IPI25N06S3-25 Equivalent & Substitute Parts

Part Overview

The IPI25N06S3-25 is an N-Channel MOSFET manufactured by Infineon Technologies, rated for 55V drain-to-source voltage and 25A continuous drain current in a TO-262-3 through-hole package. This device is classified as obsolete, making equivalent substitutes necessary for ongoing production and maintenance applications. The OptiMOS™ series component delivers 48W maximum power dissipation and operates across the industrial temperature range of -55°C to 175°C.

Substiute Parts

IPI25N06S3-25
Infineon TechnologiesIn Stock: 796IPI25N06S3-25 Datasheet
IPI25N06S3-25
Current Part
IRFZ44ZLPBF
International RectifierIn Stock: 3696IRFZ44ZLPBF Datasheet
IRFZ44ZLPBF
MFR Recommended
IRFZ44L
Vishay SiliconixIn Stock: 842IRFZ44L Datasheet
IRFZ44L
MFR Recommended

Key Parameters

Parameter Value Unit
Drain-to-Source Voltage (Vdss) 55 V
Continuous Drain Current @ 25°C (Id) 25 A
On-State Resistance @ 15A, 10V (Rds On Max) 25.1 mOhm
Gate Threshold Voltage @ 20µA (Vgs th Max) 4 V
Gate Charge @ 10V (Qg Max) 41 nC
Maximum Gate Voltage (Vgs Max) ±20 V
Input Capacitance @ 25V (Ciss Max) 1862 pF
Power Dissipation (Max) 48 W
Operating Temperature Range (TJ) -55 to 175 °C
Package Type TO-262-3
Mounting Type Through Hole

Substitute Part Grouping Explanation

Substitution of the IPI25N06S3-25 is determined by strict electrical and mechanical compatibility criteria:

Mandatory Matching Parameters:

  • Drain-to-Source Voltage (Vdss): Must equal or exceed 55V
  • Package Type: Must be TO-262-3 or equivalent through-hole configuration
  • FET Type: N-Channel MOSFET technology
  • Gate Voltage Rating (Vgs Max): Must support ±20V
  • Operating Temperature Range: Must cover -55°C to 175°C

Performance Considerations:

  • Continuous Drain Current (Id): Substitute must meet or exceed 25A at 25°C
  • On-State Resistance (Rds On): Lower values indicate improved performance but do not disqualify higher values within thermal limits
  • Power Dissipation: Substitute must handle thermal requirements of the application
  • Gate Charge (Qg): Affects switching speed; higher values acceptable if circuit design accommodates

Compatibility Constraints:

  • All substitute parts must maintain through-hole mounting for PCB compatibility
  • Pinout configuration must align with TO-262-3 standard
  • Electrical stress ratings must not be exceeded in the target application

Parameter Comparison

Parameter IPI25N06S3-25 IRFZ44ZLPBF IRFZ44L Unit
Manufacturer Infineon Technologies International Rectifier Vishay Siliconix
Product Status Obsolete Active Active
Drain-to-Source Voltage (Vdss) 55 55 60 V
Continuous Drain Current @ 25°C (Id) 25 51 50 A
On-State Resistance @ 10V (Rds On Max) 25.1 @ 15A 13.9 @ 31A 28 @ 31A mOhm
Gate Threshold Voltage (Vgs th Max) 4 @ 20µA 4 @ 250µA 4 @ 250µA V
Gate Charge @ 10V (Qg Max) 41 43 67 nC
Maximum Gate Voltage (Vgs Max) ±20 ±20 ±20 V
Input Capacitance @ 25V (Ciss Max) 1862 1420 1900 pF
Power Dissipation (Max) 48 80 150 (Tc) W
Operating Temperature Range (TJ) -55 to 175 -55 to 175 -55 to 175 °C
Package Type TO-262-3 TO-262 TO-262-3
Mounting Type Through Hole Through Hole Through Hole

Engineering Selection Recommendations

IRFZ44ZLPBF (International Rectifier)

This part is the manufacturer-recommended substitute. It maintains electrical compatibility with 55V Vdss rating and exceeds the 25A continuous drain current requirement at 51A. The HEXFET® series device is in active production status, ensuring long-term availability. The lower on-state resistance of 13.9 mOhm at 31A, 10V compared to the original 25.1 mOhm indicates improved efficiency. Gate charge remains comparable at 43 nC. Power dissipation capability of 80W exceeds the original 48W specification. TO-262 package maintains through-hole compatibility. This substitute is suitable for direct replacement in applications where the original IPI25N06S3-25 was specified.

