IRF3709STRL N-Channel 30V 90A MOSFET Equivalent & Substitute Parts

Part Overview

The IRF3709STRL is an N-Channel MOSFET manufactured by Infineon Technologies, rated for 30V drain-to-source voltage and 90A continuous drain current in a D2PAK surface mount package. This device is part of the HEXFET® series and is classified as obsolete. Due to its obsolete status, equivalent substitute parts from active product lines are necessary to maintain design continuity and ensure long-term component availability for new production and field replacements.

Substiute Parts

IRF3709STRL
Infineon TechnologiesIn Stock: 1134IRF3709STRL Datasheet
IRF3709STRL
Current Part
PSMN017-30BL,118
Nexperia USA Inc.In Stock: 2850PSMN017-30BL,118 Datasheet
PSMN017-30BL,118
MFR Recommended
PSMN4R3-30BL,118
Nexperia USA Inc.In Stock: 10797PSMN4R3-30BL,118 Datasheet
PSMN4R3-30BL,118
MFR Recommended
STB70NF03LT4
STMicroelectronicsIn Stock: 25184STB70NF03LT4 Datasheet
STB70NF03LT4
MFR Recommended

Key Parameters

Parameter Value Unit
Drain-to-Source Voltage (Vdss) 30 V
Continuous Drain Current (Id) @ 25°C 90 A (Tc)
On-State Resistance (Rds On Max) @ Id, Vgs 9 mOhm @ 15A, 10V mOhm
Gate Threshold Voltage (Vgs(th) Max) @ Id 3 V @ 250µA
Gate Charge (Qg Max) @ Vgs 41 nC @ 5V
Input Capacitance (Ciss Max) @ Vds 2672 pF @ 16V
Power Dissipation (Max) 3.1 (Ta), 120 (Tc) W
Operating Temperature Range -55 to 150 °C (TJ)
Package Type D2PAK (TO-263-3) Surface Mount
Product Status Obsolete

Substitute Part Grouping Explanation

Substitution of the IRF3709STRL is determined by the following critical electrical and mechanical parameters:

Primary Substitution Criteria:

  • Drain-to-Source Voltage (Vdss): Must equal 30V
  • Package Type: Must be D2PAK (TO-263-3) surface mount
  • FET Type: Must be N-Channel MOSFET
  • Mounting: Surface mount configuration

Secondary Compatibility Parameters:

  • Continuous Drain Current (Id): Substitute must meet or exceed 90A rating
  • On-State Resistance (Rds On): Lower or equivalent values are acceptable
  • Gate Threshold Voltage (Vgs(th)): Must be within ±20V maximum gate voltage specification
  • Operating Temperature Range: Must support -55°C to 150°C minimum

Acceptable Substitutes:

The PSMN4R3-30BL,118 (Nexperia) and STB70NF03LT4 (STMicroelectronics) meet the primary substitution criteria with 30V Vdss and D2PAK packaging. The PSMN4R3-30BL,118 provides superior current handling at 100A, while the STB70NF03LT4 provides 70A continuous drain current. Both are active products with RoHS3 compliance.

The PSMN017-30BL,118 (Nexperia) meets voltage and package requirements but provides only 32A continuous drain current, making it suitable only for applications where the 90A rating is not fully utilized.

Parameter Comparison

Parameter IRF3709STRL (Main) PSMN4R3-30BL,118 PSMN017-30BL,118 STB70NF03LT4
Manufacturer Infineon Technologies Nexperia USA Inc. Nexperia USA Inc. STMicroelectronics
Vdss (V) 30 30 30 30
Id @ 25°C (A, Tc) 90 100 32 70
Rds On Max (mOhm) 9 @ 15A, 10V 4.1 @ 15A, 10V 17 @ 10A, 10V 9.5 @ 35A, 10V
Vgs(th) Max (V) 3 @ 250µA 2.15 @ 1mA 2.15 @ 1mA 1 @ 250µA
Qg Max (nC) 41 @ 5V 41.5 @ 10V 10.7 @ 10V 30 @ 5V
Ciss Max (pF) 2672 @ 16V 2400 @ 15V 552 @ 15V 1440 @ 25V
Power Dissipation Max (W, Tc) 120 103 47 100
Operating Temperature (°C, TJ) -55 to 150 -55 to 175 -55 to 175 -55 to 175
Package D2PAK (TO-263-3) D2PAK (TO-263-3) D2PAK (TO-263-3) D2PAK (TO-263-3)
Product Status Obsolete Active Obsolete Active
RoHS Status Non-compliant ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant

Engineering Selection Recommendations

Primary Recommendation: PSMN4R3-30BL,118

The PSMN4R3-30BL,118 is the preferred substitute for the IRF3709STRL. This device is manufactured by Nexperia USA Inc. and maintains active product status. It provides 100A continuous drain current, exceeding the original 90A specification, with superior on-state resistance of 4.1 mOhm compared to 9 mOhm. The device is RoHS3 compliant and supports an extended operating temperature range of -55°C to 175°C. Inventory availability is substantial at 10,750 pieces. The D2PAK package is identical to the original part, ensuring direct mechanical compatibility.

