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Equivalent & Substitute Parts for IPB034N06L3GATMA1
Part Overview
The IPB034N06L3GATMA1 is an N-Channel 60V 90A MOSFET manufactured by Infineon Technologies in the OptiMOS™ series, packaged in D2PAK (TO-263-3) surface mount configuration. This device is classified as "Not For New Designs," indicating it has reached end-of-life status. The part delivers 167W maximum power dissipation and operates across the temperature range of -55°C to 175°C. Due to its discontinued design status, equivalent and substitute parts from active product lines are necessary for ongoing production requirements and new design implementations.
Substiute Parts
Key Parameters
| Parameter | Value | Unit |
|---|---|---|
| Drain to Source Voltage (Vdss) | 60 | V |
| Continuous Drain Current (Id) @ 25°C | 90 | A (Tc) |
| Rds On (Max) @ 90A, 10V | 3.4 | mOhm |
| Gate Threshold Voltage (Vgs(th)) @ 93µA | 2.2 | V |
| Gate Charge (Qg) @ 4.5V | 79 | nC |
| Power Dissipation (Max) | 167 | W (Tc) |
| Operating Temperature Range | -55 to 175 | °C (TJ) |
| Package Type | D2PAK (TO-263-3) | Surface Mount |
| RoHS Status | ROHS3 Compliant | - |
Substitute Part Grouping Explanation
Substitution compatibility for the IPB034N06L3GATMA1 is determined by the following critical parameters:
Primary Compatibility Criteria:
- Drain to Source Voltage (Vdss): 60V minimum (55V acceptable with design margin verification)
- Continuous Drain Current (Id): 90A or greater at 25°C
- Package Type: D2PAK (TO-263-3) surface mount configuration
- Gate Voltage Range (Vgs): ±20V maximum
- Operating Temperature: -55°C to 175°C minimum
- RoHS3 Compliance and MSL Level 1
Secondary Compatibility Factors:
- Rds On (Max): Lower or equal values improve thermal performance
- Gate Charge (Qg): Lower values reduce switching losses
- Power Dissipation: Higher ratings provide thermal margin
Substitute parts are grouped into two categories: Direct Equivalents (matching or exceeding all primary parameters with active product status) and Functional Alternatives (meeting minimum electrical requirements with enhanced performance characteristics).
Parameter Comparison
| Part Number | Manufacturer | Vdss (V) | Id @ 25°C (A) | Rds On Max (mOhm) | Qg Max (nC) | Power Diss (W) | Package | Status |
|---|---|---|---|---|---|---|---|---|
| IPB034N06L3GATMA1 | Infineon | 60 | 90 (Tc) | 3.4 @ 90A, 10V | 79 @ 4.5V | 167 | D2PAK | Not For New Designs |
| IRFS3206TRRPBF | Infineon | 60 | 120 (Tc) | 3.0 @ 75A, 10V | 170 @ 10V | 300 | D2PAK | Active |
| AOB266L | Alpha & Omega | 60 | 140 (Tc) | 3.2 @ 20A, 10V | 80 @ 10V | 268 | D2PAK | Active |
| BUK763R1-60E,118 | Nexperia | 60 | 120 (Tc) | 3.1 @ 25A, 10V | 114 @ 10V | 293 | D2PAK | Active |
| BUK764R0-55B,118 | Nexperia | 55 | 75 (Tc) | 4.0 @ 25A, 10V | 86 @ 10V | 300 | D2PAK | Active |
| FDB029N06 | Fairchild | 60 | 120 (Tc) | 3.1 @ 75A, 10V | 151 @ 10V | 231 | D2PAK | Active |
| FDB035AN06A0 | Fairchild | 60 | 80 (Tc) | 3.5 @ 80A, 10V | 124 @ 10V | 310 | D2PAK | Active |
| PSMN004-60B,118 | Nexperia | 60 | 75 (Tc) | 3.6 @ 25A, 10V | 168 @ 10V | 230 | D2PAK | Active |
| PSMN3R0-60BS,118 | Nexperia | 60 | 100 (Tc) | 3.2 @ 25A, 10V | 130 @ 10V | 306 | D2PAK | Active |
| STH260N6F6-2 | STMicroelectronics | 60 | 180 (Tc) | 2.4 @ 60A, 10V | 183 @ 10V | 300 | H2PAK-2 | Active |
Engineering Selection Recommendations
Tier 1 - Direct Substitutes (Recommended for Immediate Replacement):
IRFS3206TRRPBF, PSMN3R0-60BS,118, and BUK763R1-60E,118 are the primary substitutes. All three devices maintain 60V Vdss rating, exceed the 90A continuous drain current requirement, and are packaged in D2PAK configuration. IRFS3206TRRPBF offers the lowest Rds On at 3.0 mOhm and highest power dissipation at 300W, providing superior thermal performance. BUK763R1-60E,118 includes AEC-Q101 automotive qualification, suitable for applications requiring automotive-grade reliability. All three carry Active product status and ROHS3 compliance.