IRFZ44L (Vishay Siliconix)

This alternative substitute provides 60V Vdss rating, exceeding the 55V requirement with additional voltage margin. Continuous drain current of 50A significantly exceeds the 25A specification. The device is in active production status. On-state resistance of 28 mOhm at 31A, 10V is higher than IRFZ44ZLPBF but remains within acceptable operating parameters. Gate charge of 67 nC is elevated compared to the original specification, which may affect switching characteristics in high-frequency applications. Power dissipation of 150W (Tc) provides substantial thermal headroom. TO-262-3 package matches the original form factor exactly. This substitute is applicable where additional voltage margin and current capacity are beneficial.

Selection Basis:

Both substitutes meet mandatory compatibility criteria: N-Channel MOSFET technology, TO-262 through-hole packages, ±20V gate voltage rating, and -55°C to 175°C operating temperature range. Both are in active production, addressing the obsolescence of the original IPI25N06S3-25. Selection between them depends on application-specific requirements for on-state resistance, gate charge, and thermal dissipation capacity.

Frequently Asked Questions (FAQ)

Q: Can the IRFZ44ZLPBF directly replace the IPI25N06S3-25 without PCB modifications?

A: Yes. Both devices use TO-262 through-hole packages with standard pinout configuration. Mechanical and electrical interfaces are compatible. No PCB layout changes are required for direct substitution.

Q: What is the significance of the higher continuous drain current in the substitute parts?

A: The IRFZ44ZLPBF (51A) and IRFZ44L (50A) both exceed the original 25A specification. This provides design margin and allows the same device to be used in applications requiring higher current capacity. The original circuit will operate within safe limits as the substitute is rated for higher current.

Q: How does the on-state resistance difference affect circuit performance?

A: The IRFZ44ZLPBF has lower on-state resistance (13.9 mOhm) compared to the IPI25N06S3-25 (25.1 mOhm), resulting in reduced power dissipation and improved efficiency. The IRFZ44L has slightly higher resistance (28 mOhm), which may increase heat generation marginally but remains within acceptable thermal limits for most applications.

Q: Are there package compatibility concerns between TO-262 and TO-262-3?

A: TO-262 and TO-262-3 are functionally equivalent through-hole packages with identical pinout and lead spacing. Both are suitable for standard PCB through-hole mounting. The designation difference reflects minor manufacturing variations but does not affect electrical or mechanical compatibility.

Q: Why is gate charge important when selecting a substitute?

A: Gate charge (Qg) determines the energy required to switch the MOSFET on and off. The original IPI25N06S3-25 has 41 nC gate charge. The IRFZ44ZLPBF (43 nC) is nearly identical, ensuring similar switching behavior. The IRFZ44L (67 nC) has higher gate charge, which may require adjustment to gate drive circuits in high-frequency switching applications but is acceptable for standard industrial switching frequencies.

Q: What does "Active" product status mean for long-term availability?

A: Active status indicates the manufacturer continues production and maintains supply. Both substitute parts (IRFZ44ZLPBF and IRFZ44L) are actively manufactured, ensuring availability for current and future production runs. The original IPI25N06S3-25 is obsolete, meaning Infineon no longer manufactures it, making substitutes necessary.

Q: Can the IRFZ44L be used in applications where the IRFZ44ZLPBF is specified?

A: Yes. The IRFZ44L meets all mandatory electrical and mechanical compatibility criteria. The 60V Vdss rating provides additional voltage margin over the 55V requirement. However, the higher gate charge (67 nC vs. 43 nC) may affect switching speed in high-frequency circuits. Verify gate drive circuit compatibility before substitution in time-critical applications.

Q: What thermal considerations apply when substituting these parts?

A: The original IPI25N06S3-25 dissipates 48W maximum. The IRFZ44ZLPBF (80W) and IRFZ44L (150W) have higher thermal ratings, providing additional margin. If the original circuit was thermally constrained, the substitutes may reduce operating temperature. If thermal management was marginal, the improved efficiency of lower on-state resistance (IRFZ44ZLPBF) may provide additional benefit.

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