IM393S6EXKLA1 Equivalent & Substitute Parts

Part Overview

The IM393S6EXKLA1 is a Power Driver Module IGBT 3 Phase Inverter rated for 600V and 6A operation in a 35-PowerDIP Module package with 30 leads. This component is manufactured by Infineon Technologies under the CIPOS™ series and is currently classified as obsolete. Due to its obsolete status, identifying functionally equivalent substitute parts is essential for system redesign, maintenance, and continued component availability in production environments.

Substiute Parts

IM393S6EXKLA1

Infineon TechnologiesIn Stock: 1157IM393S6EXKLA1 Datasheet

Current PartRFQ

IGCM06F60GAXKMA1

Infineon TechnologiesIn Stock: 974IGCM06F60GAXKMA1 Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the IM393S6EXKLA1 are identified based on the following critical electrical and mechanical parameters:

• Voltage Rating: 600V (exact match required)
• Current Rating: 6A (exact match required)
• Voltage Isolation: 2000Vrms (exact match required)
• Type: IGBT (exact match required)
• Configuration: 3 Phase operation capability
• Mounting Type: Through Hole (exact match required)
• Manufacturer: Infineon Technologies (same manufacturer ensures design compatibility within CIPOS™ series)

The IGCM06F60GAXKMA1 meets all critical electrical parameters and maintains compatibility with the original design specifications while offering an active product status and improved availability.

Parameter Comparison

Engineering Selection Recommendations

The IGCM06F60GAXKMA1 is the manufacturer-recommended substitute for the obsolete IM393S6EXKLA1. Both components share identical electrical specifications (600V, 6A, 2000Vrms isolation) and are manufactured by Infineon Technologies within the CIPOS™ series. Both components maintain ROHS3 compliance and REACH unaffected status, ensuring regulatory alignment.

The primary difference is the package configuration: the substitute uses a 24-PowerDIP Module (1.028", 26.10mm) versus the original 35-PowerDIP Module (0.866", 22.00mm). This package change requires PCB layout modification and mechanical redesign of the mounting interface. The substitute part is currently in active production status with confirmed inventory availability, providing long-term supply security compared to the obsolete original part.

Frequently Asked Questions (FAQ)

Q: Can the IGCM06F60GAXKMA1 directly replace the IM393S6EXKLA1 without circuit modifications?

A: Electrical specifications are identical (600V, 6A, 2000Vrms isolation), ensuring functional compatibility. However, the package change from 35-PowerDIP to 24-PowerDIP requires PCB layout redesign and mechanical mounting modifications. Pin configuration must be verified against detailed datasheets before implementation.

Q: What is the significance of the package size difference?

A: The IM393S6EXKLA1 uses a 35-PowerDIP Module measuring 0.866" (22.00mm), while the IGCM06F60GAXKMA1 uses a 24-PowerDIP Module measuring 1.028" (26.10mm). This affects board space allocation, thermal management design, and mechanical assembly procedures. Both maintain Through Hole mounting type.

Q: Why is the IM393S6EXKLA1 classified as obsolete?

A: Obsolete status indicates the manufacturer has discontinued production. The IGCM06F60GAXKMA1 represents the active product line continuation within the CIPOS™ series, offering equivalent electrical performance with improved availability and long-term supply assurance.

Q: Are there compliance differences between the two parts?

A: Both components are ROHS3 compliant and REACH unaffected. The substitute has a defined Moisture Sensitivity Level of 1 (Unlimited), while the original lists Not Applicable. Both maintain the same ECCN and HTSUS classifications for regulatory purposes.

Q: What inventory status should be considered for procurement?

A: The IM393S6EXKLA1 has 1072 pieces in stock as new original inventory. The IGCM06F60GAXKMA1 has 931 pieces in stock as new original inventory. For new designs, the active substitute part is recommended to ensure long-term component availability and supply chain continuity.