ICS502MI Clock Generator IC Equivalent & Substitute Parts

Part Overview

The ICS502MI is a Clock Generator IC manufactured by Renesas Electronics Corporation, designed for 140MHz clock generation in 8-SOIC surface mount packaging. This part is classified as obsolete, making substitute components necessary for new designs and production continuity. The ICS502MI generates CMOS output from clock or crystal input sources with integrated PLL functionality and 2:2 input-to-output ratio configuration.

Substiute Parts

ICS502MI
Renesas Electronics CorporationIn Stock: 1054ICS502MI Datasheet
ICS502MI
Current Part
NB3N502DG
onsemiIn Stock: 1547NB3N502DG Datasheet
NB3N502DG
Direct
NB3N502DR2G
onsemiIn Stock: 3083NB3N502DR2G Datasheet
NB3N502DR2G
Direct

Key Parameters

Parameter Value
Manufacturer Renesas Electronics Corporation
Part Number ICS502MI
Product Category Clock/Timing - Clock Generator
Product Status Obsolete
Package Type 8-SOIC (0.154", 3.90mm Width)
Mounting Type Surface Mount
Frequency - Maximum 140MHz
Voltage Supply Range 3V ~ 5.5V
Operating Temperature Range -40°C ~ 85°C
PLL Function Yes
Input Type Clock, Crystal
Output Type CMOS
Number of Circuits 1
Input:Output Ratio 2:2
Moisture Sensitivity Level (MSL) 1 (Unlimited)
RoHS Status RoHS non-compliant

Substitute Part Grouping Explanation

Substitute parts for the ICS502MI are qualified based on the following critical parameters that determine functional and mechanical compatibility:

Electrical Compatibility Criteria:

  • Package/Case: 8-SOIC (0.154", 3.90mm Width) - identical physical footprint required
  • Voltage Supply Range: 3V ~ 5.5V - must support the same supply voltage window
  • Operating Temperature Range: -40°C ~ 85°C - must cover the same temperature specification
  • Mounting Type: Surface Mount - same assembly method
  • PLL Function: Yes - must include integrated PLL capability
  • Input Type: Clock, Crystal - must accept both input sources
  • Number of Circuits: 1 - single circuit configuration

Functional Parameters:

  • Maximum Frequency: 140MHz minimum capability required
  • Output Type: CMOS compatible output required

The substitute parts NB3N502DG and NB3N502DR2G, both manufactured by onsemi, meet all electrical and mechanical compatibility requirements. These parts are functionally equivalent with enhanced specifications (190MHz maximum frequency, expanded output options including TTL, and active product status with RoHS3 compliance).

Parameter Comparison

Parameter ICS502MI (Renesas) NB3N502DG (onsemi) NB3N502DR2G (onsemi)
Manufacturer Renesas Electronics onsemi onsemi
Product Status Obsolete Active Active
Package / Case 8-SOIC (0.154", 3.90mm Width) 8-SOIC (0.154", 3.90mm Width) 8-SOIC (0.154", 3.90mm Width)
Packaging Format - Tube Tape & Reel (TR)
Mounting Type Surface Mount Surface Mount Surface Mount
Frequency - Max 140MHz 190MHz 190MHz
Voltage - Supply 3V ~ 5.5V 3V ~ 5.5V 3V ~ 5.5V
Operating Temperature -40°C ~ 85°C -40°C ~ 85°C -40°C ~ 85°C
PLL Yes Yes with Bypass Yes with Bypass
Input Clock, Crystal Clock, Crystal Clock, Crystal
Output CMOS CMOS, TTL CMOS, TTL
Number of Circuits 1 1 1
Input:Output Ratio 2:2 1:2 1:2
Divider/Multiplier No/Yes Yes/Yes Yes/Yes
Moisture Sensitivity Level (MSL) 1 (Unlimited) 1 (Unlimited) 1 (Unlimited)
RoHS Status RoHS non-compliant ROHS3 Compliant ROHS3 Compliant

Engineering Selection Recommendations

For New Designs and Production Continuity:

The NB3N502DG and NB3N502DR2G are direct functional substitutes for the obsolete ICS502MI. Both onsemi parts are in active production status, ensuring long-term availability and supply chain stability.

Compliance Considerations:

The onsemi substitutes offer improved regulatory compliance with ROHS3 certification, compared to the RoHS non-compliant ICS502MI. Both substitute parts maintain identical electrical operating parameters (3V ~ 5.5V supply, -40°C ~ 85°C temperature range) and package footprint (8-SOIC).

Packaging Selection:

  • NB3N502DG: Tube packaging for lower-volume applications and manual assembly
  • NB3N502DR2G: Tape & Reel packaging for high-volume automated assembly

Both packaging formats are compatible with standard surface mount assembly processes.

Frequently Asked Questions (FAQ)

Q: Can NB3N502DG and NB3N502DR2G be used interchangeably with ICS502MI?

A: Yes. Both onsemi parts are functionally equivalent substitutes. The primary difference is packaging format (Tube vs. Tape & Reel). The electrical specifications, pin configuration, and 8-SOIC footprint are identical, enabling direct board-level substitution.

Q: What is the difference between NB3N502DG and NB3N502DR2G?

A: These parts are electrically identical. NB3N502DG is supplied in Tube packaging, while NB3N502DR2G is supplied in Tape & Reel format. Selection depends on assembly volume and handling requirements. Tape & Reel is standard for high-volume automated pick-and-place assembly.

Q: Are the substitute parts compatible with existing PCB designs for ICS502MI?

A: Yes. Both NB3N502DG and NB3N502DR2G use the same 8-SOIC (0.154", 3.90mm Width) package footprint as the ICS502MI, enabling direct PCB compatibility without layout modifications.

Q: What are the key electrical differences between ICS502MI and the onsemi substitutes?

A: The onsemi substitutes offer higher maximum frequency (190MHz vs. 140MHz), expanded output options (CMOS and TTL vs. CMOS only), and enhanced divider/multiplier functionality. Supply voltage range and operating temperature specifications remain identical.

Q: Is RoHS compliance a factor in selecting between these parts?

A: The ICS502MI is RoHS non-compliant, while both NB3N502DG and NB3N502DR2G are ROHS3 compliant. For applications requiring RoHS compliance, the onsemi substitutes are the appropriate selection.

Q: What is the MSL rating for these clock generator ICs?

A: All three parts (ICS502MI, NB3N502DG, and NB3N502DR2G) have MSL 1 (Unlimited) rating, indicating no moisture sensitivity restrictions for storage and handling.

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