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IR4426SPBF Low-Side Gate Driver IC Equivalent & Substitute Parts
Part Overview
The IR4426SPBF is a low-side gate driver IC manufactured by Infineon Technologies, designed for driving IGBT and N-Channel MOSFET gates in power management applications. This device operates with a supply voltage range of 6V to 20V and features inverting logic with independent dual-channel configuration in an 8-SOIC package.
The IR4426SPBF is classified as obsolete. Equivalent and substitute parts are necessary to maintain design continuity and ensure component availability for new production runs and field replacements. Substitute parts must maintain functional compatibility across critical electrical parameters including supply voltage range, output current capability, logic thresholds, and thermal operating range.
Substiute Parts
Key Parameters
| Parameter | IR4426SPBF Value |
|---|---|
| Manufacturer | Infineon Technologies |
| Driven Configuration | Low-Side |
| Number of Drivers | 2 |
| Gate Type | IGBT, N-Channel MOSFET |
| Voltage - Supply | 6V ~ 20V |
| Logic Voltage - VIL, VIH | 0.8V, 2.7V |
| Current - Peak Output (Source, Sink) | 2.3A, 3.3A |
| Input Type | Inverting |
| Rise / Fall Time (Typ) | 15ns, 10ns |
| Operating Temperature | -40°C ~ 150°C (TJ) |
| Package / Case | 8-SOIC (0.154", 3.90mm Width) |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 2 (1 Year) |
Substitute Part Grouping Explanation
Substitute parts for the IR4426SPBF are selected based on strict electrical and mechanical compatibility criteria. The primary substitution parameters are:
Critical Matching Parameters:
- Driven configuration (Low-Side)
- Number of drivers (2 independent channels)
- Input type (Inverting logic)
- Package type (8-SOIC form factor)
- Gate type compatibility (IGBT and/or N-Channel MOSFET support)
Allowable Parameter Ranges for Substitution:
- Supply voltage range must encompass or exceed the 6V to 20V requirement
- Logic voltage thresholds (VIL, VIH) must be compatible with system logic levels
- Peak output current (source and sink) must meet or exceed application demands
- Operating temperature range must cover the required thermal envelope
- Rise and fall times must be acceptable for the switching application
Substitute parts are grouped by manufacturer and packaging configuration. Parts with identical electrical specifications but different packaging (Tube vs. Cut Tape vs. Tape & Reel) are considered direct substitutes. Parts with enhanced specifications (wider voltage range, higher current capability, faster switching times, or extended temperature range) are compatible substitutes when the application permits.
Parameter Comparison
| Parameter | IR4426SPBF | IR4426STRPBF | IXDI602SI | IXDI602SIA | IXDI602SIATR | IXDI602SITR | LM5111-2M/NOPB | LM5111-2MX/NOPB | MAX4426CSA+ | MAX4426CSA+T | MAX4426ESA+ |
|---|---|---|---|---|---|---|---|---|---|---|---|
| Manufacturer | Infineon | Infineon | IXYS | IXYS | IXYS | IXYS | Texas Instruments | Texas Instruments | Analog Devices/Maxim | Analog Devices/Maxim | Analog Devices/Maxim |
| Driven Configuration | Low-Side | Low-Side | Low-Side | Low-Side | Low-Side | Low-Side | Low-Side | Low-Side | Low-Side | Low-Side | Low-Side |
| Number of Drivers | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| Gate Type | IGBT, N-Channel MOSFET | IGBT, N-Channel MOSFET | IGBT, N-Channel, P-Channel MOSFET | IGBT, N-Channel, P-Channel MOSFET | IGBT, N-Channel, P-Channel MOSFET | IGBT, N-Channel, P-Channel MOSFET | N-Channel MOSFET | N-Channel MOSFET | N-Channel, P-Channel MOSFET | N-Channel, P-Channel MOSFET | N-Channel, P-Channel MOSFET |
| Voltage - Supply | 6V ~ 20V | 6V ~ 20V | 4.5V ~ 35V | 4.5V ~ 35V | 4.5V ~ 35V | 4.5V ~ 35V | 3.5V ~ 14V | 3.5V ~ 14V | 4.5V ~ 18V | 4.5V ~ 18V | 4.5V ~ 18V |
| Logic Voltage - VIL, VIH | 0.8V, 2.7V | 0.8V, 2.7V | 0.8V, 3V | 0.8V, 3V | 0.8V, 3V | 0.8V, 3V | 0.8V, 2.2V | 0.8V, 2.2V | 0.8V, 2.4V | 0.8V, 2.4V | 0.8V, 2.4V |
| Current - Peak Output (Source, Sink) | 2.3A, 3.3A | 2.3A, 3.3A | 2A, 2A | 2A, 2A | 2A, 2A | 2A, 2A | 3A, 5A | 3A, 5A | 1.5A, 1.5A | 1.5A, 1.5A | 1.5A, 1.5A |
| Input Type | Inverting | Inverting | Inverting | Inverting | Inverting | Inverting | Inverting | Inverting | Inverting | Inverting | Inverting |
| Rise / Fall Time (Typ) | 15ns, 10ns | 15ns, 10ns | 7.5ns, 6.5ns | 7.5ns, 6.5ns | 7.5ns, 6.5ns | 7.5ns, 6.5ns | 14ns, 12ns | 14ns, 12ns | 20ns, 20ns | 20ns, 20ns | 20ns, 20ns |
| Operating Temperature | -40°C ~ 150°C (TJ) | -40°C ~ 150°C (TJ) | -55°C ~ 150°C (TJ) | -55°C ~ 150°C (TJ) | -55°C ~ 150°C (TJ) | -55°C ~ 150°C (TJ) | -40°C ~ 125°C (TJ) | -40°C ~ 125°C (TJ) | 0°C ~ 70°C (TA) | 0°C ~ 70°C (TA) | -40°C ~ 85°C (TA) |
| Package / Case | 8-SOIC | 8-SOIC | 8-SOIC-EP | 8-SOIC | 8-SOIC | 8-SOIC-EP | 8-SOIC | 8-SOIC | 8-SOIC | 8-SOIC | 8-SOIC |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 2 (1 Year) | 2 (1 Year) | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) |
| Product Status | Obsolete | Active | Active | Active | Active | Active | Last Time Buy | Active | Active | Active | Active |
Engineering Selection Recommendations
Direct Substitutes (Infineon IR4426 Series): IR4426STRPBF is the active production equivalent of the obsolete IR4426SPBF. Both parts share identical electrical specifications and 8-SOIC packaging. The primary difference is packaging configuration: IR4426SPBF is supplied in Tube format, while IR4426STRPBF is supplied in Cut Tape and Digi-Reel format. IR4426STRPBF is recommended as the primary replacement for new designs and production continuity.
