ICF-308-T-I Equivalent & Substitute Parts

Part Overview

The ICF-308-T-I is an 8-position DIP socket manufactured by Samtec Inc., designed for surface mount applications with 0.3" (7.62mm) row spacing. This component features tin-plated beryllium copper contacts and is housed in liquid crystal polymer (LCP) material. The part maintains active product status and is ROHS3 compliant with unlimited moisture sensitivity level rating. Equivalent and substitute parts are identified to provide alternative sourcing options when the primary part is unavailable or when application requirements necessitate different mounting or contact finish specifications.

Key Parameters

Parameter	Value
Manufacturer Part Number	ICF-308-T-I
Manufacturer	Samtec Inc.
Category	Sockets for ICs, Transistors
Number of Positions	8 (2 x 4)
Row Spacing	0.3" (7.62mm)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Tin
Contact Material - Mating	Beryllium Copper
Mounting Type	Surface Mount
Housing Material	Liquid Crystal Polymer (LCP)
Operating Temperature Range	-55°C ~ 125°C
Product Status	Active
RoHS Status	ROHS3 Compliant
Moisture Sensitivity Level	1 (Unlimited)

Substitute Part Grouping Explanation

Substitution of the ICF-308-T-I is determined by the following critical parameters:

Position Count & Row Spacing: Both main and substitute parts must maintain 8 positions in a 2 x 4 configuration with 0.3" (7.62mm) row spacing to ensure mechanical compatibility with target PCB layouts.
Pitch - Mating: The 0.100" (2.54mm) mating pitch is a fundamental requirement for component insertion and electrical connection.
Contact Material - Mating: Beryllium copper mating contacts are specified for both parts, ensuring consistent electrical performance and contact reliability.
Termination Type: Both parts utilize solder termination, maintaining assembly process compatibility.
RoHS Compliance: Both parts are ROHS3 compliant, meeting regulatory requirements for hazardous substance restrictions.

The substitute part 08-3518-10 (Aries Electronics) differs in mounting type (through hole versus surface mount) and contact finish specifications. This substitution is valid when application requirements permit through-hole mounting and when the gold-plated mating contact finish is acceptable or preferred for enhanced corrosion resistance.

Parameter Comparison

Parameter	ICF-308-T-I (Samtec)	08-3518-10 (Aries Electronics)
Number of Positions	8 (2 x 4)	8 (2 x 4)
Row Spacing	0.3" (7.62mm)	0.3" (7.62mm)
Pitch - Mating	0.100" (2.54mm)	0.100" (2.54mm)
Contact Finish - Mating	Tin	Gold (10.0µin / 0.25µm)
Contact Material - Mating	Beryllium Copper	Beryllium Copper
Mounting Type	Surface Mount	Through Hole
Features	Open Frame	Open Frame
Termination	Solder	Solder
Pitch - Post	0.100" (2.54mm)	0.100" (2.54mm)
RoHS Status	ROHS3 Compliant	ROHS3 Compliant
Moisture Sensitivity Level	1 (Unlimited)	1 (Unlimited)

Engineering Selection Recommendations

Selection between the ICF-308-T-I and 08-3518-10 is determined by PCB design requirements and application constraints:

ICF-308-T-I (Samtec Inc.) is the specified choice for surface mount applications where PCB real estate is optimized for SMT assembly processes. This part is recommended when the design explicitly requires surface mount termination and tin-plated contact finish.

08-3518-10 (Aries Electronics) serves as a substitute when through-hole mounting is acceptable or required by the application design. The gold-plated mating contact finish (10.0µin / 0.25µm) provides enhanced corrosion resistance compared to tin plating. This part is suitable for applications where through-hole assembly methods are employed or when superior contact durability in corrosive environments is necessary.

Both parts maintain active product status, ROHS3 compliance, and unlimited moisture sensitivity level rating, ensuring regulatory and environmental requirement alignment.

Frequently Asked Questions (FAQ)

Q: Can the 08-3518-10 be used as a direct replacement for the ICF-308-T-I on a surface mount PCB?

A: No. The 08-3518-10 is a through-hole component, while the ICF-308-T-I is surface mount. Direct substitution requires PCB redesign to accommodate through-hole termination posts and via placement.

Q: What is the significance of the contact finish difference between tin and gold plating?

A: Tin plating (ICF-308-T-I) provides standard corrosion protection suitable for general applications. Gold plating (08-3518-10) offers enhanced corrosion resistance and lower contact resistance, beneficial in high-reliability or corrosive environment applications.

Q: Are both parts compatible with the same IC packages?

A: Yes. Both parts accommodate 8-position DIP packages with 0.3" (7.62mm) row spacing and 0.100" (2.54mm) pitch. Compatibility is determined by PCB mounting type (surface mount versus through-hole), not by IC package compatibility.

Q: Do both parts meet the same regulatory compliance standards?

A: Yes. Both the ICF-308-T-I and 08-3518-10 are ROHS3 compliant with unlimited moisture sensitivity level (MSL 1), meeting equivalent regulatory requirements for hazardous substance restrictions and moisture handling.

Q: What is the operating temperature range for both parts?

A: The ICF-308-T-I specifies -55°C ~ 125°C. Operating temperature data for the 08-3518-10 is not provided in the available specifications.

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