ICS553MI Clock Fanout Buffer Equivalent & Substitute Parts

Part Overview

The ICS553MI is a Clock Fanout Buffer (Distribution) IC manufactured by Renesas Electronics Corporation, designed for 1:4 clock distribution at frequencies up to 200 MHz. This component operates with CMOS input and output logic levels, supporting supply voltages from 2.375V to 5.25V across an operating temperature range of -40°C to 85°C. The device is packaged in an 8-SOIC (0.154", 3.90mm Width) surface mount configuration.

The ICS553MI carries an Obsolete product status. Identifying functionally equivalent substitute parts is essential for ongoing system support, design updates, and procurement continuity when the original part becomes unavailable.

Substiute Parts

ICS553MI

Renesas Electronics CorporationIn Stock: 3043ICS553MI Datasheet

Current PartRFQ

553MILF

Renesas Electronics CorporationIn Stock: 1429553MILF Datasheet

DirectRFQ

NB3L553DG

onsemiIn Stock: 2437NB3L553DG Datasheet

DirectRFQ

NB3L553DR2G

onsemiIn Stock: 2771NB3L553DR2G Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the ICS553MI is determined by strict alignment across the following critical parameters:

• Fanout Configuration: 1:4 ratio (one input, four outputs)
• Maximum Frequency: 200 MHz minimum capability
• Logic Levels: CMOS input and output compatibility
• Supply Voltage Range: 2.375V ~ 5.25V support
• Operating Temperature Range: -40°C ~ 85°C minimum coverage
• Package Type: 8-SOIC (0.154", 3.90mm Width) surface mount
• Moisture Sensitivity: MSL 1 (Unlimited)

All identified substitute parts meet these electrical and mechanical requirements. The substitute parts include both Renesas Electronics Corporation variants and onsemi equivalents, with distinctions based on product status and compliance certifications.

Parameter Comparison

Engineering Selection Recommendations

553MILF (Renesas Electronics Corporation): This part is the direct Renesas successor to the ICS553MI, maintaining identical electrical specifications and package configuration. The 553MILF carries Active product status and achieves ROHS3 compliance, making it the preferred choice for new designs and systems requiring regulatory compliance. This variant is suitable for direct replacement in existing applications.

NB3L553DG (onsemi): This onsemi equivalent provides full functional compatibility with expanded input/output logic support (LVCMOS and LVTTL in addition to standard CMOS). The part maintains Active product status and ROHS3 compliance. Packaging is supplied in Tube format. This option is appropriate for applications where onsemi supply chain preference or logic level flexibility is advantageous.

NB3L553DR2G (onsemi): This onsemi variant is electrically identical to the NB3L553DG, with the primary distinction being packaging format (Cut Tape with Digi-Reel). The part carries Active product status and ROHS3 compliance. Selection between NB3L553DG and NB3L553DR2G depends solely on packaging and handling requirements for manufacturing processes.

All substitute parts satisfy the electrical and mechanical requirements established by the ICS553MI specification. Selection among active alternatives should be based on supply chain availability, compliance requirements, and packaging preferences.

Frequently Asked Questions (FAQ)

Q: Can the 553MILF directly replace the ICS553MI in existing designs?

A: Yes. The 553MILF maintains identical electrical specifications, supply voltage range, frequency capability, operating temperature range, and 8-SOIC package configuration. The primary difference is product status (Active vs. Obsolete) and improved RoHS compliance.

Q: What is the difference between NB3L553DG and NB3L553DR2G?

A: Both parts are electrically identical onsemi equivalents with identical specifications. The distinction is packaging format: NB3L553DG is supplied in Tube packaging, while NB3L553DR2G is supplied in Cut Tape with Digi-Reel format. Selection depends on manufacturing process requirements and handling preferences.

Q: Are the onsemi parts (NB3L553 series) compatible with the original ICS553MI?

A: Yes. The NB3L553DG and NB3L553DR2G maintain the same 1:4 fanout ratio, 200 MHz maximum frequency, supply voltage range, operating temperature range, and 8-SOIC package. The onsemi variants support expanded logic levels (LVCMOS and LVTTL) in addition to standard CMOS, providing enhanced flexibility.

Q: Does the ICS553MI support LVCMOS or LVTTL logic levels?

A: No. The ICS553MI is specified for standard CMOS input and output only. The onsemi substitutes (NB3L553DG and NB3L553DR2G) support LVCMOS and LVTTL in addition to CMOS, offering broader logic level compatibility.

Q: What is the significance of the RoHS compliance difference?

A: The ICS553MI is RoHS non-compliant, while all substitute parts (553MILF, NB3L553DG, NB3L553DR2G) are ROHS3 compliant. For applications subject to RoHS regulations or customer requirements, the compliant substitutes are necessary.

Q: Are all parts available in the same 8-SOIC package?

A: Yes. All parts—ICS553MI, 553MILF, NB3L553DG, and NB3L553DR2G—use the 8-SOIC (0.154", 3.90mm Width) surface mount package, ensuring PCB layout compatibility.

Q: Which substitute should I select for a new design?

A: For new designs, the 553MILF is the recommended choice as the direct Renesas successor with Active product status and ROHS3 compliance. If onsemi supply chain preference is established, either NB3L553DG or NB3L553DR2G provides equivalent functionality with packaging format as the differentiator.