Secondary Recommendation: STB70NF03LT4

The STB70NF03LT4, manufactured by STMicroelectronics as part of the STripFET™ II series, is an active product suitable for applications where 70A continuous drain current is sufficient. This device provides 100W power dissipation and is RoHS3 compliant with extended temperature range support (-55°C to 175°C). Inventory availability is high at 25,100 pieces. The D2PAK package provides identical mechanical compatibility.

Not Recommended: PSMN017-30BL,118

The PSMN017-30BL,118 is classified as obsolete and provides only 32A continuous drain current, which is insufficient for applications requiring the full 90A capability of the original IRF3709STRL. This part should be selected only for applications with reduced current requirements.

Frequently Asked Questions (FAQ)

Q: Can the PSMN4R3-30BL,118 directly replace the IRF3709STRL in all applications?

A: The PSMN4R3-30BL,118 is mechanically and electrically compatible with the IRF3709STRL in D2PAK package applications. Both devices share identical 30V Vdss rating and D2PAK surface mount packaging. The PSMN4R3-30BL,118 provides superior current handling (100A vs. 90A) and lower on-state resistance (4.1 mOhm vs. 9 mOhm), making it suitable for direct substitution. However, circuit board layout and thermal management design should be verified to ensure compatibility with the substitute device's thermal characteristics.

Q: What is the key difference between the PSMN4R3-30BL,118 and STB70NF03LT4?

A: Both devices are active products with 30V Vdss and D2PAK packaging. The PSMN4R3-30BL,118 provides 100A continuous drain current with 4.1 mOhm on-state resistance, while the STB70NF03LT4 provides 70A continuous drain current with 9.5 mOhm on-state resistance. The PSMN4R3-30BL,118 is the closer electrical match to the IRF3709STRL. Selection between these two depends on the specific current requirements of the application.

Q: Why is the PSMN017-30BL,118 listed as a substitute if it provides only 32A?

A: The PSMN017-30BL,118 meets the primary substitution criteria of 30V Vdss and D2PAK packaging. It is listed as a substitute for applications where the full 90A current rating is not required. For designs operating at lower current levels, this device provides a valid alternative. However, for applications requiring the full 90A capability, the PSMN4R3-30BL,118 or STB70NF03LT4 must be selected.

Q: Are there any temperature range limitations when substituting the IRF3709STRL?

A: The IRF3709STRL operates from -55°C to 150°C (TJ). Both recommended substitutes (PSMN4R3-30BL,118 and STB70NF03LT4) support extended temperature ranges of -55°C to 175°C. This extended range provides additional design margin and does not introduce any temperature-related compatibility issues.

Q: What is the significance of RoHS compliance in selecting a substitute?

A: The IRF3709STRL is RoHS non-compliant, while all recommended substitutes (PSMN4R3-30BL,118, STB70NF03LT4, and PSMN017-30BL,118) are RoHS3 compliant. For new designs and production runs subject to RoHS regulations, the compliant substitutes are required. For legacy system maintenance, RoHS compliance may not be a constraint, but using compliant parts ensures regulatory alignment for future production.

Q: Is the D2PAK package identical across all listed parts?

A: Yes. All parts listed—IRF3709STRL, PSMN4R3-30BL,118, PSMN017-30BL,118, and STB70NF03LT4—use the D2PAK (TO-263-3) surface mount package with 2 leads plus tab configuration. This ensures identical PCB footprint and mechanical compatibility without requiring board redesign.

Q: What should be verified before implementing a substitute in production?

A: Electrical verification should focus on gate drive voltage compatibility (all substitutes support ±20V maximum gate voltage), on-state resistance performance under actual load conditions, and thermal management adequacy. Mechanical verification should confirm D2PAK package compatibility with existing PCB layouts and thermal interface materials. Functional testing should validate performance in the specific application circuit before full production implementation.

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