Tier 2 - Functional Alternatives (Performance Enhancement Options):
AOB266L and STH260N6F6-2 provide enhanced current handling capabilities (140A and 180A respectively) with improved Rds On characteristics. AOB266L maintains D2PAK packaging for direct board-level compatibility. STH260N6F6-2 uses H2PAK-2 packaging, requiring PCB layout modification but delivering superior thermal dissipation at 2.4 mOhm Rds On. Both are Active products with full compliance certifications.
Tier 3 - Conditional Substitutes (Design Margin Verification Required):
BUK764R0-55B,118 operates at 55V Vdss and 75A continuous current, below the original 60V/90A specification. This part is suitable only for applications with confirmed 55V maximum operating voltage and 75A maximum current draw. FDB035AN06A0 provides 80A continuous current, marginally below the 90A requirement, and is applicable only where thermal derating analysis confirms adequate performance margin.
All substitute parts maintain the required operating temperature range (-55°C to 175°C), gate voltage rating (±20V), and compliance certifications (ROHS3, MSL Level 1).
Frequently Asked Questions (FAQ)
Q1: Can IRFS3206TRRPBF directly replace IPB034N06L3GATMA1 without PCB modifications?
A: Yes. IRFS3206TRRPBF is packaged in D2PAK (TO-263-3), identical to the original part. Pin configuration and footprint are compatible. No PCB layout changes are required. The higher current rating (120A vs. 90A) and lower Rds On (3.0 mOhm vs. 3.4 mOhm) provide improved performance margins.
Q2: What is the significance of the 55V rating on BUK764R0-55B,118 compared to the 60V original specification?
A: The 55V Vdss rating on BUK764R0-55B,118 indicates the maximum drain-source voltage the device can withstand. This part is suitable only for circuits where the maximum applied voltage does not exceed 55V. For applications requiring 60V operation, this part is not appropriate. Verify circuit maximum voltage before selection.
Q3: Why does STH260N6F6-2 use H2PAK-2 packaging instead of D2PAK?
A: H2PAK-2 is a thermally enhanced package variant offering superior heat dissipation compared to standard D2PAK. The larger tab and internal structure reduce thermal resistance. However, H2PAK-2 requires different PCB footprint and thermal via patterns. This part is selected when thermal performance is critical and PCB redesign is acceptable.
Q4: Are all substitute parts RoHS3 compliant and MSL Level 1?
A: Yes. All listed substitute parts carry ROHS3 Compliant status and MSL Level 1 (Unlimited) moisture sensitivity rating, matching the original IPB034N06L3GATMA1 specifications. This ensures compatibility with standard manufacturing processes and storage requirements.
Q5: Which substitute offers the best Rds On performance?
A: STH260N6F6-2 delivers the lowest Rds On at 2.4 mOhm @ 60A, 10V, compared to the original 3.4 mOhm @ 90A, 10V. This reduces conduction losses and heat generation. IRFS3206TRRPBF provides 3.0 mOhm @ 75A, 10V, the second-best performance in D2PAK packaging.
Q6: Is BUK763R1-60E,118 suitable for automotive applications?
A: Yes. BUK763R1-60E,118 carries AEC-Q101 automotive qualification and Automotive Grade designation. This part meets automotive reliability and testing standards. Other substitutes do not carry explicit automotive qualification unless specified in their product documentation.
Q7: What is the difference between continuous drain current ratings at Ta (ambient) versus Tc (case)?
A: Tc (case temperature) ratings assume active thermal management with the device case maintained at 25°C through heatsinking. Ta (ambient temperature) ratings assume free-air operation without heatsinking. For applications using heatsinks, Tc ratings apply. For free-air mounting, Ta ratings are the limiting factor. AOB266L specifies both: 18A (Ta) and 140A (Tc).
Q8: Can FDB029N06 replace IPB034N06L3GATMA1 in all applications?
A: FDB029N06 meets the primary electrical requirements: 60V Vdss, 120A continuous current, D2PAK packaging, and -55°C to 175°C operating range. However, it is listed as Bulk packaging rather than Cut Tape or Digi-Reel. Verify packaging format compatibility with your procurement and assembly processes before selection.
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