IRF2804LPBF N-Channel MOSFET 40V 75A Equivalent & Substitute Parts

Part Overview

The IRF2804LPBF is an N-Channel MOSFET manufactured by Infineon Technologies, rated for 40V drain-to-source voltage and 75A continuous drain current in a Through Hole TO-262 package. This device is classified as "Not For New Designs," indicating it has reached end-of-life status. The HEXFET® series component delivers 300W maximum power dissipation and operates across -55°C to 175°C junction temperature range. Due to its obsolescence status, equivalent and substitute parts are necessary for ongoing maintenance, repair, and legacy system support where direct replacement or functional alternatives are required.

Substiute Parts

IRF2804LPBF

Infineon TechnologiesIn Stock: 2185IRF2804LPBF Datasheet

Current PartRFQ

IRF3205ZLPBF

Infineon TechnologiesIn Stock: 3722IRF3205ZLPBF Datasheet

MFR RecommendedRFQ

FDMS8333L

onsemiIn Stock: 35167FDMS8333L Datasheet

DirectRFQ

STI270N4F3

STMicroelectronicsIn Stock: 1686STI270N4F3 Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the IRF2804LPBF is determined by the following critical electrical and mechanical parameters:

Primary Substitution Criteria:

• Drain-to-Source Voltage (Vdss): Must be equal to or greater than 40V
• Continuous Drain Current (Id): Must support 75A or higher at 25°C
• On-Resistance (Rds On): Lower or equivalent values ensure thermal performance
• Gate Threshold Voltage (Vgs(th)): Must remain within compatible gate drive ranges
• Mounting Type and Package: Through Hole packages (TO-262, I2PAK) maintain mechanical compatibility
• Operating Temperature Range: Must encompass -55°C to 175°C minimum
• RoHS Compliance: ROHS3 compliance required for regulatory alignment

Substitution Logic: Parts are grouped into two categories based on package compatibility and electrical performance:

1. Direct Through-Hole Substitutes (TO-262 package): IRF3205ZLPBF and STI270N4F3 maintain identical mounting footprints and Through Hole assembly compatibility.

2. Functional Equivalent with Package Variation (Surface Mount): FDMS8333L provides equivalent voltage and current ratings but requires different PCB assembly methodology due to 8-PQFN surface mount package.

Parameter Comparison

Engineering Selection Recommendations

IRF3205ZLPBF (Infineon Technologies)

This part is a manufacturer-recommended substitute with identical Through Hole TO-262 package compatibility. It maintains the same gate threshold voltage (4V @ 250µA) and operating temperature range (-55°C to 175°C). The higher Vdss rating (55V vs. 40V) provides additional voltage margin for applications with transient overvoltage conditions. However, the higher Rds On value (6.5mOhm @ 66A vs. 2.3mOhm @ 75A) results in increased on-state power dissipation. The lower power dissipation rating (170W vs. 300W) and reduced gate charge (110nC vs. 240nC) indicate faster switching characteristics. Product status is Obsolete; inventory availability is 3640 units. ROHS3 compliance and RoHS certification are maintained.

FDMS8333L (onsemi)

This part provides functional equivalence with matching 40V Vdss and 76A continuous drain current (Tc rating). The Active product status ensures long-term availability and supply chain stability. The 8-PQFN surface mount package requires PCB redesign and different assembly processes compared to Through Hole mounting. Lower gate charge (64nC) and input capacitance (4545pF) support faster switching operation. The reduced operating temperature maximum (150°C vs. 175°C) may limit use in high-temperature applications. Inventory availability is 35100 units. ROHS3 compliance is maintained.

STI270N4F3 (STMicroelectronics)

This part is a manufacturer-recommended substitute with Through Hole I2PAK package compatibility. It delivers superior continuous drain current (160A vs. 75A) and higher power dissipation capability (330W vs. 300W), making it suitable for higher-current applications. The Rds On value (2.6mOhm @ 80A) is comparable to the original part. Gate threshold voltage (4V @ 250µA) and operating temperature range (-55°C to 175°C) match the IRF2804LPBF. AEC-Q101 automotive qualification provides additional reliability assurance. Product status is Obsolete; inventory availability is 1585 units. ROHS3 compliance is maintained.

Frequently Asked Questions (FAQ)

Q: Can IRF3205ZLPBF directly replace IRF2804LPBF in existing PCB assemblies?

A: Yes. Both parts use identical TO-262-3 Through Hole package geometry and pinout. No PCB modifications are required. However, the higher Rds On value (6.5mOhm vs. 2.3mOhm) will increase on-state power dissipation by approximately 2.8 times at rated current, requiring thermal management verification.

Q: Is FDMS8333L suitable for Through Hole applications?

A: No. FDMS8333L uses an 8-PQFN (5x6) surface mount package, which is incompatible with Through Hole PCB designs. PCB redesign and reflow soldering assembly are required. This part is recommended only for new designs or systems undergoing PCB revision.

Q: What are the key differences between STI270N4F3 and IRF2804LPBF?

A: STI270N4F3 provides double the continuous drain current (160A vs. 75A) and higher power dissipation (330W vs. 300W). The I2PAK package footprint differs from TO-262-3, requiring PCB layout modification. Both maintain 40V Vdss and -55°C to 175°C operating range. STI270N4F3 includes AEC-Q101 automotive qualification.

Q: Which substitute part has the best long-term availability?

A: FDMS8333L carries Active product status with 35100 units in stock, ensuring continued supply and manufacturing support. IRF3205ZLPBF and STI270N4F3 are both Obsolete, with limited inventory (3640 and 1585 units respectively) and no new production planned.

Q: Are all substitute parts RoHS compliant?

A: Yes. IRF3205ZLPBF, FDMS8333L, and STI270N4F3 all carry ROHS3 compliance certification, matching the environmental and regulatory requirements of the original IRF2804LPBF.

Q: Can STI270N4F3 be used in applications requiring exactly 75A continuous current?

A: Yes. STI270N4F3 is rated for 160A continuous drain current, which exceeds the 75A requirement. The part will operate well within its current rating, providing thermal margin and extended component life. However, the I2PAK package requires PCB redesign compared to TO-262-3.

Q: What is the impact of lower gate charge in FDMS8333L on circuit performance?

A: Lower gate charge (64nC vs. 240nC) reduces gate drive power requirements and enables faster switching transitions. This improves efficiency in PWM and switching applications but requires verification that existing gate drive circuits can accommodate the different charge profile and lower threshold voltage (3V vs. 4V).