ICO-640-LGT Equivalent & Substitute Parts

Part Overview

The ICO-640-LGT is a 40-position DIP socket manufactured by Samtec Inc., designed for through-hole mounting applications. This socket features a 0.6" (15.24mm) row spacing with gold-plated mating contacts and tin-plated posts. The component is classified as Active product status and is RoHS3 compliant. Substitute parts are identified when equivalent electrical and mechanical parameters are required for component procurement, inventory management, or design flexibility across manufacturing sources.

Substiute Parts

ICO-640-LGT

Samtec Inc.In Stock: 815ICO-640-LGT Datasheet

Current PartRFQ

115-93-640-41-001000

Mill-Max Manufacturing Corp.In Stock: 1031115-93-640-41-001000 Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

The ICO-640-LGT has one identified substitute: 115-93-640-41-001000 (Mill-Max Manufacturing Corp.). This substitution is valid based on the following critical parameters that determine functional equivalence:

Matching Parameters:

• Number of Positions: 40 (2 x 20)
• Type: DIP, 0.6" (15.24mm) Row Spacing
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Termination: Solder
• Operating Temperature Range: -55°C ~ 125°C
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin-based
• Contact Material - Post: Brass-based

These parameters establish mechanical and electrical compatibility for direct substitution in DIP socket applications.

Parameter Comparison

Engineering Selection Recommendations

ICO-640-LGT Selection Criteria:

• Required for applications mandating RoHS3 compliance
• Specified contact resistance of 10mOhm is a design requirement
• UL94 V-0 flammability rating is required
• Current rating of 1 A is sufficient for the application

115-93-640-41-001000 Selection Criteria:

• Applications where RoHS compliance is not required
• Higher current rating of 3 A accommodates higher-load applications
• Tin-Lead post finish acceptable for non-RoHS environments
• Active product status ensures continued availability

Both parts maintain identical mechanical compatibility and core electrical parameters for DIP socket functionality. Selection between these parts depends on regulatory compliance requirements and current-handling specifications.

Frequently Asked Questions (FAQ)

Q: Can the 115-93-640-41-001000 be used as a direct replacement for the ICO-640-LGT in a new design?

A: Direct replacement is mechanically and electrically feasible based on matching pitch, position count, and contact materials. However, the ICO-640-LGT is RoHS3 compliant while the 115-93-640-41-001000 is RoHS non-compliant. Design compliance requirements must be evaluated before substitution.

Q: What is the significance of the different post contact finishes (Tin vs. Tin-Lead)?

A: The ICO-640-LGT uses pure Tin post finish (10.0µin thickness), while the 115-93-640-41-001000 uses Tin-Lead finish (200.0µin thickness). Both are solder-compatible terminations. The Tin-Lead finish provides thicker plating but is associated with RoHS non-compliance. Selection depends on soldering process requirements and regulatory constraints.

Q: Are the housing materials functionally equivalent?

A: Both housing materials are polyester-based with glass or PCT reinforcement. The ICO-640-LGT uses Polyester with glass filling, while the 115-93-640-41-001000 uses PCT polyester. Both materials support the -55°C to 125°C operating temperature range and provide mechanical stability for through-hole mounting.

Q: Why does the 115-93-640-41-001000 have a higher current rating (3 A vs. 1 A)?

A: Current rating differences reflect design specifications from each manufacturer. The higher rating on the Mill-Max part indicates greater current-carrying capacity. Applications requiring currents above 1 A should specify the 115-93-640-41-001000.

Q: Are both parts suitable for automated assembly?

A: Both parts feature identical 0.100" (2.54mm) pitch and through-hole termination, supporting standard automated PCB assembly processes. Packaging in tubes facilitates component handling in pick-and-place equipment.