IXYS IXDI602 Series Substitutes: The IXDI602SI, IXDI602SIA, IXDI602SIATR, and IXDI602SITR variants are compatible substitutes with enhanced specifications. These parts feature a wider supply voltage range (4.5V to 35V), extended lower temperature rating (-55°C), and faster switching times (7.5ns rise, 6.5ns fall). IXDI602SI and IXDI602SITR include exposed pad (8-SOIC-EP) packaging for improved thermal performance. All IXDI602 variants maintain the required 2-channel independent low-side configuration with inverting logic. These parts are suitable for applications requiring extended voltage headroom or improved thermal management.
Texas Instruments LM5111 Series Substitutes: LM5111-2M/NOPB and LM5111-2MX/NOPB are compatible substitutes with higher peak output current capability (3A source, 5A sink). The LM5111-2M/NOPB is classified as Last Time Buy, while LM5111-2MX/NOPB is in active production. These parts operate within a narrower supply voltage range (3.5V to 14V) and have a lower maximum junction temperature rating (125°C). LM5111 variants are suitable for applications requiring higher gate drive current with standard operating temperature ranges.
Analog Devices/Maxim MAX4426 Series Substitutes: MAX4426CSA+, MAX4426CSA+T, and MAX4426ESA+ are compatible substitutes with lower peak output current (1.5A source and sink). MAX4426CSA+ and MAX4426CSA+T operate from 0°C to 70°C, while MAX4426ESA+ extends the lower temperature limit to -40°C. These parts are suitable for applications where lower output current is acceptable and cost optimization is a priority.
All substitute parts are ROHS3 compliant and maintain the 8-SOIC form factor for direct PCB compatibility. Selection should be based on specific application requirements for supply voltage range, output current capability, thermal operating range, and packaging format.
Frequently Asked Questions (FAQ)
Q: Can IR4426STRPBF directly replace IR4426SPBF in existing designs? A: Yes. IR4426STRPBF is the active production equivalent with identical electrical specifications and 8-SOIC packaging. The only difference is packaging format (Cut Tape/Digi-Reel vs. Tube). No circuit modifications are required.
Q: What are the key differences between Infineon IR4426 and IXYS IXDI602 gate drivers? A: Both are 2-channel low-side inverting gate drivers in 8-SOIC packages. IXDI602 variants offer wider supply voltage range (4.5V to 35V vs. 6V to 20V), extended lower temperature rating (-55°C vs. -40°C), and faster switching times (7.5ns/6.5ns vs. 15ns/10ns). IXDI602SI and IXDI602SITR include exposed pad packaging for thermal enhancement.
Q: Are the Texas Instruments LM5111 parts suitable replacements? A: LM5111-2M/NOPB and LM5111-2MX/NOPB are compatible substitutes with higher output current capability (3A/5A vs. 2.3A/3.3A). However, they operate within a narrower supply voltage range (3.5V to 14V) and lower maximum temperature (125°C vs. 150°C). Verify application requirements before substitution.
Q: What is the significance of the 8-SOIC-EP package variant? A: The 8-SOIC-EP (Exposed Pad) variant, available in IXDI602SI and IXDI602SITR, includes a thermal pad for improved heat dissipation. This is beneficial in high-frequency switching applications or when thermal management is critical. Standard 8-SOIC packages without exposed pad are suitable for lower power applications.
Q: Can I use MAX4426 parts as a substitute? A: MAX4426 variants are compatible substitutes with lower peak output current (1.5A source and sink). They are suitable for applications where lower gate drive current is acceptable. MAX4426ESA+ offers the widest temperature range (-40°C to 85°C) among MAX4426 options.
Q: What does MSL (Moisture Sensitivity Level) mean for component selection? A: MSL indicates moisture sensitivity during storage and handling. IR4426SPBF has MSL 2 (1 Year shelf life), while most substitutes have MSL 1 (Unlimited shelf life). MSL 1 parts offer better long-term storage stability and lower risk of moisture-related failures during assembly.
Q: Are all substitute parts available in multiple packaging formats? A: Packaging availability varies by manufacturer. Infineon IR4426STRPBF, IXYS IXDI602 series, and Texas Instruments LM5111 series are available in Tube, Cut Tape, and Tape & Reel formats. Analog Devices/Maxim MAX4426 variants are available in Tube and Tape & Reel formats. Verify specific packaging availability with your supplier.
Q: What is the impact of different rise and fall times on circuit performance? A: Rise and fall times affect gate switching speed and EMI characteristics. Faster switching times (IXDI602 at 7.5ns/6.5ns) reduce switching losses and EMI but may require careful PCB layout. Slower switching times (MAX4426 at 20ns/20ns) reduce EMI but increase switching losses. Select based on application switching frequency and EMI requirements.
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