ICO-324-SST DIP Socket Equivalent & Substitute Parts

Part Overview

The ICO-324-SST is a 24-position DIP socket manufactured by Samtec Inc., designed for through-hole mounting applications requiring gold-plated mating contacts. This component is classified as an active product with full RoHS3 compliance and unlimited moisture sensitivity rating. DIP sockets of this specification are essential in applications requiring reliable IC interconnection with standardized 0.3" row spacing and 0.100" pitch configuration. Substitute parts are identified when equivalent electrical and mechanical parameters are maintained across critical specifications.

Substiute Parts

ICO-324-SST
Samtec Inc.In Stock: 834ICO-324-SST Datasheet
ICO-324-SST
Current Part
110-91-324-41-001000
Mill-Max Manufacturing Corp.In Stock: 905110-91-324-41-001000 Datasheet
110-91-324-41-001000
Similar

Key Parameters

Parameter Value
Number of Positions 24 (2 x 12)
Type DIP, 0.3" (7.62mm) Row Spacing
Pitch - Mating 0.100" (2.54mm)
Pitch - Post 0.100" (2.54mm)
Contact Finish - Mating Gold
Contact Material - Mating Beryllium Copper
Mounting Type Through Hole
Termination Solder
Operating Temperature Range -55°C ~ 125°C
Termination Post Length 0.125" (3.18mm)
Current Rating 1 A

Substitute Part Grouping Explanation

Substitution eligibility for the ICO-324-SST is determined by strict equivalence across the following critical parameters:

  • Position count and grid configuration (24 positions, 2 x 12 arrangement)
  • DIP socket type with 0.3" row spacing
  • Mating pitch of 0.100" (2.54mm)
  • Post pitch of 0.100" (2.54mm)
  • Gold-plated mating contacts with beryllium copper material
  • Through-hole solder termination
  • Operating temperature range of -55°C ~ 125°C
  • Termination post length of 0.125" (3.18mm)

The substitute part 110-91-324-41-001000 (Mill-Max Manufacturing Corp.) meets all these critical parameters, establishing functional and mechanical compatibility for direct substitution in applications where the ICO-324-SST is specified.

Parameter Comparison

Parameter ICO-324-SST (Samtec) 110-91-324-41-001000 (Mill-Max)
Manufacturer Samtec Inc. Mill-Max Manufacturing Corp.
Number of Positions 24 (2 x 12) 24 (2 x 12)
Type DIP, 0.3" (7.62mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing
Pitch - Mating 0.100" (2.54mm) 0.100" (2.54mm)
Pitch - Post 0.100" (2.54mm) 0.100" (2.54mm)
Contact Finish - Mating Gold Gold
Contact Finish Thickness - Mating 10.0µin (0.25µm) 10.0µin (0.25µm)
Contact Material - Mating Beryllium Copper Beryllium Copper
Contact Finish - Post Tin Tin-Lead
Contact Material - Post Brass Brass Alloy
Mounting Type Through Hole Through Hole
Features Open Frame Open Frame
Termination Solder Solder
Operating Temperature -55°C ~ 125°C -55°C ~ 125°C
Termination Post Length 0.125" (3.18mm) 0.125" (3.18mm)
Current Rating (Amps) 1 A 3 A
Product Status Active Active
RoHS Status ROHS3 Compliant RoHS non-compliant
Moisture Sensitivity Level 1 (Unlimited) 1 (Unlimited)
ECCN EAR99 EAR99
HTSUS 8536.69.4040 8536.69.4040

Engineering Selection Recommendations

Both the ICO-324-SST and 110-91-324-41-001000 are active products with identical mechanical and electrical compatibility across all critical mating and termination parameters. The primary differentiators are:

RoHS Compliance: The ICO-324-SST carries ROHS3 compliance certification, while the 110-91-324-41-001000 is RoHS non-compliant. Applications subject to RoHS regulatory requirements must specify the ICO-324-SST.

Current Rating: The 110-91-324-41-001000 provides a 3 A current rating compared to the ICO-324-SST's 1 A rating. Applications requiring higher current capacity may benefit from the Mill-Max part, provided RoHS compliance is not mandated.

Post Finish: The ICO-324-SST uses tin plating on posts, while the 110-91-324-41-001000 uses tin-lead plating. This distinction affects solderability characteristics and environmental compliance considerations.

Both parts maintain identical operating temperature ranges, moisture sensitivity levels, and export classifications (EAR99).

Frequently Asked Questions (FAQ)

Q: Can the 110-91-324-41-001000 be used as a direct replacement for the ICO-324-SST in all applications?

A: The 110-91-324-41-001000 is mechanically and electrically compatible with the ICO-324-SST across all critical parameters. However, RoHS compliance requirements must be evaluated. If RoHS3 compliance is mandatory, the ICO-324-SST is the required choice. If RoHS compliance is not required and higher current capacity is beneficial, the 110-91-324-41-001000 is suitable.

Q: What are the key compatibility criteria for DIP socket substitution?

A: Substitution requires equivalence in position count, row spacing (0.3"), mating pitch (0.100"), post pitch (0.100"), contact finish (gold), contact material (beryllium copper), mounting type (through-hole), termination method (solder), operating temperature range (-55°C ~ 125°C), and post length (0.125").

Q: Does the difference in current rating affect socket selection?

A: The current rating reflects the maximum continuous current the socket contacts can safely carry. The ICO-324-SST is rated for 1 A, while the 110-91-324-41-001000 is rated for 3 A. Selection depends on the actual current requirements of the application. Both sockets are mechanically identical and will physically fit the same PCB layout.

Q: Are there differences in contact resistance between these parts?

A: The ICO-324-SST specifies a contact resistance of 10mOhm. The 110-91-324-41-001000 does not provide a contact resistance specification in the available data. Both parts use identical mating contact materials (beryllium copper) and gold plating thickness (10.0µin), which typically result in comparable contact resistance performance.

Q: What is the significance of the post finish difference (tin vs. tin-lead)?

A: The ICO-324-SST uses tin plating on the solder posts, while the 110-91-324-41-001000 uses tin-lead plating. Tin-lead plating is a traditional finish that may be preferred in certain manufacturing environments. Tin plating aligns with lead-free soldering practices. The choice depends on the PCB assembly process and solder specifications in use.

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