommendations

For Direct Replacement (Obsolete to Active):

IRF630STRLPBF and IRF630STRRPBF are the primary substitutes for the IRF630STRR. Both parts are manufactured by Vishay Siliconix with identical electrical specifications and active product status. These parts carry ROHS3 compliance, addressing regulatory requirements that the original IRF630STRR does not meet. The only distinction between these two options is packaging format: IRF630STRLPBF is supplied in Tape & Reel (TR) format, while IRF630STRRPBF is also supplied in Tape & Reel (TR) format. Both are suitable for production environments requiring compliant components.

For Performance Enhancement:

STB19NF20 (STMicroelectronics) offers superior electrical performance with 15A continuous drain current, 160 mOhm on-resistance, and 90W power dissipation at Tc. This part is recommended when thermal management or current handling capacity requires improvement over the original specification. The STB19NF20 maintains the same 200V Vdss rating and D2PAK package footprint, ensuring mechanical compatibility.

RCJ120N20TL (Rohm Semiconductor) provides 12A continuous drain current with 325 mOhm on-resistance and reduced gate charge (15 nC). This part is suitable for applications where switching speed and gate drive efficiency are critical. The LPTS package maintains TO-263 footprint compatibility.

IRF630NSTRLPBF (Infineon Technologies) delivers 9.3A continuous drain current with improved on-resistance (300 mOhm) and reduced gate charge (35 nC) compared to the IRF630STRR. Extended operating temperature range to 175°C provides additional thermal margin. This part is classified as obsolete but offers intermediate performance between the original part and higher-rated alternatives.

Compliance Considerations:

All recommended active substitutes carry ROHS3 compliance certification. The IRF630STRR is RoHS non-compliant; migration to any active substitute addresses regulatory requirements for new designs and procurement cycles.

Frequently Asked Questions (FAQ)

Q: Can IRF630STRLPBF and IRF630STRRPBF be used interchangeably with IRF630STRR?

A: Yes. Both parts are parametric equivalents with identical electrical specifications (200V Vdss, 9A Id, 400 mOhm Rds On, 43 nC Qg). The primary difference is packaging format (Tape & Reel). Both are pin-compatible in TO-263 (D2PAK) footprints and require no circuit modifications.

Q: What is the advantage of using STB19NF20 over IRF630STRLPBF?

A: STB19NF20 provides higher continuous drain current (15A vs. 9A), significantly lower on-resistance (160 mOhm vs. 400 mOhm), and higher power dissipation capability (90W vs. 74W at Tc). These improvements reduce heat generation and enable higher current applications. The trade-off is higher gate charge (24 nC vs. 43 nC), which may require adjusted gate drive circuits in high-frequency switching applications.

Q: Is the RCJ120N20TL package compatible with the IRF630STRR footprint?

A: RCJ120N20TL uses an LPTS package, which maintains TO-263 footprint compatibility with the IRF630STRR D2PAK package. Pin assignments and lead spacing are equivalent, allowing direct PCB substitution without layout modifications.

Q: Why is IRF630NSTRLPBF listed as a substitute if it is also obsolete?

A: IRF630NSTRLPBF is included as a manufacturer-recommended alternative because it offers improved electrical performance (300 mOhm Rds On vs. 400 mOhm, 35 nC Qg vs. 43 nC) and extended operating temperature range (-55°C to 175°C vs. -55°C to 150°C). While obsolete, it provides a performance bridge between the original IRF630STRR and fully active alternatives. For new designs, active substitutes (IRF630STRLPBF, STB19NF20, RCJ120N20TL) are preferred.

Q: What are the key electrical parameters that determine substitution compatibility?

A: Substitution compatibility is determined by: (1) Drain-to-Source Voltage (Vdss) equal to or exceeding 200V, (2) Continuous Drain Current (Id) equal to or exceeding 9A at 25°C, (3) Gate Threshold Voltage (Vgs(th)) compatible with 4V operation, (4) Maximum Gate Voltage (Vgs) supporting ±20V, (5) N-Channel FET type, and (6) MOSFET (Metal Oxide) technology. All listed substitutes meet or exceed these criteria.

Q: Are there thermal performance differences between the substitute parts?

A: Yes. Power dissipation at Tc varies: IRF630STRR and IRF630STRLPBF/STRRPBF dissipate 74W, IRF630NSTRLPBF dissipates 82W, RCJ120N20TL dissipates 40W, and STB19NF20 dissipates 90W. Higher power dissipation capability indicates better thermal performance under continuous operation. Selection depends on application thermal requirements and heatsinking capability.

Q: Do all substitute parts meet RoHS compliance requirements?

A: All active substitute parts (IRF630STRLPBF, IRF630STRRPBF, RCJ120N20TL, STB19NF20) carry ROHS3 compliance certification. The original IRF630STRR is RoHS non-compliant. For applications requiring regulatory compliance, active substitutes are mandatory.

Q: What is the difference between Tape & Reel (TR) and Cut Tape (CT) packaging?

A: Tape & Reel (TR) packaging is supplied on continuous reels suitable for automated pick-and-place assembly in high-volume production. Cut Tape (CT) packaging is supplied in individual tape segments suitable for lower-volume or manual assembly. Both formats contain identical components; packaging selection depends on manufacturing process requirements.

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