ICF-308-T-O-TR Equivalent & Substitute Parts

Part Overview

The ICF-308-T-O-TR is an 8-position DIP socket manufactured by Samtec Inc., designed for surface mount applications with 0.3" (7.62mm) row spacing. This connector features tin-plated beryllium copper contacts and is housed in liquid crystal polymer (LCP) material. The part is currently active in production and maintains full RoHS3 compliance with unlimited moisture sensitivity rating (MSL 1).

Equivalent and substitute parts are identified to provide design flexibility, support supply chain continuity, and accommodate specific application requirements such as packaging format preferences or alternative housing materials.

Substiute Parts

ICF-308-T-O-TR

Samtec Inc.In Stock: 1251ICF-308-T-O-TR Datasheet

Current PartRFQ

214-44-308-01-670800

Mill-Max Manufacturing Corp.In Stock: 70965214-44-308-01-670800 Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the ICF-308-T-O-TR is determined by strict alignment with the following core parameters:

• 8-position configuration (2 x 4 grid)
• 0.3" (7.62mm) row spacing
• 0.100" (2.54mm) mating and post pitch
• Tin contact finish on mating surfaces
• Surface mount termination via solder
• Operating temperature range of -55°C to 125°C
• RoHS3 compliance and MSL 1 rating

The substitute part 214-44-308-01-670800 (Mill-Max Manufacturing Corp.) meets all critical electrical and mechanical parameters. Variations in housing material (PCT/Polyester vs. LCP), frame design (closed vs. open), and packaging format (tube vs. tape & reel) do not affect functional compatibility when these core parameters are maintained.

Parameter Comparison

Engineering Selection Recommendations

Both the ICF-308-T-O-TR and 214-44-308-01-670800 are active production parts with identical RoHS3 compliance and MSL 1 ratings. Selection between these parts is based on application-specific requirements:

The ICF-308-T-O-TR is supplied in tape & reel packaging and features an open frame design with LCP housing material. The 214-44-308-01-670800 is supplied in tube packaging and features a closed frame design with PCT/Polyester housing material. Both configurations support the same electrical performance and thermal operating range.

Packaging format selection depends on assembly process requirements. Tape & reel format supports automated pick-and-place operations, while tube packaging accommodates manual or alternative assembly methods. Housing material and frame design differences do not affect electrical compatibility or performance in standard DIP socket applications.

Frequently Asked Questions (FAQ)

Q: Are the ICF-308-T-O-TR and 214-44-308-01-670800 electrically interchangeable?

A: Yes. Both parts maintain identical mating pitch (0.100"), post pitch (0.100"), contact finish (tin), contact material (beryllium copper), and operating temperature range (-55°C to 125°C). Electrical performance is equivalent.

Q: What is the difference between open frame and closed frame designs?

A: Open frame design (ICF-308-T-O-TR) provides reduced material mass and cost. Closed frame design (214-44-308-01-670800) provides additional structural support and contact retention. Both designs support standard DIP component insertion and retention.

Q: Does housing material affect compatibility?

A: Housing material differences (LCP vs. PCT/Polyester) do not affect electrical compatibility or mechanical fit. Material selection impacts thermal properties, cost, and manufacturing process compatibility. Both materials are RoHS3 compliant.

Q: What packaging format should I select?

A: Tape & reel packaging (ICF-308-T-O-TR) is optimized for automated assembly lines. Tube packaging (214-44-308-01-670800) is suitable for manual assembly or lower-volume production. Select based on your assembly process requirements.

Q: Are both parts compliant with current regulations?

A: Yes. Both parts are RoHS3 compliant, REACH unaffected, and carry MSL 1 (unlimited) moisture sensitivity ratings. Both support standard lead-free solder assembly processes.