IR2302PBF Equivalent & Substitute Parts

Part Overview

The IR2302PBF is a half-bridge gate driver IC manufactured by Infineon Technologies, designed for driving IGBT and N-Channel MOSFET configurations in power management applications. The device operates with a supply voltage range of 5V to 20V and features non-inverting input logic with peak output currents of 200mA (source) and 350mA (sink).

The IR2302PBF is classified as obsolete. Identifying equivalent and substitute parts is necessary to ensure continued availability for new designs, production continuity, and system maintenance where original components are no longer readily procurable.

Substiute Parts

IR2302PBF
Infineon TechnologiesIn Stock: 29835IR2302PBF Datasheet
IR2302PBF
Current Part
IR2302STRPBF
Infineon TechnologiesIn Stock: 23717IR2302STRPBF Datasheet
IR2302STRPBF
MFR Recommended

Key Parameters

Parameter Value
Driven Configuration Half-Bridge
Number of Drivers 2
Gate Type IGBT, N-Channel MOSFET
Voltage - Supply 5V ~ 20V
Logic Voltage - VIL, VIH 0.8V, 2.9V
Current - Peak Output (Source, Sink) 200mA, 350mA
Input Type Non-Inverting
High Side Voltage - Max (Bootstrap) 600V
Rise / Fall Time (Typ) 130ns, 50ns
Operating Temperature -40°C ~ 150°C (TJ)
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)

Substitute Part Grouping Explanation

Substitution of the IR2302PBF is determined by electrical and mechanical parameter equivalence within the half-bridge gate driver category. The following parameters establish substitution validity:

Electrical Equivalence Criteria:

  • Driven configuration: Half-Bridge
  • Number of drivers: 2
  • Gate type compatibility: IGBT, N-Channel MOSFET
  • Supply voltage range: 5V ~ 20V
  • Logic voltage levels: VIL 0.8V, VIH 2.9V
  • Peak output current: 200mA (source), 350mA (sink)
  • Input logic type: Non-Inverting
  • Bootstrap voltage rating: 600V maximum
  • Timing characteristics: Rise/Fall time 130ns/50ns typical
  • Temperature range: -40°C ~ 150°C (TJ)

Mechanical Compatibility:

  • Package type and pinout must support the application mounting method
  • Compliance certifications: ROHS3, REACH Unaffected, EAR99

The IR2302STRPBF meets all electrical equivalence criteria and is classified as an active product with current manufacturer support.

Parameter Comparison

Parameter IR2302PBF IR2302STRPBF
Manufacturer Infineon Technologies Infineon Technologies
Base Product Number IR2302 IR2302
Driven Configuration Half-Bridge Half-Bridge
Channel Type Synchronous Synchronous
Number of Drivers 2 2
Gate Type IGBT, N-Channel MOSFET IGBT, N-Channel MOSFET
Voltage - Supply 5V ~ 20V 5V ~ 20V
Logic Voltage - VIL, VIH 0.8V, 2.9V 0.8V, 2.9V
Current - Peak Output (Source, Sink) 200mA, 350mA 200mA, 350mA
Input Type Non-Inverting Non-Inverting
High Side Voltage - Max (Bootstrap) 600V 600V
Rise / Fall Time (Typ) 130ns, 50ns 130ns, 50ns
Operating Temperature -40°C ~ 150°C (TJ) -40°C ~ 150°C (TJ)
Mounting Type Through Hole Surface Mount
Package / Case 8-DIP (0.300", 7.62mm) 8-SOIC (0.154", 3.90mm Width)
Product Status Obsolete Active
RoHS Status ROHS3 Compliant ROHS3 Compliant
REACH Status REACH Unaffected REACH Unaffected
ECCN EAR99 EAR99

Engineering Selection Recommendations

The IR2302STRPBF is the manufacturer-recommended substitute for the obsolete IR2302PBF. Both devices share identical electrical specifications and are manufactured by Infineon Technologies under the same base product number IR2302.

Product Status Consideration: The IR2302PBF is obsolete, while the IR2302STRPBF maintains active product status with current manufacturer support and documented inventory availability.

Compliance Alignment: Both parts maintain ROHS3 compliance and REACH unaffected status, ensuring regulatory consistency in applications requiring these certifications.

Package Transition: The primary difference is packaging format. The IR2302PBF uses through-hole 8-DIP mounting, while the IR2302STRPBF uses surface-mount 8-SOIC packaging. This distinction requires PCB layout modification but does not affect electrical functionality or performance characteristics.

Moisture Sensitivity: The IR2302PBF carries MSL 1 (unlimited), while the IR2302STRPBF carries MSL 2 (1 year). This represents a minor increase in moisture sensitivity handling requirements for the substitute part.

Frequently Asked Questions (FAQ)

Q: Are the IR2302PBF and IR2302STRPBF electrically interchangeable?

A: Yes. Both devices share identical electrical specifications including supply voltage range (5V ~ 20V), output current ratings (200mA source, 350mA sink), logic voltage levels, bootstrap voltage rating (600V), and timing characteristics. Electrical functionality is fully equivalent.

Q: What is the primary difference between these two parts?

A: The primary difference is packaging. The IR2302PBF uses through-hole 8-DIP mounting (0.300" width), while the IR2302STRPBF uses surface-mount 8-SOIC packaging (0.154" width). PCB layout and assembly method must be adapted accordingly.

Q: Can I use the IR2302STRPBF as a direct replacement in existing through-hole designs?

A: No. The IR2302STRPBF requires surface-mount assembly and cannot be directly installed in through-hole PCB footprints designed for the IR2302PBF. PCB redesign is necessary to accommodate the different package format.

Q: Why is the IR2302PBF classified as obsolete?

A: The IR2302PBF is no longer in active production. The IR2302STRPBF represents the current active product offering from Infineon Technologies for this gate driver function.

Q: Are there compliance differences between these parts?

A: Both parts maintain ROHS3 compliance and REACH unaffected status. The IR2302PBF carries MSL 1 (unlimited moisture sensitivity level), while the IR2302STRPBF carries MSL 2 (1 year). This represents a minor difference in moisture handling requirements during storage and assembly.

Q: What inventory status should I expect?

A: The IR2302PBF has documented inventory of 29,783 pieces available as new original stock. The IR2302STRPBF has documented inventory of 23,690 pieces available as new original stock in cut tape and Digi-Reel packaging formats.

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