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INMP504ACEZ-R0 Equivalent & Substitute Parts
Part Overview
The INMP504ACEZ-R0 is a MEMS analog omnidirectional microphone manufactured by TDK InvenSense, designed for audio capture applications requiring low-power operation and compact form factor. This component operates across a frequency range of 100 Hz to 20 kHz with a sensitivity of -38dB ±3dB at 94dB SPL. The product is classified as Obsolete, necessitating identification of functionally equivalent alternatives for ongoing design requirements and production continuity.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Manufacturer Part Number | INMP504ACEZ-R0 |
| Manufacturer | TDK InvenSense |
| Type | MEMS (Silicon) |
| Output Type | Analog |
| Direction | Omnidirectional |
| Frequency Range | 100 Hz ~ 20 kHz |
| Sensitivity | -38dB ±3dB @ 94dB SPL |
| S/N Ratio | 65dB |
| Impedance | 200 Ohms |
| Voltage Range | 1.6 V ~ 3.3 V |
| Current - Supply | 225 µA |
| Termination | Solder Pads |
| Size / Dimension | 0.132" L x 0.098" W (3.35mm x 2.50mm) |
| Height (Max) | 0.039" (0.98mm) |
| RoHS Status | ROHS3 Compliant |
| Product Status | Obsolete |
Substitute Part Grouping Explanation
Substitution eligibility for the INMP504ACEZ-R0 is determined by the following critical parameters:
- Microphone Type: MEMS (Silicon) construction
- Output Configuration: Analog output
- Directional Pattern: Omnidirectional response
- Sensitivity Level: -38dB nominal at 94dB SPL
- Frequency Response: Coverage of audio spectrum (minimum 100 Hz to 20 kHz)
- Termination Method: Solder Pads
- Physical Footprint: 3.35mm x 2.50mm base dimensions
- Supply Voltage Compatibility: Overlap within 1.6 V to 3.3 V range
- Compliance: ROHS3 Compliant
The INMP510ACEZ-R7 meets these substitution criteria through equivalent MEMS analog omnidirectional architecture with matching sensitivity specification, identical footprint dimensions, compatible termination, and regulatory compliance.
Parameter Comparison
| Parameter | INMP504ACEZ-R0 | INMP510ACEZ-R7 |
|---|---|---|
| Manufacturer | TDK InvenSense | TDK InvenSense |
| Type | MEMS (Silicon) | MEMS (Silicon) |
| Output Type | Analog | Analog |
| Direction | Omnidirectional | Omnidirectional |
| Frequency Range | 100 Hz ~ 20 kHz | 60 Hz ~ 20 kHz |
| Sensitivity | -38dB ±3dB @ 94dB SPL | -38dB ±2dB @ 94dB SPL |
| S/N Ratio | 65dB | 65dB |
| Impedance | 200 Ohms | 350 Ohms |
| Voltage Range | 1.6 V ~ 3.3 V | 1.5 V ~ 3.63 V |
| Current - Supply | 225 µA | 250 µA |
| Termination | Solder Pads | Solder Pads |
| Size / Dimension | 0.132" L x 0.098" W (3.35mm x 2.50mm) | 0.132" L x 0.098" W (3.35mm x 2.50mm) |
| Height (Max) | 0.039" (0.98mm) | 0.043" (1.10mm) |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant |
| Product Status | Obsolete | Not For New Designs |
Engineering Selection Recommendations
The INMP510ACEZ-R7 is the manufacturer-recommended substitute for the obsolete INMP504ACEZ-R0. Both components maintain ROHS3 compliance and identical footprint geometry, enabling direct mechanical and electrical substitution in existing PCB layouts.
Key considerations for selection:
- Sensitivity Tolerance: The INMP510ACEZ-R7 provides tighter sensitivity tolerance (±2dB versus ±3dB), resulting in improved consistency across production batches.
- Frequency Response Extension: The INMP510ACEZ-R7 extends lower frequency response to 60 Hz, providing enhanced bass capture capability.
- Impedance Variation: The INMP510ACEZ-R7 operates at 350 Ohms versus 200 Ohms. Circuit impedance matching and signal conditioning must be evaluated for the specific application.
- Supply Current: The INMP510ACEZ-R7 requires 250 µA versus 225 µA, representing a 25 µA increase in power consumption.
- Voltage Range Expansion: The INMP510ACEZ-R7 supports extended supply voltage range (1.5 V to 3.63 V), providing greater design flexibility.
- Physical Height: The INMP510ACEZ-R7 maximum height is 1.10mm versus 0.98mm for the INMP504ACEZ-R0. PCB clearance must be verified for space-constrained applications.
- Product Status: The INMP510ACEZ-R7 is classified as "Not For New Designs," indicating limited long-term availability. Designs should evaluate next-generation alternatives for new product development.
Frequently Asked Questions (FAQ)
Q: Can the INMP510ACEZ-R7 be used as a direct replacement for the INMP504ACEZ-R0?
A: Yes, the INMP510ACEZ-R7 is the manufacturer-recommended substitute. Both components share identical footprint dimensions (3.35mm x 2.50mm), solder pad termination, and analog omnidirectional architecture. Circuit design must account for impedance differences (350 Ohms versus 200 Ohms) and the 1.10mm maximum height versus 0.98mm.
Q: What are the key electrical differences between these parts?
A: The INMP510ACEZ-R7 features tighter sensitivity tolerance (±2dB versus ±3dB), extended lower frequency response (60 Hz versus 100 Hz), higher impedance (350 Ohms versus 200 Ohms), slightly increased supply current (250 µA versus 225 µA), and expanded voltage range (1.5 V to 3.63 V versus 1.6 V to 3.3 V).
Q: Are there packaging differences between these components?
A: The INMP504ACEZ-R0 is supplied in standard packaging, while the INMP510ACEZ-R7 is available in Cut Tape (CT) and Digi-Reel® packaging options. Both use identical solder pad termination.
Q: What is the impact of impedance difference on circuit design?
A: The INMP510ACEZ-R7 operates at 350 Ohms compared to 200 Ohms for the INMP504ACEZ-R0. Signal conditioning circuits, input impedance matching, and amplifier input stages must be evaluated to ensure proper impedance coupling and signal integrity.
Q: Should new designs use the INMP510ACEZ-R7?
A: The INMP510ACEZ-R7 is classified as "Not For New Designs." While it serves as a substitute for obsolete INMP504ACEZ-R0 inventory, new product development should evaluate current-generation MEMS microphone alternatives from TDK InvenSense for extended product lifecycle support.
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